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Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6940170 |
Techniques for triple and quadruple damascene fabrication |
Sep. 6, 2005 |
| 6940166 |
Semiconductor device and method for designing the same |
Sep. 6, 2005 |
| 6936926 |
Wiring structure in a semiconductor device |
Aug. 30, 2005 |
| 6936925 |
Semiconductor device having copper lines with reduced electromigration using an electroplated interim copper-zinc alloy film on a copper surface |
Aug. 30, 2005 |
| 6936927 |
Circuit device having a multi-layer conductive path |
Aug. 30, 2005 |
| 6936916 |
Microelectronic assemblies and electronic devices including connection structures with multiple elongated members |
Aug. 30, 2005 |
| 6933599 |
Electromagnetic noise shielding in semiconductor packages using caged interconnect structures |
Aug. 23, 2005 |
| 6933614 |
Integrated circuit die having a copper contact and method therefor |
Aug. 23, 2005 |
| 6933606 |
Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same |
Aug. 23, 2005 |
| 6933615 |
Electronic component device and manufacturing method therefor |
Aug. 23, 2005 |
| 6930377 |
Using adhesive materials as insulation coatings for leadless lead frame semiconductor packages |
Aug. 16, 2005 |
| 6930395 |
Circuit substrate having improved connection reliability and a method for manufacturing the same |
Aug. 16, 2005 |
| 6919640 |
Semiconductor device having a contact window including a lower region with a wider width to provide a lower contact resistance |
Jul. 19, 2005 |
| 6919635 |
High density microvia substrate with high wireability |
Jul. 19, 2005 |
| 6919637 |
Interconnect structure for an integrated circuit and method of fabrication |
Jul. 19, 2005 |
| 6919644 |
Semiconductor device manufacturing method and semiconductor device manufactured thereby |
Jul. 19, 2005 |
| 6917113 |
Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly |
Jul. 12, 2005 |
| 6917101 |
Apparatus carrying electronic device |
Jul. 12, 2005 |
| 6909176 |
Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate |
Jun. 21, 2005 |
| 6906409 |
Multichip semiconductor package |
Jun. 14, 2005 |
| 6906423 |
Mask used for exposing a porous substrate |
Jun. 14, 2005 |
| 6906428 |
Electronic component having a semiconductor chip and method for populating a circuit carrier during the production of the electronic component |
Jun. 14, 2005 |
| 6900545 |
Variable thickness pads on a substrate surface |
May. 31, 2005 |
| 6900533 |
Apparatus for routing electrical signals |
May. 31, 2005 |
| 6900540 |
Simulating diagonal wiring directions using Manhattan directional wires |
May. 31, 2005 |
| 6900546 |
Semiconductor memory device and method for manufacturing the same |
May. 31, 2005 |
| 6900512 |
Light-receiving module |
May. 31, 2005 |
| 6892452 |
Method of forming a projection electrode |
May. 17, 2005 |
| 6894376 |
Leadless microelectronic package and a method to maximize the die size in the package |
May. 17, 2005 |
| 6888252 |
Method of forming a conductive contact |
May. 3, 2005 |
| 6888231 |
Surface mounting semiconductor device |
May. 3, 2005 |
| 6888254 |
Semiconductor device |
May. 3, 2005 |
| 6888253 |
Inexpensive wafer level MMIC chip packaging |
May. 3, 2005 |
| 6885076 |
Semiconductor laser device |
Apr. 26, 2005 |
| 6879494 |
Circuit package for electronic systems |
Apr. 12, 2005 |
| 6876085 |
Signal layer interconnect using tapered traces |
Apr. 5, 2005 |
| 6873056 |
Electrode-to-electrode bond structure |
Mar. 29, 2005 |
| 6873055 |
Integrated circuit arrangement with field-shaping electrical conductor |
Mar. 29, 2005 |
| 6873040 |
Semiconductor packages for enhanced number of terminals, speed and power performance |
Mar. 29, 2005 |
| 6870266 |
Oxide semiconductor electrode and process for producing the same |
Mar. 22, 2005 |
| 6867498 |
Metal line layout of an integrated circuit |
Mar. 15, 2005 |
| 6864586 |
Padless high density circuit board |
Mar. 8, 2005 |
| 6864171 |
Via density rules |
Mar. 8, 2005 |
| 6864583 |
Wiring structure of semiconductor device |
Mar. 8, 2005 |
| 6861666 |
Apparatus and methods for determining and localization of failures in test structures using voltage contrast |
Mar. 1, 2005 |
| 6861735 |
Resin molded type semiconductor device and a method of manufacturing the same |
Mar. 1, 2005 |
| 6858944 |
Bonding pad metal layer geometry design |
Feb. 22, 2005 |
| 6858921 |
Flexible printed circuit substrate |
Feb. 22, 2005 |
| 6856024 |
Semiconductor device with wiring embedded in trenches and vias |
Feb. 15, 2005 |
| 6853059 |
Semiconductor package having improved adhesiveness and ground bonding |
Feb. 8, 2005 |
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