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Class Information
Number: 257/776
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Cross-over arrangement, component or structure
Description: Subject matter wherein means are provided for electrically insulating electrical contact elements or leads which cross each other to do so without a short circuit therebetween.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7602058 |
Flip-chip semiconductor device with improved power pad arrangement |
Oct. 13, 2009 |
| 7602069 |
Micro electronic component with electrically accessible metallic clusters |
Oct. 13, 2009 |
| 7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 6, 2009 |
| 7595549 |
Surface mount semiconductor device |
Sep. 29, 2009 |
| 7586186 |
Ball grid array |
Sep. 8, 2009 |
| 7586187 |
Interconnect structure with stress buffering ability and the manufacturing method thereof |
Sep. 8, 2009 |
| 7586188 |
Chip package and coreless package substrate thereof |
Sep. 8, 2009 |
| 7566976 |
Semiconductor device and method for fabricating the same |
Jul. 28, 2009 |
| 7564130 |
Power micro surface-mount device package |
Jul. 21, 2009 |
| 7559139 |
Method for manufacturing a probe unit |
Jul. 14, 2009 |
| 7560814 |
Semiconductor device that improves electrical connection reliability |
Jul. 14, 2009 |
| 7560819 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
Jul. 14, 2009 |
| 7557451 |
Electro-optical device and electronic apparatus |
Jul. 7, 2009 |
| 7557449 |
Flexible via design to improve reliability |
Jul. 7, 2009 |
| 7554202 |
Semiconductor integrated circuit device |
Jun. 30, 2009 |
| 7553703 |
Methods of forming an interconnect structure |
Jun. 30, 2009 |
| 7554197 |
High frequency IC package and method for fabricating the same |
Jun. 30, 2009 |
| 7550855 |
Vertically spaced plural microsprings |
Jun. 23, 2009 |
| 7550854 |
Integrated interconnect arrangement |
Jun. 23, 2009 |
| 7550842 |
Integrated circuit assembly |
Jun. 23, 2009 |
| 7550833 |
Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof |
Jun. 23, 2009 |
| 7547935 |
Semiconductor devices including buried digit lines that are laterally offset from corresponding active-device regions |
Jun. 16, 2009 |
| 7547965 |
Package and package module of the package |
Jun. 16, 2009 |
| 7540970 |
Methods of fabricating a semiconductor device |
Jun. 2, 2009 |
| 7541670 |
Semiconductor device having terminals |
Jun. 2, 2009 |
| 7541678 |
Printed wiring board, information processing apparatus, and method of manufacturing the printed wiring board |
Jun. 2, 2009 |
| 7538417 |
Semiconductor device with signal line having decreased characteristic impedance |
May. 26, 2009 |
| 7538442 |
Semiconductor chip and semiconductor device |
May. 26, 2009 |
| 7535108 |
Electronic component including reinforcing member |
May. 19, 2009 |
| 7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure |
May. 19, 2009 |
| 7521797 |
Method of manufacturing substrate joint body, substrate joint body and electrooptical device |
Apr. 21, 2009 |
| 7514795 |
Semiconductor integrated circuit having improved power supply wiring |
Apr. 7, 2009 |
| 7508079 |
Circuit substrate and method of manufacturing the same |
Mar. 24, 2009 |
| 7509615 |
Circuit layout structure and method |
Mar. 24, 2009 |
| 7501701 |
Rewiring substrate strip having a plurality of semiconductor component positions |
Mar. 10, 2009 |
| 7498674 |
Semiconductor module having a coupling substrate, and methods for its production |
Mar. 3, 2009 |
| 7495343 |
Pad over active circuit system and method with frame support structure |
Feb. 24, 2009 |
| 7495335 |
Method of reducing process steps in metal line protective structure formation |
Feb. 24, 2009 |
| 7495327 |
Chip stacking structure |
Feb. 24, 2009 |
| 7495326 |
Stacked electronic structures including offset substrates |
Feb. 24, 2009 |
| 7495340 |
Metal layer structure of semiconductor device |
Feb. 24, 2009 |
| 7492013 |
Systems and arrangements to interconnect components of a semiconductor device |
Feb. 17, 2009 |
| 7479697 |
Resilient carrier assembly for an integrated circuit |
Jan. 20, 2009 |
| 7476965 |
Electronic device with integrated heat distributor |
Jan. 13, 2009 |
| 7474003 |
Semiconductor integrated circuit device |
Jan. 6, 2009 |
| 7474002 |
Semiconductor device having dielectric film having aperture portion |
Jan. 6, 2009 |
| 7474000 |
High density contact to relaxed geometry layers |
Jan. 6, 2009 |
| 7462887 |
Semiconductor connection component |
Dec. 9, 2008 |
| 7453151 |
Methods for lateral current carrying capability improvement in semiconductor devices |
Nov. 18, 2008 |
| 7453158 |
Pad over active circuit system and method with meshed support structure |
Nov. 18, 2008 |
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