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Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5831332 |
Semiconductor package for surface mounting |
Nov. 3, 1998 |
| 5818110 |
Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same |
Oct. 6, 1998 |
| 5818111 |
Low capacitance interconnect structures in integrated circuits using a stack of low dielectric materials |
Oct. 6, 1998 |
| 5814884 |
Commonly housed diverse semiconductor die |
Sep. 29, 1998 |
| 5808365 |
Semiconductor device and method of manufacturing the same |
Sep. 15, 1998 |
| 5796158 |
Lead frame coining for semiconductor devices |
Aug. 18, 1998 |
| 5793098 |
Package including conductive layers having notches formed |
Aug. 11, 1998 |
| 5786639 |
Wiring member and lead frame having the same |
Jul. 28, 1998 |
| 5780872 |
Liquid crystal device, projection type color display device and driving circuit |
Jul. 14, 1998 |
| 5773892 |
Multi-port semiconductor memory device with reduced coupling noise |
Jun. 30, 1998 |
| 5774342 |
Electronic circuit with integrated terminal pins |
Jun. 30, 1998 |
| 5763955 |
Patterned filled layers for integrated circuit manufacturing |
Jun. 9, 1998 |
| 5760476 |
Interconnect run between a first point and a second point in a semiconductor device for reducing electromigration failure |
Jun. 2, 1998 |
| 5761028 |
Transistor connection assembly having IGBT (X) cross ties |
Jun. 2, 1998 |
| 5757076 |
Chip type electronic component |
May. 26, 1998 |
| 5739590 |
Semiconductor device having improved surface evenness |
Apr. 14, 1998 |
| 5739579 |
Method for forming interconnections for semiconductor fabrication and semiconductor device having such interconnections |
Apr. 14, 1998 |
| 5739589 |
Semiconductor integrated circuit device process for fabricating the same and apparatus for fabricating the same |
Apr. 14, 1998 |
| 5729048 |
Cmos ic device suppressing spike noise |
Mar. 17, 1998 |
| 5726498 |
Wire shape conferring reduced crosstalk and formation methods |
Mar. 10, 1998 |
| 5712510 |
Reduced electromigration interconnection line |
Jan. 27, 1998 |
| 5701029 |
Semiconductor having polycrystalline silicon sandwiched by semiconductor substrate and metal silicide |
Dec. 23, 1997 |
| 5693983 |
Thin-film structure with conductive molybdenum-chromium line |
Dec. 2, 1997 |
| 5691566 |
Tapered three-wire line vertical connections |
Nov. 25, 1997 |
| 5691241 |
Method for making plurality of leadframes having grooves containing island and inner leads |
Nov. 25, 1997 |
| 5691572 |
Interconnect structures for integrated circuits |
Nov. 25, 1997 |
| 5689139 |
Enhanced electromigration lifetime of metal interconnection lines |
Nov. 18, 1997 |
| 5686762 |
Semiconductor device with improved bond pads |
Nov. 11, 1997 |
| 5684331 |
Multilayered interconnection of semiconductor device |
Nov. 4, 1997 |
| 5677574 |
Airbridge wiring structure for MMIC |
Oct. 14, 1997 |
| 5668410 |
Projecting electrode structure having a double-layer conductive layer |
Sep. 16, 1997 |
| 5663599 |
Metal layout pattern for improved passivation layer coverage |
Sep. 2, 1997 |
| 5663597 |
RF device package for high frequency applications |
Sep. 2, 1997 |
| 5656854 |
Lead frame for a multiplicity of terminals |
Aug. 12, 1997 |
| 5648685 |
Active matrix assembly with lines of equal resistance |
Jul. 15, 1997 |
| 5635759 |
Semiconductor device for mounting high-frequency element |
Jun. 3, 1997 |
| 5633523 |
Complementary mis semiconductor device of dual gate structure having a silicide layer including a thinned portion |
May. 27, 1997 |
| 5619071 |
Anchored via connection |
Apr. 8, 1997 |
| 5616961 |
Structure of contact between wiring layers in semiconductor integrated circuit device |
Apr. 1, 1997 |
| 5583380 |
Integrated circuit contacts with secured stringers |
Dec. 10, 1996 |
| 5583381 |
Resin molded type-semiconductor device having a conductor film |
Dec. 10, 1996 |
| 5567989 |
Highly integrated semiconductor wiring structure |
Oct. 22, 1996 |
| 5561327 |
Multilayer interconnection structure for a semiconductor device |
Oct. 1, 1996 |
| 5552639 |
Resin molded type semiconductor device having a conductor film |
Sep. 3, 1996 |
| 5539257 |
Resin molded type semiconductor device having a conductor film |
Jul. 23, 1996 |
| 5539255 |
Semiconductor structure having self-aligned interconnection metallization formed from a single layer of metal |
Jul. 23, 1996 |
| 5539247 |
Selective metal via plug growth technology for deep sub-micrometer ULSI |
Jul. 23, 1996 |
| 5532516 |
Techniques for via formation and filling |
Jul. 2, 1996 |
| 5528058 |
IGBT device with platinum lifetime control and reduced gaw |
Jun. 18, 1996 |
| 5528082 |
Thin-film structure with tapered feature |
Jun. 18, 1996 |
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