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Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459391 |
Semiconductor device and method of fabricating the same |
Dec. 2, 2008 |
| 7453151 |
Methods for lateral current carrying capability improvement in semiconductor devices |
Nov. 18, 2008 |
| 7439623 |
Semiconductor device having via connecting between interconnects |
Oct. 21, 2008 |
| 7432598 |
Semiconductor device |
Oct. 7, 2008 |
| 7425766 |
Film substrate, fabrication method thereof, and image display substrate |
Sep. 16, 2008 |
| 7425470 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
Sep. 16, 2008 |
| 7420211 |
Wiring line and manufacture process thereof, and semiconductor device and manufacturing process thereof |
Sep. 2, 2008 |
| 7417312 |
Use of solder paste for heat dissipation |
Aug. 26, 2008 |
| 7414317 |
BGA package with concave shaped bonding pads |
Aug. 19, 2008 |
| 7414301 |
Printed circuit board with soldering lands |
Aug. 19, 2008 |
| 7411303 |
Semiconductor assembly having substrate with electroplated contact pads |
Aug. 12, 2008 |
| 7411305 |
Interconnect structure encased with high and low k interlevel dielectrics |
Aug. 12, 2008 |
| 7411294 |
Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer |
Aug. 12, 2008 |
| 7400025 |
Integrated circuit inductor with integrated vias |
Jul. 15, 2008 |
| 7397131 |
Self-aligned semiconductor contact structures |
Jul. 8, 2008 |
| 7394164 |
Semiconductor device having bumps in a same row for staggered probing |
Jul. 1, 2008 |
| 7388279 |
Tapered dielectric and conductor structures and applications thereof |
Jun. 17, 2008 |
| 7378748 |
Solid-state imaging device and method for manufacturing the same |
May. 27, 2008 |
| 7372163 |
Semiconductor device and production method therefor |
May. 13, 2008 |
| 7372152 |
Copper interconnect systems |
May. 13, 2008 |
| 7365001 |
Interconnect structures and methods of making thereof |
Apr. 29, 2008 |
| 7361994 |
System to control signal line capacitance |
Apr. 22, 2008 |
| 7361552 |
Semiconductor integrated circuit including a DRAM and an analog circuit |
Apr. 22, 2008 |
| 7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
Apr. 22, 2008 |
| 7358613 |
Semiconductor device and method of manufacturing the same |
Apr. 15, 2008 |
| 7352059 |
Low loss interconnect structure for use in microelectronic circuits |
Apr. 1, 2008 |
| 7348679 |
Electronic part having reinforcing member |
Mar. 25, 2008 |
| 7345368 |
Semiconductor device and the manufacturing method for the same |
Mar. 18, 2008 |
| 7339274 |
Metallization performance in electronic devices |
Mar. 4, 2008 |
| 7335991 |
Pattern forming structure, pattern forming method, device, electro-optical device, and electronic apparatus |
Feb. 26, 2008 |
| 7332805 |
Electronic package with improved current carrying capability and method of forming the same |
Feb. 19, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7317208 |
Semiconductor device with contact structure and manufacturing method thereof |
Jan. 8, 2008 |
| 7317254 |
Semiconductor device mounting structure for reducing thermal stress and warpage |
Jan. 8, 2008 |
| 7315083 |
Circuit device and manufacturing method thereof |
Jan. 1, 2008 |
| 7312530 |
Semiconductor device with multilayered metal pattern |
Dec. 25, 2007 |
| 7304390 |
Anisotropic conductive sheet and manufacture thereof |
Dec. 4, 2007 |
| 7301241 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 27, 2007 |
| 7294934 |
Low-K dielectric structure and method |
Nov. 13, 2007 |
| 7291915 |
Circuit board and method of manufacturing the same |
Nov. 6, 2007 |
| 7291923 |
Tapered signal lines |
Nov. 6, 2007 |
| 7288729 |
Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
Oct. 30, 2007 |
| 7287325 |
Method of forming interconnect structure or interconnect and via structures using post chemical mechanical polishing |
Oct. 30, 2007 |
| 7288792 |
Method of manufacturing semiconductor device, method of manufacturing electronic apparatus, semiconductor device, and electronic apparatus |
Oct. 30, 2007 |
| 7285734 |
Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
Oct. 23, 2007 |
| 7268434 |
Semiconductor device and method of manufacturing the same |
Sep. 11, 2007 |
| 7265436 |
Non-repeated and non-uniform width seal ring structure |
Sep. 4, 2007 |
| 7265449 |
Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package |
Sep. 4, 2007 |
| 7262505 |
Selective electroless-plated copper metallization |
Aug. 28, 2007 |
| 7253528 |
Trace design to minimize electromigration damage to solder bumps |
Aug. 7, 2007 |
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