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Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6768189 |
High power chip scale package |
Jul. 27, 2004 |
| 6765296 |
Via-sea layout integrated circuits |
Jul. 20, 2004 |
| 6759742 |
Interchangeable bond-wire interconnects |
Jul. 6, 2004 |
| 6759599 |
Circuit board, method for manufacturing same, and high-output module |
Jul. 6, 2004 |
| 6750142 |
Semiconductor device and method for manufacturing the same |
Jun. 15, 2004 |
| 6747356 |
Semiconductor device |
Jun. 8, 2004 |
| 6744139 |
Semiconductor device |
Jun. 1, 2004 |
| 6740976 |
Semiconductor device including via contact plug with a discontinuous barrier layer |
May. 25, 2004 |
| 6740947 |
MRAM with asymmetric cladded conductor |
May. 25, 2004 |
| 6740916 |
Contact structure for integrated circuit devices |
May. 25, 2004 |
| 6737745 |
Method for relieving bond stress in an under-bond-pad resistor |
May. 18, 2004 |
| 6737740 |
High performance silicon contact for flip chip |
May. 18, 2004 |
| 6734560 |
Diamond barrier layer |
May. 11, 2004 |
| 6734547 |
Semiconductor wiring structure having divided power lines and ground lines on the same layer |
May. 11, 2004 |
| 6727174 |
Method for fabricating a dual-diameter electrical conductor |
Apr. 27, 2004 |
| 6727538 |
Method and structure for improved alignment tolerance in multiple, singularized plugs |
Apr. 27, 2004 |
| 6724070 |
Fine pitch lead frame |
Apr. 20, 2004 |
| 6724092 |
Semiconductor device having a wiring pattern and method for manufacturing the same |
Apr. 20, 2004 |
| 6717272 |
Reinforced bond-pad substructure and method for fabricating the same |
Apr. 6, 2004 |
| 6713881 |
Semiconductor device and method of manufacturing same |
Mar. 30, 2004 |
| 6703715 |
Semiconductor device having interconnection layer with multiply layered sidewall insulation film |
Mar. 9, 2004 |
| 6703683 |
Chip resistor and method for manufacturing the same |
Mar. 9, 2004 |
| 6703712 |
Microelectronic device layer deposited with multiple electrolytes |
Mar. 9, 2004 |
| 6700457 |
Impedance compensation for circuit board breakout region |
Mar. 2, 2004 |
| 6700135 |
Active matrix panel |
Mar. 2, 2004 |
| 6700189 |
Resin sealed semiconductor device |
Mar. 2, 2004 |
| 6696636 |
By-pass rectifier element and terminal housing for solar battery modules using a by-pass rectifier element |
Feb. 24, 2004 |
| 6693360 |
Static type semiconductor memory device |
Feb. 17, 2004 |
| 6693324 |
Semiconductor device having a thin film transistor and manufacturing method thereof |
Feb. 17, 2004 |
| 6693357 |
Methods and semiconductor devices with wiring layer fill structures to improve planarization uniformity |
Feb. 17, 2004 |
| 6693342 |
Thin microelectronic substrates and methods of manufacture |
Feb. 17, 2004 |
| 6690092 |
Multilayer interconnection structure of a semiconductor device |
Feb. 10, 2004 |
| 6686615 |
Flip-chip type semiconductor device for reducing signal skew |
Feb. 3, 2004 |
| 6683382 |
Semiconductor device having an interconnect layer with a plurality of layout regions having substantially uniform densities of active interconnects and dummy fills |
Jan. 27, 2004 |
| 6680248 |
Method of forming dual damascene structure |
Jan. 20, 2004 |
| 6677669 |
Semiconductor package including two semiconductor die disposed within a common clip |
Jan. 13, 2004 |
| 6670714 |
Semiconductor integrated circuit device having multilevel interconnection |
Dec. 30, 2003 |
| 6670717 |
Structure and method for charge sensitive electrical devices |
Dec. 30, 2003 |
| 6670718 |
Wiring board utilizing a conductive member having a reduced thickness |
Dec. 30, 2003 |
| 6667547 |
High current capacity semiconductor device package and lead frame with large area connection posts and modified outline |
Dec. 23, 2003 |
| 6664639 |
Contact and via structure and method of fabrication |
Dec. 16, 2003 |
| 6661101 |
Semiconductor device |
Dec. 9, 2003 |
| 6653729 |
Semiconductor device and test method for manufacturing same |
Nov. 25, 2003 |
| 6649995 |
Semiconductor device and method of manufacturing the same |
Nov. 18, 2003 |
| 6650018 |
High power, high luminous flux light emitting diode and method of making same |
Nov. 18, 2003 |
| 6646351 |
Semiconductor device and manufacturing method thereof |
Nov. 11, 2003 |
| 6642604 |
Semiconductor device with resistor layer having heat radiation path to semiconductor substrate |
Nov. 4, 2003 |
| 6635583 |
Silicon carbide deposition for use as a low-dielectric constant anti-reflective coating |
Oct. 21, 2003 |
| 6630738 |
Deflectable interconnect |
Oct. 7, 2003 |
| 6627994 |
Semiconductor device and film carrier tape |
Sep. 30, 2003 |
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