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Class Information
Number: 257/776
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Cross-over arrangement, component or structure
Description: Subject matter wherein means are provided for electrically insulating electrical contact elements or leads which cross each other to do so without a short circuit therebetween.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8710667 Semiconductor device Apr. 29, 2014
8710674 Internal wiring structure of semiconductor device Apr. 29, 2014
8710648 Wafer level packaging structure with large contact area and preparation method thereof Apr. 29, 2014
8704363 Interface plate between integrated circuits Apr. 22, 2014
8692280 Optoelectronic semiconductor device Apr. 8, 2014
8692351 Dummy shoulder structure for line stress reduction Apr. 8, 2014
8692379 Integrated circuit connector access region Apr. 8, 2014
8686567 Semiconductor device having plural wiring layers Apr. 1, 2014
8680686 Method and system for thin multi chip stack package with film on wire and copper wire Mar. 25, 2014
8673772 Biosensor chip and a method of manufacturing the same Mar. 18, 2014
8664769 Semiconductor device Mar. 4, 2014
8653648 Zigzag pattern for TSV copper adhesion Feb. 18, 2014
8648449 Electrical connectivity for circuit applications Feb. 11, 2014
8648467 Semiconductor memory device and method of manufacturing the same Feb. 11, 2014
8648471 Nonvolatile semiconductor memory device including a via-hole with a narrowing cross-section and method of manufacturing the same Feb. 11, 2014
8643189 Packaged semiconductor die with power rail pads Feb. 4, 2014
8637976 Semiconductor device with lead terminals having portions thereof extending obliquely Jan. 28, 2014
8633595 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8633594 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8603906 Method of forming a three-dimensional semiconductor memory device comprising sub-cells, terraced structures and strapping regions Dec. 10, 2013
8598708 Carbon nanotube-based interconnection element Dec. 3, 2013
8592974 Package configurations for low EMI circuits Nov. 26, 2013
8592978 Method of fabricating semiconductor device and the semiconductor device Nov. 26, 2013
8592979 Semiconductor device conductive pattern structures and methods of manufacturing the same Nov. 26, 2013
8587123 Multi-chip and multi-substrate reconstitution based packaging Nov. 19, 2013
8587129 Integrated circuit packaging system with through silicon via base and method of manufacture thereof Nov. 19, 2013
8581415 Semiconductor device and a method of manufacturing the same Nov. 12, 2013
8575585 Memristive device Nov. 5, 2013
8569820 Capacitor having a plurality of parallel conductive members Oct. 29, 2013
8564127 Semiconductor device Oct. 22, 2013
8558348 Variable resistance memory device and methods of forming the same Oct. 15, 2013
8558385 Interconnection architecture for semiconductor device Oct. 15, 2013
8558391 Semiconductor device and a method of manufacturing the same Oct. 15, 2013
8552563 Three-dimensional semiconductor architecture Oct. 8, 2013
8541893 Semiconductor memory device and power line arrangement method thereof Sep. 24, 2013
8519545 Electronic device comprising a chip disposed on a pin Aug. 27, 2013
8513777 Method and apparatus for generating reticle data Aug. 20, 2013
8513708 Integrated circuit for various packaging modes Aug. 20, 2013
8513707 RF CMOS transistor design Aug. 20, 2013
8502396 Embedded package security tamper mesh Aug. 6, 2013
8503212 Semiconductor memory apparatus with power-meshed structure Aug. 6, 2013
8492904 Semiconductor device and manufacturing method of the same Jul. 23, 2013
8482131 Via structure Jul. 9, 2013
8476763 Semiconductor device conductive pattern structures including dummy conductive patterns Jul. 2, 2013
8476751 Stacked semiconductor package and method for manufacturing the same Jul. 2, 2013
8471391 Methods for multi-wire routing and apparatus implementing same Jun. 25, 2013
8471390 Power MOSFET contact metallization Jun. 25, 2013
8471297 Semiconductor memory device and method of manufacturing the same Jun. 25, 2013
8455931 Package configurations for low EMI circuits Jun. 4, 2013
8455853 Memory devices and formation methods Jun. 4, 2013

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