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Class Information
Number: 257/774
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Via (interconnection hole) shape
Description: Subject matter wherein the shape or configuration of an electrical contact or lead is determined by the shape of a hole through an insulating layer through which the contact extends.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7335592 |
Wafer level package, multi-package stack, and method of manufacturing the same |
Feb. 26, 2008 |
| 7332812 |
Memory card with connecting portions for connection to an adapter |
Feb. 19, 2008 |
| 7332805 |
Electronic package with improved current carrying capability and method of forming the same |
Feb. 19, 2008 |
| 7332449 |
Method for forming dual damascenes with supercritical fluid treatments |
Feb. 19, 2008 |
| 7329953 |
Structure for reducing leakage currents and high contact resistance for embedded memory and method for making same |
Feb. 12, 2008 |
| 7327022 |
Assembly, contact and coupling interconnection for optoelectronics |
Feb. 5, 2008 |
| 7326907 |
Wiring substrate and radiation detector using same |
Feb. 5, 2008 |
| 7323785 |
Semiconductor device |
Jan. 29, 2008 |
| 7323784 |
Top via pattern for bond pad structure |
Jan. 29, 2008 |
| 7323781 |
Semiconductor device and manufacturing method thereof |
Jan. 29, 2008 |
| 7321171 |
Semiconductor integrated circuit device |
Jan. 22, 2008 |
| 7321164 |
Stack structure with semiconductor chip embedded in carrier |
Jan. 22, 2008 |
| 7319274 |
Methods for selective integration of airgaps and devices made by such methods |
Jan. 15, 2008 |
| 7319273 |
Methods and apparatus for a flexible circuit interposer |
Jan. 15, 2008 |
| 7319270 |
Multi-layer electrode and method of forming the same |
Jan. 15, 2008 |
| 7319269 |
Semiconductor device power interconnect striping |
Jan. 15, 2008 |
| 7319049 |
Method of manufacturing an electronic parts packaging structure |
Jan. 15, 2008 |
| 7317255 |
Reliable printed wiring board assembly employing packages with solder joints |
Jan. 8, 2008 |
| 7317208 |
Semiconductor device with contact structure and manufacturing method thereof |
Jan. 8, 2008 |
| 7317201 |
Method of producing a microelectronic electrode structure, and microelectronic electrode structure |
Jan. 8, 2008 |
| 7315084 |
Copper interconnection and the method for fabricating the same |
Jan. 1, 2008 |
| 7315072 |
Semiconductor device capable of suppressing current concentration in pad and its manufacture method |
Jan. 1, 2008 |
| 7312532 |
Dual damascene interconnect structure with improved electro migration lifetimes |
Dec. 25, 2007 |
| 7312530 |
Semiconductor device with multilayered metal pattern |
Dec. 25, 2007 |
| 7312523 |
Enhanced via structure for organic module performance |
Dec. 25, 2007 |
| 7309922 |
Lower substrate, display apparatus having the same and method of manufacturing the same |
Dec. 18, 2007 |
| 7309921 |
Semiconductor device |
Dec. 18, 2007 |
| 7309917 |
Multilayer board and a semiconductor device |
Dec. 18, 2007 |
| 7307348 |
Semiconductor components having through wire interconnects (TWI) |
Dec. 11, 2007 |
| 7304390 |
Anisotropic conductive sheet and manufacture thereof |
Dec. 4, 2007 |
| 7304389 |
Semiconductor device and supporting plate |
Dec. 4, 2007 |
| 7303987 |
Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same |
Dec. 4, 2007 |
| 7301241 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 27, 2007 |
| 7301240 |
Semiconductor device |
Nov. 27, 2007 |
| 7301237 |
Semiconductor device |
Nov. 27, 2007 |
| 7301236 |
Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy via |
Nov. 27, 2007 |
| 7300860 |
Integrated circuit with metal layer having carbon nanotubes and methods of making same |
Nov. 27, 2007 |
| 7298050 |
Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same |
Nov. 20, 2007 |
| 7297998 |
Semiconductor devices having a buried and enlarged contact hole and methods of fabricating the same |
Nov. 20, 2007 |
| 7294935 |
Integrated circuits protected against reverse engineering and method for fabricating the same using an apparent metal contact line terminating on field oxide |
Nov. 13, 2007 |
| 7294921 |
System-on-a-chip with multi-layered metallized through-hole interconnection |
Nov. 13, 2007 |
| 7294907 |
Solid-state imaging device and method for manufacturing the same |
Nov. 13, 2007 |
| 7291922 |
Substrate with many via contact means disposed therein |
Nov. 6, 2007 |
| 7291916 |
Signal transmission structure and circuit substrate thereof |
Nov. 6, 2007 |
| 7291908 |
Quad flat no-lead package structure and manufacturing method thereof |
Nov. 6, 2007 |
| 7291904 |
Downsized package for electric wave device |
Nov. 6, 2007 |
| 7291875 |
Semiconductor device with double barrier film |
Nov. 6, 2007 |
| 7288847 |
Assembly including a circuit and an encapsulation frame, and method of making the same |
Oct. 30, 2007 |
| 7288792 |
Method of manufacturing semiconductor device, method of manufacturing electronic apparatus, semiconductor device, and electronic apparatus |
Oct. 30, 2007 |
| 7288464 |
MEMS packaging structure and methods |
Oct. 30, 2007 |
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