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Browse by Category: Main > Physics
Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8053682 Multilayer ceramic substrate Nov. 8, 2011
8049338 Power semiconductor module and fabrication method Nov. 1, 2011
8044394 Semiconductor wafer with electrically connected contact and test areas Oct. 25, 2011
8039947 Integrated circuit package system with different mold locking features Oct. 18, 2011
8035232 Semiconductor device including interconnects, vias connecting the interconnects and greater thickness of the liner film adjacent the vias Oct. 11, 2011
8035231 Semiconductor device and method of manufacturing the same Oct. 11, 2011
8030779 Multi-layered metal interconnection Oct. 4, 2011
8026591 Semiconductor device with lead terminals having portions thereof extending obliquely Sep. 27, 2011
8026588 Method of wire bonding over active area of a semiconductor circuit Sep. 27, 2011
8022553 Mounting substrate and manufacturing method thereof Sep. 20, 2011
8022536 Semiconductor substrate for build-up packages Sep. 20, 2011
8022497 Semiconductor device comprising insulating film Sep. 20, 2011
8018070 Semiconductor device, method for manufacturing semiconductor devices and mask systems used in the manufacturing of semiconductor devices Sep. 13, 2011
8013348 Semiconductor device with a driver circuit for light emitting diodes Sep. 6, 2011
8004090 Semiconductor device and method for manufacturing the same Aug. 23, 2011
7999393 Semiconductor device and manufacturing method thereof Aug. 16, 2011
7999392 Multilayer wiring structure, semiconductor device, pattern transfer mask and method for manufacturing multilayer wiring structure Aug. 16, 2011
7989939 Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire Aug. 2, 2011
7984394 Design structure for a redundant micro-loop structure for use in an integrated circuit physical design process and method of forming the same Jul. 19, 2011
7977232 Semiconductor wafer including cracking stopper structure and method of forming the same Jul. 12, 2011
7973415 Manufacturing process and structure of through silicon via Jul. 5, 2011
7973391 Tapered dielectric and conductor structures and applications thereof Jul. 5, 2011
7964971 Flexible column die interconnects and structures including same Jun. 21, 2011
7964969 Semiconductor device having via connecting between interconnects Jun. 21, 2011
7960797 Semiconductor devices including fine pitch arrays with staggered contacts Jun. 14, 2011
7952203 Methods of forming C4 round dimple metal stud bumps for fine pitch packaging applications and structures formed thereby May. 31, 2011
7948094 Semiconductor device May. 24, 2011
7943973 Method for producing a field-effect transistor, field-effect transistor and integrated circuit arrangement May. 17, 2011
7940544 Memory system having multiple vias at junctions between traces May. 10, 2011
7936073 Semiconductor device and method of manufacturing the same May. 3, 2011
7932609 Semiconductor device having groove-shaped via-hole Apr. 26, 2011
7932608 Through-silicon via formed with a post passivation interconnect structure Apr. 26, 2011
7932606 Semiconductor device and a method of manufacturing the same Apr. 26, 2011
7928580 Semiconductor memory device having wiring with lead portions disposed with a pitch larger than pitch of parallel bit lines Apr. 19, 2011
7923843 Semiconductor device with a contact plug connected to multiple interconnects formed within Apr. 12, 2011
7919810 Device with polymer layers and two-step self-aligned source etch with large process window Apr. 5, 2011
7915737 Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device Mar. 29, 2011
7911063 Semiconductor device Mar. 22, 2011
7911062 Electronic component with varying rigidity leads using Pb-free solder Mar. 22, 2011
7911012 Flexible and elastic dielectric integrated circuit Mar. 22, 2011
7906851 Semiconductor device having groove-shaped via-hole Mar. 15, 2011
7900350 Method of manufacturing a wiring board Mar. 8, 2011
7898087 Integrated chip carrier with compliant interconnects Mar. 1, 2011
7897499 Method for fabricating a semiconductor device with self-aligned contact Mar. 1, 2011
7880311 Stacked semiconductor package and method for manufacturing the same Feb. 1, 2011
7880309 Arrangement of stacked integrated circuit dice having a direct electrical connection Feb. 1, 2011
7880308 Semiconductor device Feb. 1, 2011
7875982 Semiconductor device for preventing voids in the contact region and method of forming the same Jan. 25, 2011
7872354 High voltage-resistant semiconductor device and method of manufacturing high voltage-resistant semiconductor device Jan. 18, 2011
7868460 Semiconductor package and method of manufacturing the same Jan. 11, 2011

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