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Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7608891 |
Thin film transistor, circuit apparatus and liquid crystal display |
Oct. 27, 2009 |
| 7602059 |
Lead pin, circuit, semiconductor device, and method of forming lead pin |
Oct. 13, 2009 |
| 7598615 |
Analytic structure for failure analysis of semiconductor device having a multi-stacked interconnection structure |
Oct. 6, 2009 |
| 7595549 |
Surface mount semiconductor device |
Sep. 29, 2009 |
| 7595265 |
Semiconductor device and method for forming a metal line in the semiconductor device |
Sep. 29, 2009 |
| 7592705 |
Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device |
Sep. 22, 2009 |
| 7592701 |
Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure |
Sep. 22, 2009 |
| 7589019 |
Memory cell array and method of forming a memory cell array |
Sep. 15, 2009 |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| 7582971 |
Semiconductor device and manufacturing method of the same |
Sep. 1, 2009 |
| 7566972 |
Semiconductor device and method for manufacturing the semiconductor device |
Jul. 28, 2009 |
| 7564130 |
Power micro surface-mount device package |
Jul. 21, 2009 |
| 7564695 |
Circuit connection structure and printed circuit board |
Jul. 21, 2009 |
| 7560819 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
Jul. 14, 2009 |
| 7557449 |
Flexible via design to improve reliability |
Jul. 7, 2009 |
| 7557304 |
Printed circuit board having closed vias |
Jul. 7, 2009 |
| RE40819 |
Semiconductor device with improved bond pads |
Jul. 7, 2009 |
| 7550833 |
Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof |
Jun. 23, 2009 |
| 7550855 |
Vertically spaced plural microsprings |
Jun. 23, 2009 |
| 7547974 |
Wiring substrate with improvement in tensile strength of traces |
Jun. 16, 2009 |
| 7541676 |
Fuse-structure |
Jun. 2, 2009 |
| 7540970 |
Methods of fabricating a semiconductor device |
Jun. 2, 2009 |
| 7538417 |
Semiconductor device with signal line having decreased characteristic impedance |
May. 26, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7535108 |
Electronic component including reinforcing member |
May. 19, 2009 |
| 7528491 |
Semiconductor components and assemblies including vias of varying lateral dimensions |
May. 5, 2009 |
| 7525190 |
Printed wiring board with wiring pattern having narrow width portion |
Apr. 28, 2009 |
| 7521804 |
Semiconductor device preventing electrical short and method of manufacturing the same |
Apr. 21, 2009 |
| 7518241 |
Wafer structure with a multi-layer barrier in an UBM layer network device with power supply |
Apr. 14, 2009 |
| 7511351 |
Semiconductor device and method for fabricating the same |
Mar. 31, 2009 |
| 7511349 |
Contact or via hole structure with enlarged bottom critical dimension |
Mar. 31, 2009 |
| 7504724 |
Semiconductor device |
Mar. 17, 2009 |
| 7495327 |
Chip stacking structure |
Feb. 24, 2009 |
| 7495340 |
Metal layer structure of semiconductor device |
Feb. 24, 2009 |
| 7489040 |
Interconnection structure of semiconductor device |
Feb. 10, 2009 |
| 7485952 |
Drop resistant bumpers for fully molded memory cards |
Feb. 3, 2009 |
| 7476974 |
Method to fabricate interconnect structures |
Jan. 13, 2009 |
| 7476965 |
Electronic device with integrated heat distributor |
Jan. 13, 2009 |
| 7473459 |
Method of manufacturing a film printed circuit board |
Jan. 6, 2009 |
| 7462905 |
Nonvolatile semiconductor memory device, semiconductor device and method of manufacturing nonvolatile semiconductor memory device |
Dec. 9, 2008 |
| 7462887 |
Semiconductor connection component |
Dec. 9, 2008 |
| 7459391 |
Semiconductor device and method of fabricating the same |
Dec. 2, 2008 |
| 7453151 |
Methods for lateral current carrying capability improvement in semiconductor devices |
Nov. 18, 2008 |
| 7439623 |
Semiconductor device having via connecting between interconnects |
Oct. 21, 2008 |
| 7432598 |
Semiconductor device |
Oct. 7, 2008 |
| 7425766 |
Film substrate, fabrication method thereof, and image display substrate |
Sep. 16, 2008 |
| 7425470 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
Sep. 16, 2008 |
| 7420211 |
Wiring line and manufacture process thereof, and semiconductor device and manufacturing process thereof |
Sep. 2, 2008 |
| 7417312 |
Use of solder paste for heat dissipation |
Aug. 26, 2008 |
| 7414301 |
Printed circuit board with soldering lands |
Aug. 19, 2008 |
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