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Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7265449 |
Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package |
Sep. 4, 2007 |
| 7262505 |
Selective electroless-plated copper metallization |
Aug. 28, 2007 |
| 7253528 |
Trace design to minimize electromigration damage to solder bumps |
Aug. 7, 2007 |
| 7253514 |
Self-supporting connecting element for a semiconductor chip |
Aug. 7, 2007 |
| 7253439 |
Substrate for display, method of manufacturing the same and display having the same |
Aug. 7, 2007 |
| 7250679 |
Semiconductor device and method for fabricating the same |
Jul. 31, 2007 |
| 7250681 |
Semiconductor device and a method of manufacturing the semiconductor device |
Jul. 31, 2007 |
| 7247931 |
Semiconductor package and leadframe therefor having angled corners |
Jul. 24, 2007 |
| 7247939 |
Metal filled semiconductor features with improved structural stability |
Jul. 24, 2007 |
| 7247943 |
Integrated circuit with at least one bump |
Jul. 24, 2007 |
| 7245014 |
Semiconductor light emitting apparatus and method for producing the same |
Jul. 17, 2007 |
| 7239028 |
Semiconductor device with signal line having decreased characteristic impedance |
Jul. 3, 2007 |
| 7235883 |
Layered wiring line of silver alloy and method for forming the same and display panel substrate using the same |
Jun. 26, 2007 |
| 7229913 |
Stitched micro-via to enhance adhesion and mechanical strength |
Jun. 12, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7227781 |
Semiconductor device provided with NAND strings and select gates having different gate lengths |
Jun. 5, 2007 |
| 7221055 |
System and method for die attach using a backside heat spreader |
May. 22, 2007 |
| 7217995 |
Apparatus for stacking electrical components using insulated and interconnecting via |
May. 15, 2007 |
| 7215029 |
Multilayer interconnection structure of a semiconductor |
May. 8, 2007 |
| 7208831 |
Semiconductor device having multilayer wiring structure and method, wherein connecting portion and wiring layer are formed of same layer |
Apr. 24, 2007 |
| 7205649 |
Ball grid array copper balancing |
Apr. 17, 2007 |
| 7202566 |
Crossed power strapped layout for full CMOS circuit design |
Apr. 10, 2007 |
| 7202567 |
Semiconductor device and manufacturing method for the same |
Apr. 10, 2007 |
| 7199470 |
Surface-mountable semiconductor component and method for producing it |
Apr. 3, 2007 |
| 7190060 |
Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same |
Mar. 13, 2007 |
| 7190080 |
Semiconductor chip assembly with embedded metal pillar |
Mar. 13, 2007 |
| 7187083 |
Thermal interface material and solder preforms |
Mar. 6, 2007 |
| 7183654 |
Providing a via with an increased via contact area |
Feb. 27, 2007 |
| 7176578 |
Method for processing a thin film substrate |
Feb. 13, 2007 |
| 7176574 |
Semiconductor device having a multiple thickness interconnect |
Feb. 13, 2007 |
| 7173337 |
Semiconductor device manufactured by the damascene process having improved stress migration resistance |
Feb. 6, 2007 |
| 7170182 |
Semiconductor device with reduced interconnect capacitance |
Jan. 30, 2007 |
| 7170168 |
Flip-chip semiconductor package with lead frame and method for fabricating the same |
Jan. 30, 2007 |
| 7170181 |
Optimum padset for wire bonding RF technologies with high-Q inductors |
Jan. 30, 2007 |
| 7164208 |
Semiconductor device and method for manufacturing the same |
Jan. 16, 2007 |
| 7154184 |
Interconnection structure of semiconductor device |
Dec. 26, 2006 |
| 7154183 |
Semiconductor device having multilevel interconnection |
Dec. 26, 2006 |
| 7148564 |
Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness |
Dec. 12, 2006 |
| 7148535 |
Zero capacitance bondpad utilizing active negative capacitance |
Dec. 12, 2006 |
| 7145246 |
Method of fabricating an ultra-narrow channel semiconductor device |
Dec. 5, 2006 |
| 7145247 |
Offset-bonded, multi-chip semiconductor device |
Dec. 5, 2006 |
| 7132726 |
Integrated semiconductor circuit having a logic and power metallization without intermetal dielectric |
Nov. 7, 2006 |
| 7132736 |
Devices having compliant wafer-level packages with pillars and methods of fabrication |
Nov. 7, 2006 |
| 7126225 |
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling |
Oct. 24, 2006 |
| 7124389 |
Automated wiring pattern layout method |
Oct. 17, 2006 |
| 7122901 |
Semiconductor device |
Oct. 17, 2006 |
| 7119441 |
Semiconductor interconnect structure |
Oct. 10, 2006 |
| 7115996 |
Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped |
Oct. 3, 2006 |
| 7115999 |
Semiconductor device and method of manufacturing the same |
Oct. 3, 2006 |
| 7105861 |
Electronic device contact structures |
Sep. 12, 2006 |
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