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Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Patent Number Title Of Patent Date Issued
6982494 Semiconductor device with signal line having decreased characteristic impedance Jan. 3, 2006
6979643 Interlayer connections for layered electronic devices Dec. 27, 2005
6979898 Semiconductor component and a method of fabricating the semiconductor component Dec. 27, 2005
6977431 Stackable semiconductor package and manufacturing method thereof Dec. 20, 2005
6975031 Semiconductor device and chip carrier Dec. 13, 2005
6972434 Substrate for display, method of manufacturing the same and display having the same Dec. 6, 2005
6967398 Module power distribution network Nov. 22, 2005
6960830 Semiconductor integrated circuit device with dummy bumps Nov. 1, 2005
6955948 Method of manufacturing a component built-in module Oct. 18, 2005
6954001 Semiconductor device including a diffusion layer Oct. 11, 2005
6952053 Metal bond pad for integrated circuits allowing improved probing ability of small pads Oct. 4, 2005
6949816 Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturin Sep. 27, 2005
6949837 Bonding pad arrangement method for semiconductor devices Sep. 27, 2005
6949839 Aligned buried structures formed by surface transformation of empty spaces in solid state materials Sep. 27, 2005
6946737 Robust interlocking via Sep. 20, 2005
6946744 System and method of reducing die attach stress and strain Sep. 20, 2005
6943100 Method of fabricating a wiring board utilizing a conductive member having a reduced thickness Sep. 13, 2005
6943431 Semiconductor device using low-k material as interlayer insulating film and including a surface modifying layer Sep. 13, 2005
6943447 Thin film multi-layer wiring substrate having a coaxial wiring structure in at least one layer Sep. 13, 2005
6940166 Semiconductor device and method for designing the same Sep. 6, 2005
6940170 Techniques for triple and quadruple damascene fabrication Sep. 6, 2005
6936916 Microelectronic assemblies and electronic devices including connection structures with multiple elongated members Aug. 30, 2005
6936925 Semiconductor device having copper lines with reduced electromigration using an electroplated interim copper-zinc alloy film on a copper surface Aug. 30, 2005
6936926 Wiring structure in a semiconductor device Aug. 30, 2005
6936927 Circuit device having a multi-layer conductive path Aug. 30, 2005
6933599 Electromagnetic noise shielding in semiconductor packages using caged interconnect structures Aug. 23, 2005
6933606 Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same Aug. 23, 2005
6933614 Integrated circuit die having a copper contact and method therefor Aug. 23, 2005
6933615 Electronic component device and manufacturing method therefor Aug. 23, 2005
6930377 Using adhesive materials as insulation coatings for leadless lead frame semiconductor packages Aug. 16, 2005
6930395 Circuit substrate having improved connection reliability and a method for manufacturing the same Aug. 16, 2005
6919635 High density microvia substrate with high wireability Jul. 19, 2005
6919637 Interconnect structure for an integrated circuit and method of fabrication Jul. 19, 2005
6919640 Semiconductor device having a contact window including a lower region with a wider width to provide a lower contact resistance Jul. 19, 2005
6919644 Semiconductor device manufacturing method and semiconductor device manufactured thereby Jul. 19, 2005
6917101 Apparatus carrying electronic device Jul. 12, 2005
6917113 Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly Jul. 12, 2005
6909176 Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate Jun. 21, 2005
6906409 Multichip semiconductor package Jun. 14, 2005
6906423 Mask used for exposing a porous substrate Jun. 14, 2005
6906428 Electronic component having a semiconductor chip and method for populating a circuit carrier during the production of the electronic component Jun. 14, 2005
6900512 Light-receiving module May. 31, 2005
6900533 Apparatus for routing electrical signals May. 31, 2005
6900540 Simulating diagonal wiring directions using Manhattan directional wires May. 31, 2005
6900545 Variable thickness pads on a substrate surface May. 31, 2005
6900546 Semiconductor memory device and method for manufacturing the same May. 31, 2005
6892452 Method of forming a projection electrode May. 17, 2005
6894376 Leadless microelectronic package and a method to maximize the die size in the package May. 17, 2005
6888231 Surface mounting semiconductor device May. 3, 2005
6888252 Method of forming a conductive contact May. 3, 2005

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