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Class Information
Number: 257/776
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Cross-over arrangement, component or structure
Description: Subject matter wherein means are provided for electrically insulating electrical contact elements or leads which cross each other to do so without a short circuit therebetween.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7453151 |
Methods for lateral current carrying capability improvement in semiconductor devices |
Nov. 18, 2008 |
| 7453158 |
Pad over active circuit system and method with meshed support structure |
Nov. 18, 2008 |
| 7446047 |
Metal structure with sidewall passivation and method |
Nov. 4, 2008 |
| 7439623 |
Semiconductor device having via connecting between interconnects |
Oct. 21, 2008 |
| 7439625 |
Circuit board |
Oct. 21, 2008 |
| 7432594 |
Semiconductor chip, electrically connections therefor |
Oct. 7, 2008 |
| 7429797 |
Electronic device and carrier substrate |
Sep. 30, 2008 |
| 7429798 |
Integrated circuit package-in-package system |
Sep. 30, 2008 |
| 7423300 |
Single-mask phase change memory element |
Sep. 9, 2008 |
| 7414301 |
Printed circuit board with soldering lands |
Aug. 19, 2008 |
| 7414319 |
Semiconductor chip assembly with metal containment wall and solder terminal |
Aug. 19, 2008 |
| 7411294 |
Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer |
Aug. 12, 2008 |
| 7411305 |
Interconnect structure encased with high and low k interlevel dielectrics |
Aug. 12, 2008 |
| 7408260 |
Microelectronic assemblies having compliant layers |
Aug. 5, 2008 |
| 7405956 |
Line layout structure of semiconductor memory devices |
Jul. 29, 2008 |
| 7405485 |
Semiconductor device |
Jul. 29, 2008 |
| 7405484 |
Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
Jul. 29, 2008 |
| 7405474 |
Low cost thermally enhanced semiconductor package |
Jul. 29, 2008 |
| 7405473 |
Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing |
Jul. 29, 2008 |
| 7405419 |
Unidirectionally conductive materials for interconnection |
Jul. 29, 2008 |
| 7394155 |
Top and sidewall bridged interconnect structure and method |
Jul. 1, 2008 |
| 7391114 |
Electrode pad section for external connection |
Jun. 24, 2008 |
| 7391120 |
Increasing the adhesion of an adhesive connection in housings |
Jun. 24, 2008 |
| 7385295 |
Fabrication of nano-gap electrode arrays by the construction and selective chemical etching of nano-crosswire stacks |
Jun. 10, 2008 |
| 7375432 |
Via attached to a bond pad utilizing a tapered interconnect |
May. 20, 2008 |
| 7375426 |
Semiconductor package |
May. 20, 2008 |
| 7368803 |
System and method for protecting microelectromechanical systems array using back-plate with non-flat portion |
May. 6, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7368819 |
Multilayer printed wiring board and multilayer printed circuit board |
May. 6, 2008 |
| 7368821 |
BGA semiconductor chip package and mounting structure thereof |
May. 6, 2008 |
| 7365413 |
Reduced power distribution mesh resistance using a modified swiss-cheese slotting pattern |
Apr. 29, 2008 |
| 7365431 |
Semiconductor device having multilayer structure and method for manufacturing thereof |
Apr. 29, 2008 |
| 7361987 |
Circuit device with at least partial packaging and method for forming |
Apr. 22, 2008 |
| 7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
Apr. 22, 2008 |
| 7358549 |
Multi-layered metal routing technique |
Apr. 15, 2008 |
| 7358614 |
Antisymmetric nanowire crossbars |
Apr. 15, 2008 |
| 7358615 |
Microelectronic package having multiple conductive paths through an opening in a support substrate |
Apr. 15, 2008 |
| 7354800 |
Method of fabricating a stacked integrated circuit package system |
Apr. 8, 2008 |
| 7355265 |
Semiconductor integrated circuit |
Apr. 8, 2008 |
| 7352059 |
Low loss interconnect structure for use in microelectronic circuits |
Apr. 1, 2008 |
| 7348674 |
Low capacitance wiring layout |
Mar. 25, 2008 |
| 7348678 |
Integrated circuit package to provide high-bandwidth communication among multiple dice |
Mar. 25, 2008 |
| 7348679 |
Electronic part having reinforcing member |
Mar. 25, 2008 |
| 7348680 |
Electronic device and use thereof |
Mar. 25, 2008 |
| 7345368 |
Semiconductor device and the manufacturing method for the same |
Mar. 18, 2008 |
| 7342267 |
MOSFET package |
Mar. 11, 2008 |
| 7339274 |
Metallization performance in electronic devices |
Mar. 4, 2008 |
| 7335965 |
Packaging of electronic chips with air-bridge structures |
Feb. 26, 2008 |
| 7335985 |
Method and system for electrically coupling a chip to chip package |
Feb. 26, 2008 |
| 7335992 |
Semiconductor apparatus with improved yield |
Feb. 26, 2008 |
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