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Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5270570 |
Lead frame for a multiplicity of terminals |
Dec. 14, 1993 |
| 5260597 |
Routing structure for a customizable integrated circuit |
Nov. 9, 1993 |
| 5248347 |
Solar cell |
Sep. 28, 1993 |
| 5240868 |
Method of fabrication metal-electrode in semiconductor device |
Aug. 31, 1993 |
| 5233212 |
Semiconductor device having gate electrode spacing dependent upon gate side wall insulating dimension |
Aug. 3, 1993 |
| 5233224 |
Electrode having an improved configuration for a semiconductor element |
Aug. 3, 1993 |
| 5233225 |
Resin encapsulated pin grid array and method of manufacturing the same |
Aug. 3, 1993 |
| 5229645 |
Semiconductor device and manufacturing method thereof |
Jul. 20, 1993 |
| 5229642 |
Resin molded type semiconductor device having a conductor film |
Jul. 20, 1993 |
| 5216267 |
Stacked capacitor dynamic random access memory with a sloped lower electrode |
Jun. 1, 1993 |
| 5208658 |
Semiconductor integrated circuit provided with contact for inter-layer connection and method of inter-layer connection therefor |
May. 4, 1993 |
| 5194753 |
Method of preventing storage node to storage node shorts in fabrication of memory integrated circuitry having stacked capacitors and stacked capacitor memory integrated circuits |
Mar. 16, 1993 |
| 5185652 |
Electrical connection between buses on a semiconductor integrated circuit |
Feb. 9, 1993 |
| 5179435 |
Resin sealed semiconductor integrated circuit device |
Jan. 12, 1993 |
| 5173574 |
Soldering connector and method for manufacturing an electric circuit with this soldering connector |
Dec. 22, 1992 |
| 5132768 |
Semiconductor component with turn-off facility |
Jul. 21, 1992 |
| 5126819 |
Wiring pattern of semiconductor integrated circuit device |
Jun. 30, 1992 |
| 5111276 |
Thick bus metallization interconnect structure to reduce bus area |
May. 5, 1992 |
| 5108950 |
Method for forming a bump electrode for a semiconductor device |
Apr. 28, 1992 |
| 5103287 |
Multi-layered wiring structure of semiconductor integrated circuit device |
Apr. 7, 1992 |
| 5089863 |
Field effect transistor with T-shaped gate electrode |
Feb. 18, 1992 |
| 5084416 |
Method of forming a low resistance contact by forming a contact hole within a recess |
Jan. 28, 1992 |
| 5072282 |
Multi-layer wirings on a semiconductor device and fabrication method |
Dec. 10, 1991 |
| 5068707 |
DRAM memory cell with tapered capacitor electrodes |
Nov. 26, 1991 |
| 5034799 |
Semiconductor integrated circuit device having a hollow multi-layered lead structure |
Jul. 23, 1991 |
| 5031016 |
Semiconductor component with turn-off facility |
Jul. 9, 1991 |
| 5027174 |
Semiconductor integrated circuit device with improved resistance against electrostatic noise |
Jun. 25, 1991 |
| 5008731 |
Integrated semiconductor circuit with decoupled D.C. wiring |
Apr. 16, 1991 |
| 5006917 |
Thermocompression bonding in integrated circuit packaging |
Apr. 9, 1991 |
| 5003373 |
Structure of electrode junction for semiconductor device |
Mar. 26, 1991 |
| 5001079 |
Method of manufacturing a semiconductor device by forming insulating side walls with voids below overhangs |
Mar. 19, 1991 |
| 5001541 |
Advanced electromigration resistant interconnect structure and process |
Mar. 19, 1991 |
| 4996584 |
Thin-film electrical connections for integrated circuits |
Feb. 26, 1991 |
| 4992851 |
Characteristic impedance-correct chip carrier for microwave semiconductor components |
Feb. 12, 1991 |
| 4985597 |
Optical semiconductor device |
Jan. 15, 1991 |
| 4979012 |
Semiconductor device with bonding pad contacts |
Dec. 18, 1990 |
| 4975753 |
Semiconductor memory device having an aluminum-based metallization film and a refractory metal silicide-based metallization film |
Dec. 4, 1990 |
| 4970572 |
Semiconductor integrated circuit device of multilayer interconnection structure |
Nov. 13, 1990 |
| H842 |
Metal conductor structure having low electro-migration at high currents for semiconductor devices |
Nov. 6, 1990 |
| 4951120 |
Lead frame and semiconductor device using the same |
Aug. 21, 1990 |
| 4951098 |
Electrode structure for light emitting diode array chip |
Aug. 21, 1990 |
| 4949157 |
Large scale integrated circuit |
Aug. 14, 1990 |
| 4935797 |
Heterojunction bipolar transistors |
Jun. 19, 1990 |
| 4935637 |
Linear element array with wire bonding arrangement |
Jun. 19, 1990 |
| 4924290 |
Semiconductor device having improved multilayered wirings |
May. 8, 1990 |
| 4916509 |
Method for obtaining low interconnect resistance on a grooved surface and the resulting structure |
Apr. 10, 1990 |
| 4905068 |
Semiconductor device having interconnection layers of T-shape cross section |
Feb. 27, 1990 |
| 4882607 |
Optical semiconductor device |
Nov. 21, 1989 |
| 4847674 |
High speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism |
Jul. 11, 1989 |
| 4839510 |
Optical sensor including shortcircuit protection having notched electrode regions |
Jun. 13, 1989 |
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