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Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7067796 |
Integrated circuit for optical encoder |
Jun. 27, 2006 |
| 7064431 |
Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts |
Jun. 20, 2006 |
| 7064450 |
Semiconductor die with high density offset-inline bond arrangement |
Jun. 20, 2006 |
| 7060537 |
Microchip controller board manufacturing method |
Jun. 13, 2006 |
| 7057271 |
Apparatus for connecting an IC terminal to a reference potential |
Jun. 6, 2006 |
| 7049229 |
Method of fabricating semiconductor device and semiconductor device |
May. 23, 2006 |
| 7049701 |
Semiconductor device using insulating film of low dielectric constant as interlayer insulating film |
May. 23, 2006 |
| 7049703 |
Semiconductor device having a tapered interconnection with insulating material on conductive sidewall thereof within through hole |
May. 23, 2006 |
| 7042074 |
Power semiconductor module and method for producing it |
May. 9, 2006 |
| 7042099 |
Semiconductor device containing a dummy wire |
May. 9, 2006 |
| 7042100 |
Damascene interconnection and semiconductor device |
May. 9, 2006 |
| 7042102 |
Semiconductor device |
May. 9, 2006 |
| 7034810 |
Liquid crystal display device |
Apr. 25, 2006 |
| 7030508 |
Substrate for semiconductor package and wire bonding method using thereof |
Apr. 18, 2006 |
| 7030500 |
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
Apr. 18, 2006 |
| 7026714 |
Copper interconnect systems which use conductive, metal-based cap layers |
Apr. 11, 2006 |
| 7026717 |
Fill pattern generation for spin-on glass and related self-planarization deposition |
Apr. 11, 2006 |
| 7026699 |
Semiconductor device and method for fabricating the same |
Apr. 11, 2006 |
| 7023095 |
Carrier |
Apr. 4, 2006 |
| 7023094 |
Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor |
Apr. 4, 2006 |
| 7023090 |
Bonding pad and via structure design |
Apr. 4, 2006 |
| 7012338 |
Semiconductor device, liquid crystal display device and method of manufacturing the semiconductor device |
Mar. 14, 2006 |
| 7012811 |
Method of tuning a multi-path circuit |
Mar. 14, 2006 |
| 7009298 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer |
Mar. 7, 2006 |
| 7009294 |
Production process for semiconductor device |
Mar. 7, 2006 |
| 7005750 |
Substrate with reinforced contact pad structure |
Feb. 28, 2006 |
| 7005746 |
Method for designing wiring connecting section and semiconductor device |
Feb. 28, 2006 |
| 7002225 |
Compliant component for supporting electrical interface component |
Feb. 21, 2006 |
| 6998714 |
Selectively coating bond pads |
Feb. 14, 2006 |
| 6998716 |
Diamond metal-filled patterns achieving low parasitic coupling capacitance |
Feb. 14, 2006 |
| 6992394 |
Multi-level conductive lines with reduced pitch |
Jan. 31, 2006 |
| 6989297 |
Variable thickness pads on a substrate surface |
Jan. 24, 2006 |
| 6987323 |
Chip-size semiconductor package |
Jan. 17, 2006 |
| 6982494 |
Semiconductor device with signal line having decreased characteristic impedance |
Jan. 3, 2006 |
| 6979643 |
Interlayer connections for layered electronic devices |
Dec. 27, 2005 |
| 6979898 |
Semiconductor component and a method of fabricating the semiconductor component |
Dec. 27, 2005 |
| 6977431 |
Stackable semiconductor package and manufacturing method thereof |
Dec. 20, 2005 |
| 6975031 |
Semiconductor device and chip carrier |
Dec. 13, 2005 |
| 6972434 |
Substrate for display, method of manufacturing the same and display having the same |
Dec. 6, 2005 |
| 6967398 |
Module power distribution network |
Nov. 22, 2005 |
| 6960830 |
Semiconductor integrated circuit device with dummy bumps |
Nov. 1, 2005 |
| 6955948 |
Method of manufacturing a component built-in module |
Oct. 18, 2005 |
| 6954001 |
Semiconductor device including a diffusion layer |
Oct. 11, 2005 |
| 6952053 |
Metal bond pad for integrated circuits allowing improved probing ability of small pads |
Oct. 4, 2005 |
| 6949816 |
Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturin |
Sep. 27, 2005 |
| 6949839 |
Aligned buried structures formed by surface transformation of empty spaces in solid state materials |
Sep. 27, 2005 |
| 6949837 |
Bonding pad arrangement method for semiconductor devices |
Sep. 27, 2005 |
| 6946737 |
Robust interlocking via |
Sep. 20, 2005 |
| 6946744 |
System and method of reducing die attach stress and strain |
Sep. 20, 2005 |
| 6943100 |
Method of fabricating a wiring board utilizing a conductive member having a reduced thickness |
Sep. 13, 2005 |
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