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Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Patent Number Title Of Patent Date Issued
6184586 Semiconductor device including a ball grid array Feb. 6, 2001
6181011 Method of controlling critical dimension of features in integrated circuits (ICS), ICS formed by the method, and systems utilizing same Jan. 30, 2001
6177715 Integrated circuit having a level of metallization of variable thickness Jan. 23, 2001
6166442 Semiconductor device Dec. 26, 2000
6160297 Semiconductor memory device having a first source line arranged between a memory cell string and bit lines in the direction crossing the bit lines and a second source line arranged in parallel Dec. 12, 2000
6160316 Integrated circuit utilizing an air gap to reduce capacitance between adjacent metal linewidths Dec. 12, 2000
6153937 Semiconductor device and method of the same Nov. 28, 2000
6150192 Apparatus and method for snap-on thermo-compression bonding Nov. 21, 2000
6147395 Method for fabricating a small area of contact between electrodes Nov. 14, 2000
6144090 Ball grid array package having electrodes on peripheral side surfaces of a package board Nov. 7, 2000
6140706 Semiconductor device and method of manufacturing without damaging HSQ layer and metal pattern utilizing multiple dielectric layers Oct. 31, 2000
6137182 Method of reducing via and contact dimensions beyond photolithography equipment limits Oct. 24, 2000
6130482 Semiconductor device and method for fabricating the same Oct. 10, 2000
6127732 Semiconductor device having high aspect ratio contacts Oct. 3, 2000
6127734 Semiconductor device comprising a contact hole of varying width thru multiple insulating layers Oct. 3, 2000
6124640 Scalable and reliable integrated circuit inter-level dielectric Sep. 26, 2000
6114723 Flash memory cell using poly to poly tunneling for erase Sep. 5, 2000
6114766 Integrated circuit with metal features presenting a larger landing area for vias Sep. 5, 2000
RE36837 Structure of contact between wiring layers in semiconductor integrated circuit device Aug. 29, 2000
6107196 Integrated circuit, and method for forming an integrated circuit Aug. 22, 2000
6104062 Semiconductor device having reduced effective substrate resistivity and associated methods Aug. 15, 2000
6100588 Multiple level conductor wordline strapping scheme Aug. 8, 2000
6097103 Semiconductor device having an improved interconnection and method for fabricating the same Aug. 1, 2000
6091149 Dissolvable dielectric method and structure Jul. 18, 2000
6081035 Microelectronic bond ribbon design Jun. 27, 2000
6081036 Semiconductor device Jun. 27, 2000
6072242 Contact structure of semiconductor memory device for reducing contact related defect and contact resistance and method for forming the same Jun. 6, 2000
6060771 Connecting lead for semiconductor devices and method for fabricating the lead May. 9, 2000
6051885 Semiconductor device having a conductor with a wedge shaped depression Apr. 18, 2000
6051889 Semiconductor device having a flip-chip structure Apr. 18, 2000
6046504 Resin-encapsulated LOC semiconductor device having a thin inner lead Apr. 4, 2000
6037665 Mounting assembly of integrated circuit device and method for production thereof Mar. 14, 2000
6031258 High DC current stagger power/ground pad Feb. 29, 2000
6028363 Vertical via/contact Feb. 22, 2000
6025647 Apparatus for equalizing signal parameters in flip chip redistribution layers Feb. 15, 2000
6020644 Semiconductor memory device having bit lines and signal wiring layers different in thickness and process of fabricating thereof Feb. 1, 2000
6016012 Thin liner layer providing reduced via resistance Jan. 18, 2000
6008541 Packaged integrated circuit device Dec. 28, 1999
5989994 Method for producing contact structures Nov. 23, 1999
5990561 Tungsten plugs for integrated circuits and methods for making same Nov. 23, 1999
5986477 Method and system for providing an interconnect layout to reduce delays in logic circuits Nov. 16, 1999
5981379 Method of forming via Nov. 9, 1999
5977638 Edge metal for interconnect layers Nov. 2, 1999
5973387 Tapered isolated metal profile to reduce dielectric layer cracking Oct. 26, 1999
5962867 Abatement of electron beam charging distortion during dimensional measurements of integrated circuit patterns with scanning electron microscopy by the utilization of specially designed test st Oct. 5, 1999
5963831 Method of making an interconnect structure employing equivalent resistance paths to improve electromigration resistance Oct. 5, 1999
5959360 Interconnect structure employing equivalent resistance paths to improve electromigration resistance Sep. 28, 1999
5949651 Quad flat pack integrated circuit package Sep. 7, 1999
5939791 Electrically conductive interconnects for integrated circuits Aug. 17, 1999
5932491 Reduction of contact size utilizing formation of spacer material over resist pattern Aug. 3, 1999

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