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Browse by Category: Main > Physics
Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Patent Number Title Of Patent Date Issued
7863753 Semiconductor device and manufacturing method thereof Jan. 4, 2011
7863751 Multilayer wiring structure for memory circuit Jan. 4, 2011
7859113 Structure including via having refractory metal collar at copper wire and dielectric layer liner-less interface and related method Dec. 28, 2010
7859090 Die attach method and leadframe structure Dec. 28, 2010
7855457 Stacked multilayer structure and manufacturing method thereof Dec. 21, 2010
7855148 Methods of isolating array features during pitch doubling processes and semiconductor device structures having isolated array features Dec. 21, 2010
7847384 Semiconductor package and manufacturing method thereof Dec. 7, 2010
7839003 Semiconductor device including a coupling conductor having a concave and convex Nov. 23, 2010
7838996 Semiconductor device Nov. 23, 2010
7838974 Intergrated circuit packaging with improved die bonding Nov. 23, 2010
7838339 Semiconductor device package having features formed by stamping Nov. 23, 2010
7833910 Film substrate, fabrication method thereof, and image display substrate Nov. 16, 2010
7829459 Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device Nov. 9, 2010
7825525 Layout and process to contact sub-lithographic structures Nov. 2, 2010
7825518 Semiconductor device and method of manufacturing the same Nov. 2, 2010
7821124 Thin, thermally enhanced flip chip in a leaded molded package Oct. 26, 2010
7808117 Integrated circuit having pads and input/output (I/O) cells Oct. 5, 2010
7804175 Semiconductor structures including conductive vias continuously extending therethrough and methods of making the same Sep. 28, 2010
7800235 Method of fabricating semiconductor device Sep. 21, 2010
7800217 Power semiconductor device connected in distinct layers of plastic Sep. 21, 2010
7800209 Wiring board with conductive wirings and protrusion electrodes Sep. 21, 2010
7781892 Interconnect structure and method of fabricating same Aug. 24, 2010
7777346 Semiconductor integrated circuit device and a method of manufacturing the same Aug. 17, 2010
7777342 Semiconductor device and method for manufacturing the same Aug. 17, 2010
7777323 Semiconductor structure and method for forming the same Aug. 17, 2010
7772706 Air-gap ILD with unlanded vias Aug. 10, 2010
7768137 Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip Aug. 3, 2010
7768132 Circuit device and manufacturing method thereof Aug. 3, 2010
7763948 Flexible and elastic dielectric integrated circuit Jul. 27, 2010
7759801 Tapered signal lines Jul. 20, 2010
7755201 Semiconductor device and method of fabricating the same Jul. 13, 2010
7745938 Circuit device, a method for manufacturing a circuit device, and a semiconductor module Jun. 29, 2010
7745923 Cover substrate attached to a rim substrate with electrically connected through hole Jun. 29, 2010
7741724 Semiconductor device Jun. 22, 2010
7723855 Pad and circuit board, electronic device using same May. 25, 2010
7723847 Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween May. 25, 2010
7719120 Multi-component integrated circuit contacts May. 18, 2010
7719116 Semiconductor device having reduced number of external pad portions May. 18, 2010
7713872 Method of manufacturing semiconductor device and semiconductor device May. 11, 2010
7709965 Metal line of semiconductor device and method of manufacturing the same May. 4, 2010
7709390 Methods of isolating array features during pitch doubling processes and semiconductor device structures having isolated array features May. 4, 2010
7705465 Surface-mount type optical semiconductor device and method for manufacturing the same Apr. 27, 2010
7705464 Connection structure for semiconductor devices Apr. 27, 2010
7705459 Semiconductor devices and methods of forming interconnection lines therein Apr. 27, 2010
7705444 Semiconductor device with lead frame having lead terminals with wide portions of trapezoidal cross section Apr. 27, 2010
7701064 Apparatus for improved power distribution in a three dimensional vertical integrated circuit Apr. 20, 2010
7696628 Relay substrate and substrate assembly Apr. 13, 2010
7695981 Seed layers, cap layers, and thin films and methods of making thereof Apr. 13, 2010
7692304 Semiconductor device having a tapered plug Apr. 6, 2010
7691680 Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths Apr. 6, 2010

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