| |
 |
|
Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6614114 |
Conductive line formed on integrated circuits |
Sep. 2, 2003 |
| 6612024 |
Method of mounting a device to a mounting substrate |
Sep. 2, 2003 |
| 6608386 |
Sub-nanoscale electronic devices and processes |
Aug. 19, 2003 |
| 6603206 |
Slot via filled dual damascene interconnect structure without middle etch stop layer |
Aug. 5, 2003 |
| 6600225 |
Semiconductor device with elongated interconnecting member and fabrication method thereof |
Jul. 29, 2003 |
| 6597049 |
Conductor structure for a magnetic memory |
Jul. 22, 2003 |
| 6586828 |
Integrated circuit bus grid having wires with pre-selected variable widths |
Jul. 1, 2003 |
| 6583510 |
Semiconductor device with varying thickness gold electrode |
Jun. 24, 2003 |
| 6580176 |
Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation |
Jun. 17, 2003 |
| 6579738 |
Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials |
Jun. 17, 2003 |
| 6577010 |
Stepped photoresist profile and opening formed using the profile |
Jun. 10, 2003 |
| 6573604 |
Semiconductor device carrying memory and logic circuit on a chip and method of manufacturing the same |
Jun. 3, 2003 |
| 6566759 |
Self-aligned contact areas for sidewall image transfer formed conductors |
May. 20, 2003 |
| 6559545 |
Semiconductor devices and methods for manufacturing semiconductor devices |
May. 6, 2003 |
| 6559541 |
Connection structure for semiconductor electrode terminals |
May. 6, 2003 |
| 6559524 |
COF-use tape carrier and COF-structured semiconductor device using the same |
May. 6, 2003 |
| 6555911 |
Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios |
Apr. 29, 2003 |
| 6552432 |
Mask on a polymer having an opening width less than that of the opening in the polymer |
Apr. 22, 2003 |
| 6545348 |
Package for a semiconductor device comprising a plurality of interconnection patterns around a semiconductor chip |
Apr. 8, 2003 |
| 6541867 |
Microelectronic connector with planar elastomer sockets |
Apr. 1, 2003 |
| 6542377 |
Printed circuit assembly having conductive pad array with in-line via placement |
Apr. 1, 2003 |
| 6541853 |
Electrically conductive path through a dielectric material |
Apr. 1, 2003 |
| 6538330 |
Multilevel semiconductor-on-insulator structures and circuits |
Mar. 25, 2003 |
| 6538332 |
Semiconductor device and method of production of same |
Mar. 25, 2003 |
| 6531664 |
Surface mount devices with solder |
Mar. 11, 2003 |
| 6528888 |
Integrated circuit and method |
Mar. 4, 2003 |
| 6521979 |
Member for semiconductor package and semiconductor package using the same, and fabrication method thereof |
Feb. 18, 2003 |
| 6518676 |
Metal interconnections and active matrix substrate using the same |
Feb. 11, 2003 |
| 6518663 |
Constant impedance routing for high performance integrated circuit packaging |
Feb. 11, 2003 |
| 6515354 |
Micro-BGA beam lead connection with cantilevered beam leads |
Feb. 4, 2003 |
| 6515368 |
Semiconductor device with copper-filled via includes a copper-zinc/alloy film for reduced electromigration of copper |
Feb. 4, 2003 |
| 6512299 |
Semiconductor device and a manufacturing process therefor |
Jan. 28, 2003 |
| 6509632 |
Method of fabricating a redundant pinout configuration for signal enhancement in an IC package |
Jan. 21, 2003 |
| 6509644 |
Grid array package with reduced power and ground impedance under high frequency |
Jan. 21, 2003 |
| 6507081 |
In-situ silicon nitride and silicon based oxide deposition with graded interface for damascene application |
Jan. 14, 2003 |
| 6504217 |
Semiconductor device and a method of manufacturing the same |
Jan. 7, 2003 |
| 6501186 |
Bond pad having variable density via support and method for fabrication |
Dec. 31, 2002 |
| 6501156 |
Lead frame which includes a die pad, a support lead, and inner leads |
Dec. 31, 2002 |
| 6501181 |
Arrangement relating to electronic circuitry |
Dec. 31, 2002 |
| 6498089 |
Semiconductor integrated circuit device with moisture-proof ring and its manufacture method |
Dec. 24, 2002 |
| 6498308 |
Semiconductor module |
Dec. 24, 2002 |
| 6495901 |
Multi-level fuse structure |
Dec. 17, 2002 |
| 6495768 |
Tape carrier package and method of fabricating the same |
Dec. 17, 2002 |
| 6492723 |
Multichip module |
Dec. 10, 2002 |
| 6489684 |
Reduction of electromigration in dual damascene connector |
Dec. 3, 2002 |
| 6486531 |
Contact structure with a lower interconnection having t-shaped portion in cross section and method for forming the same |
Nov. 26, 2002 |
| 6483180 |
Lead frame design for burr-free singulation of molded array packages |
Nov. 19, 2002 |
| 6476506 |
Packaged semiconductor with multiple rows of bond pads and method therefor |
Nov. 5, 2002 |
| 6476498 |
Elimination of flux divergence in integrated circuit interconnects |
Nov. 5, 2002 |
| 6476497 |
Concentric metal density power routing |
Nov. 5, 2002 |
|
|
|
