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Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5532516 |
Techniques for via formation and filling |
Jul. 2, 1996 |
| 5528077 |
Flexible tab semiconductor device |
Jun. 18, 1996 |
| 5528080 |
Electrically conductive interconnection through a body of semiconductor material |
Jun. 18, 1996 |
| 5528082 |
Thin-film structure with tapered feature |
Jun. 18, 1996 |
| 5528058 |
IGBT device with platinum lifetime control and reduced gaw |
Jun. 18, 1996 |
| 5523627 |
Wiring pattern of semiconductor integrated circuit device |
Jun. 4, 1996 |
| 5523625 |
Semiconductor integrated circuit device having partially constricted lower wiring for preventing upper wirings from short-circuit |
Jun. 4, 1996 |
| 5521429 |
Surface-mount flat package semiconductor device |
May. 28, 1996 |
| 5514911 |
Highly integrated semiconductor device contact structure |
May. 7, 1996 |
| 5506450 |
Semiconductor device with improved electromigration resistance and method for making the same |
Apr. 9, 1996 |
| 5504349 |
Optoelectronic device |
Apr. 2, 1996 |
| 5502336 |
Semiconductor device and manufacturing method thereof |
Mar. 26, 1996 |
| 5502337 |
Semiconductor device structure including multiple interconnection layers with interlayer insulating films |
Mar. 26, 1996 |
| 5502335 |
Semiconductor device with wiring layer |
Mar. 26, 1996 |
| 5477062 |
Semiconductor wafer |
Dec. 19, 1995 |
| 5473195 |
Semiconductor integrated circuit device having parallel signal wirings variable in either width or interval |
Dec. 5, 1995 |
| 5471084 |
Magnetoresistive element and manufacturing method therefor |
Nov. 28, 1995 |
| 5471095 |
Semiconductor integrated circuit device and method of fabricating same |
Nov. 28, 1995 |
| 5471091 |
Techniques for via formation and filling |
Nov. 28, 1995 |
| 5468998 |
Resin molded type semiconductor device having a conductor film |
Nov. 21, 1995 |
| 5465005 |
Polysilicon resistor structure including polysilicon contacts |
Nov. 7, 1995 |
| 5461260 |
Semiconductor device interconnect layout structure for reducing premature electromigration failure due to high localized current density |
Oct. 24, 1995 |
| 5455452 |
Semiconductor package having an LOC structure |
Oct. 3, 1995 |
| 5444020 |
Method for forming contact holes having different depths |
Aug. 22, 1995 |
| 5444186 |
Multilayer conductive wire for semiconductor device and manufacturing method thereof |
Aug. 22, 1995 |
| 5442237 |
Semiconductor device having a low permittivity dielectric |
Aug. 15, 1995 |
| 5438223 |
Anisotropic electrically conductive adhesive film and connection structure using the same |
Aug. 1, 1995 |
| 5422516 |
Electronic parts loaded module including thermal stress absorbing projecting electrodes |
Jun. 6, 1995 |
| 5422839 |
Semiconductor memory device |
Jun. 6, 1995 |
| 5420462 |
Semiconductor device with conductors on stepped substrate having planar upper surfaces |
May. 30, 1995 |
| 5411400 |
Interconnect system for a semiconductor chip and a substrate |
May. 2, 1995 |
| 5412239 |
Contact geometry for improved lateral MOSFET |
May. 2, 1995 |
| 5410182 |
High density semiconductor device having inclined chip mounting |
Apr. 25, 1995 |
| 5404046 |
Flat semiconductor wiring layers |
Apr. 4, 1995 |
| 5376815 |
Semiconductor device having bipolar-mos composite element pellet suitable for pressure contacted structure |
Dec. 27, 1994 |
| 5371411 |
Resin molded type semiconductor device having a conductor film |
Dec. 6, 1994 |
| 5365082 |
MOSFET cell array |
Nov. 15, 1994 |
| 5357140 |
Semiconductor device capable of laminating a plurality of wiring layers which are more than four layers |
Oct. 18, 1994 |
| 5338957 |
Nonvolatile semiconductor device and a method of manufacturing thereof |
Aug. 16, 1994 |
| 5332924 |
Semiconductor device and production method thereof |
Jul. 26, 1994 |
| 5332918 |
Ultra-high-speed photoconductive devices using semi-insulating layers |
Jul. 26, 1994 |
| 5329162 |
Semiconductor device having a conductor layer provided over a semiconductor substrate |
Jul. 12, 1994 |
| 5321300 |
Laser-broken fuse |
Jun. 14, 1994 |
| 5317193 |
Contact via for semiconductor device |
May. 31, 1994 |
| 5306665 |
Manufacturing a wiring for a semiconductor device by a forwardly tapered stack of two conductor films |
Apr. 26, 1994 |
| 5302855 |
Contact electrode structure for semiconductor device |
Apr. 12, 1994 |
| 5289040 |
Compensating lead structure for distributed IC components |
Feb. 22, 1994 |
| 5288948 |
Structure of a semiconductor chip having a conductive layer |
Feb. 22, 1994 |
| 5289036 |
Resin sealed semiconductor integrated circuit |
Feb. 22, 1994 |
| 5286675 |
Blanket tungsten etchback process using disposable spin-on-glass |
Feb. 15, 1994 |
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