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Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6114723 |
Flash memory cell using poly to poly tunneling for erase |
Sep. 5, 2000 |
| RE36837 |
Structure of contact between wiring layers in semiconductor integrated circuit device |
Aug. 29, 2000 |
| 6107196 |
Integrated circuit, and method for forming an integrated circuit |
Aug. 22, 2000 |
| 6104062 |
Semiconductor device having reduced effective substrate resistivity and associated methods |
Aug. 15, 2000 |
| 6100588 |
Multiple level conductor wordline strapping scheme |
Aug. 8, 2000 |
| 6097103 |
Semiconductor device having an improved interconnection and method for fabricating the same |
Aug. 1, 2000 |
| 6091149 |
Dissolvable dielectric method and structure |
Jul. 18, 2000 |
| 6081036 |
Semiconductor device |
Jun. 27, 2000 |
| 6081035 |
Microelectronic bond ribbon design |
Jun. 27, 2000 |
| 6072242 |
Contact structure of semiconductor memory device for reducing contact related defect and contact resistance and method for forming the same |
Jun. 6, 2000 |
| 6060771 |
Connecting lead for semiconductor devices and method for fabricating the lead |
May. 9, 2000 |
| 6051889 |
Semiconductor device having a flip-chip structure |
Apr. 18, 2000 |
| 6051885 |
Semiconductor device having a conductor with a wedge shaped depression |
Apr. 18, 2000 |
| 6046504 |
Resin-encapsulated LOC semiconductor device having a thin inner lead |
Apr. 4, 2000 |
| 6037665 |
Mounting assembly of integrated circuit device and method for production thereof |
Mar. 14, 2000 |
| 6031258 |
High DC current stagger power/ground pad |
Feb. 29, 2000 |
| 6028363 |
Vertical via/contact |
Feb. 22, 2000 |
| 6025647 |
Apparatus for equalizing signal parameters in flip chip redistribution layers |
Feb. 15, 2000 |
| 6020644 |
Semiconductor memory device having bit lines and signal wiring layers different in thickness and process of fabricating thereof |
Feb. 1, 2000 |
| 6016012 |
Thin liner layer providing reduced via resistance |
Jan. 18, 2000 |
| 6008541 |
Packaged integrated circuit device |
Dec. 28, 1999 |
| 5989994 |
Method for producing contact structures |
Nov. 23, 1999 |
| 5990561 |
Tungsten plugs for integrated circuits and methods for making same |
Nov. 23, 1999 |
| 5986477 |
Method and system for providing an interconnect layout to reduce delays in logic circuits |
Nov. 16, 1999 |
| 5981379 |
Method of forming via |
Nov. 9, 1999 |
| 5977638 |
Edge metal for interconnect layers |
Nov. 2, 1999 |
| 5973387 |
Tapered isolated metal profile to reduce dielectric layer cracking |
Oct. 26, 1999 |
| 5963831 |
Method of making an interconnect structure employing equivalent resistance paths to improve electromigration resistance |
Oct. 5, 1999 |
| 5962867 |
Abatement of electron beam charging distortion during dimensional measurements of integrated circuit patterns with scanning electron microscopy by the utilization of specially designed test st |
Oct. 5, 1999 |
| 5959360 |
Interconnect structure employing equivalent resistance paths to improve electromigration resistance |
Sep. 28, 1999 |
| 5949651 |
Quad flat pack integrated circuit package |
Sep. 7, 1999 |
| 5939791 |
Electrically conductive interconnects for integrated circuits |
Aug. 17, 1999 |
| 5932491 |
Reduction of contact size utilizing formation of spacer material over resist pattern |
Aug. 3, 1999 |
| 5925927 |
Reinforced thin lead frames and leads |
Jul. 20, 1999 |
| 5923089 |
Efficient routing method and resulting structure for integrated circuits |
Jul. 13, 1999 |
| 5920124 |
Semiconductor device having misalignment resistive interconnect layers |
Jul. 6, 1999 |
| 5912509 |
MOS semiconductor device and method of manufacturing the same |
Jun. 15, 1999 |
| 5905307 |
Semiconductor device incorporating multilayer wiring structure |
May. 18, 1999 |
| 5894170 |
Wiring layer in semiconductor device |
Apr. 13, 1999 |
| 5892286 |
Semiconductor device and manufacturing method thereof |
Apr. 6, 1999 |
| 5883433 |
Semiconductor device having a critical path wiring |
Mar. 16, 1999 |
| 5874780 |
Method of mounting a semiconductor device to a substrate and a mounted structure |
Feb. 23, 1999 |
| 5869902 |
Semiconductor device and manufacturing method thereof |
Feb. 9, 1999 |
| 5867367 |
Quad flat pack integrated circuit package |
Feb. 2, 1999 |
| 5864179 |
Aluminum like metal wiring for semiconductor devices |
Jan. 26, 1999 |
| 5859476 |
Multi-layer wiring structure having narrowed portions at predetermined length intervals |
Jan. 12, 1999 |
| 5854515 |
Integrated circuit having conductors of enhanced cross-sectional area |
Dec. 29, 1998 |
| 5852323 |
Electrically programmable antifuse using metal penetration of a P-N junction |
Dec. 22, 1998 |
| 5849641 |
Methods and apparatus for etching a conductive layer to improve yield |
Dec. 15, 1998 |
| 5847466 |
Semiconductor device and manufacturing method for the same |
Dec. 8, 1998 |
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