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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/775
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Varying width or thickness of conductor
Description: Subject matter wherein an electrical contact or lead has a width or thickness which varies over the length of the contact or lead.


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Patent Number Title Of Patent Date Issued
7608891 Thin film transistor, circuit apparatus and liquid crystal display Oct. 27, 2009
7602059 Lead pin, circuit, semiconductor device, and method of forming lead pin Oct. 13, 2009
7598615 Analytic structure for failure analysis of semiconductor device having a multi-stacked interconnection structure Oct. 6, 2009
7595549 Surface mount semiconductor device Sep. 29, 2009
7595265 Semiconductor device and method for forming a metal line in the semiconductor device Sep. 29, 2009
7592705 Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device Sep. 22, 2009
7592701 Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure Sep. 22, 2009
7589019 Memory cell array and method of forming a memory cell array Sep. 15, 2009
7586180 Semiconductor packaging device comprising a semiconductor chip including a MOSFET Sep. 8, 2009
7582971 Semiconductor device and manufacturing method of the same Sep. 1, 2009
7566972 Semiconductor device and method for manufacturing the semiconductor device Jul. 28, 2009
7564130 Power micro surface-mount device package Jul. 21, 2009
7564695 Circuit connection structure and printed circuit board Jul. 21, 2009
7560819 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument Jul. 14, 2009
7557449 Flexible via design to improve reliability Jul. 7, 2009
7557304 Printed circuit board having closed vias Jul. 7, 2009
RE40819 Semiconductor device with improved bond pads Jul. 7, 2009
7550833 Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof Jun. 23, 2009
7550855 Vertically spaced plural microsprings Jun. 23, 2009
7547974 Wiring substrate with improvement in tensile strength of traces Jun. 16, 2009
7541676 Fuse-structure Jun. 2, 2009
7540970 Methods of fabricating a semiconductor device Jun. 2, 2009
7538417 Semiconductor device with signal line having decreased characteristic impedance May. 26, 2009
7535085 Semiconductor package having improved adhesiveness and ground bonding May. 19, 2009
7535108 Electronic component including reinforcing member May. 19, 2009
7528491 Semiconductor components and assemblies including vias of varying lateral dimensions May. 5, 2009
7525190 Printed wiring board with wiring pattern having narrow width portion Apr. 28, 2009
7521804 Semiconductor device preventing electrical short and method of manufacturing the same Apr. 21, 2009
7518241 Wafer structure with a multi-layer barrier in an UBM layer network device with power supply Apr. 14, 2009
7511351 Semiconductor device and method for fabricating the same Mar. 31, 2009
7511349 Contact or via hole structure with enlarged bottom critical dimension Mar. 31, 2009
7504724 Semiconductor device Mar. 17, 2009
7495327 Chip stacking structure Feb. 24, 2009
7495340 Metal layer structure of semiconductor device Feb. 24, 2009
7489040 Interconnection structure of semiconductor device Feb. 10, 2009
7485952 Drop resistant bumpers for fully molded memory cards Feb. 3, 2009
7476974 Method to fabricate interconnect structures Jan. 13, 2009
7476965 Electronic device with integrated heat distributor Jan. 13, 2009
7473459 Method of manufacturing a film printed circuit board Jan. 6, 2009
7462905 Nonvolatile semiconductor memory device, semiconductor device and method of manufacturing nonvolatile semiconductor memory device Dec. 9, 2008
7462887 Semiconductor connection component Dec. 9, 2008
7459391 Semiconductor device and method of fabricating the same Dec. 2, 2008
7453151 Methods for lateral current carrying capability improvement in semiconductor devices Nov. 18, 2008
7439623 Semiconductor device having via connecting between interconnects Oct. 21, 2008
7432598 Semiconductor device Oct. 7, 2008
7425766 Film substrate, fabrication method thereof, and image display substrate Sep. 16, 2008
7425470 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths Sep. 16, 2008
7420211 Wiring line and manufacture process thereof, and semiconductor device and manufacturing process thereof Sep. 2, 2008
7417312 Use of solder paste for heat dissipation Aug. 26, 2008
7414301 Printed circuit board with soldering lands Aug. 19, 2008

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