| |
 |
|
Class Information
Number: 257/774
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Via (interconnection hole) shape
Description: Subject matter wherein the shape or configuration of an electrical contact or lead is determined by the shape of a hole through an insulating layer through which the contact extends.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7282648 |
Capacitor-embedded PCB having blind via hole and method of manufacturing the same |
Oct. 16, 2007 |
| 7279788 |
Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
Oct. 9, 2007 |
| 7279776 |
Method of manufacturing semiconductor device and semiconductor device |
Oct. 9, 2007 |
| 7279771 |
Wiring board mounting a capacitor |
Oct. 9, 2007 |
| 7279750 |
Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion |
Oct. 9, 2007 |
| 7276799 |
Chip stack package and manufacturing method thereof |
Oct. 2, 2007 |
| 7276797 |
Structure and method for fabricating a bond pad structure |
Oct. 2, 2007 |
| 7276794 |
Junction-isolated vias |
Oct. 2, 2007 |
| 7276787 |
Silicon chip carrier with conductive through-vias and method for fabricating same |
Oct. 2, 2007 |
| 7276786 |
Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip packages are mounted |
Oct. 2, 2007 |
| 7274105 |
Thermal conductive electronics substrate and assembly |
Sep. 25, 2007 |
| 7274104 |
Semiconductor device having an interconnect that increases in impurity concentration as width increases |
Sep. 25, 2007 |
| 7274101 |
Semiconductor package and method for manufacturing the same |
Sep. 25, 2007 |
| 7271499 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
Sep. 18, 2007 |
| 7271495 |
Chip bond layout for chip carrier for flip chip applications |
Sep. 18, 2007 |
| 7271491 |
Carrier for wafer-scale package and wafer-scale package including the carrier |
Sep. 18, 2007 |
| 7271489 |
Post passivation interconnection schemes on top of the IC chips |
Sep. 18, 2007 |
| 7271487 |
Semiconductor device and method of manufacturing the same |
Sep. 18, 2007 |
| 7268434 |
Semiconductor device and method of manufacturing the same |
Sep. 11, 2007 |
| 7268433 |
Semiconductor device |
Sep. 11, 2007 |
| 7268432 |
Interconnect structures with engineered dielectrics with nanocolumnar porosity |
Sep. 11, 2007 |
| 7268420 |
Semiconductor device having layered chips |
Sep. 11, 2007 |
| 7268408 |
Wiring board, method for manufacturing wiring board and electronic component using wiring board |
Sep. 11, 2007 |
| 7268069 |
Method of fabricating semiconductor device having multilayer wiring structure |
Sep. 11, 2007 |
| 7265450 |
Semiconductor device and method for fabricating the same |
Sep. 4, 2007 |
| 7265448 |
Interconnect structure for power transistors |
Sep. 4, 2007 |
| 7262505 |
Selective electroless-plated copper metallization |
Aug. 28, 2007 |
| 7262500 |
Interconnection structure |
Aug. 28, 2007 |
| 7262128 |
Method of forming multilayer interconnection structure, and manufacturing method for multilayer wiring boards |
Aug. 28, 2007 |
| 7259464 |
Vertical twist scheme for high-density DRAMs |
Aug. 21, 2007 |
| 7256502 |
Metal interconnections for semiconductor devices including a buffer layer on a trench sidewall |
Aug. 14, 2007 |
| 7256497 |
Semiconductor device with a barrier layer and a metal layer |
Aug. 14, 2007 |
| 7256496 |
Semiconductor device having adhesion increasing film to prevent peeling |
Aug. 14, 2007 |
| 7256070 |
Substrate-based housing component with a semiconductor chip |
Aug. 14, 2007 |
| 7253527 |
Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device |
Aug. 7, 2007 |
| 7253526 |
Semiconductor packaging substrate and method of producing the same |
Aug. 7, 2007 |
| 7253525 |
Semiconductor device including contact holes between adjacent conductor patterns and method for fabricating the same |
Aug. 7, 2007 |
| 7253520 |
CSP semiconductor device having signal and radiation bump groups |
Aug. 7, 2007 |
| 7253519 |
Chip packaging structure having redistribution layer with recess |
Aug. 7, 2007 |
| 7250683 |
Method to solve via poisoning for porous low-k dielectric |
Jul. 31, 2007 |
| 7250681 |
Semiconductor device and a method of manufacturing the semiconductor device |
Jul. 31, 2007 |
| 7250679 |
Semiconductor device and method for fabricating the same |
Jul. 31, 2007 |
| 7250327 |
Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism |
Jul. 31, 2007 |
| 7247948 |
Semiconductor device and method for fabricating the semiconductor device |
Jul. 24, 2007 |
| 7247943 |
Integrated circuit with at least one bump |
Jul. 24, 2007 |
| 7247939 |
Metal filled semiconductor features with improved structural stability |
Jul. 24, 2007 |
| 7247897 |
Conductive line for a semiconductor device using a carbon nanotube including a memory thin film and semiconductor device manufactured |
Jul. 24, 2007 |
| 7245022 |
Semiconductor module with improved interposer structure and method for forming the same |
Jul. 17, 2007 |
| 7245019 |
Semiconductor device with improved wiring arrangement utilizing a projecting portion and a method of manufacturing the same |
Jul. 17, 2007 |
| 7242102 |
Bond pad structure for copper metallization having increased reliability and method for fabricating same |
Jul. 10, 2007 |
|
|
|
