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Class Information
Number: 257/774
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Via (interconnection hole) shape
Description: Subject matter wherein the shape or configuration of an electrical contact or lead is determined by the shape of a hole through an insulating layer through which the contact extends.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7365436 |
Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same |
Apr. 29, 2008 |
| 7365435 |
Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid |
Apr. 29, 2008 |
| 7365434 |
Semiconductor device and manufacturing method for the same |
Apr. 29, 2008 |
| 7365433 |
High-frequency semiconductor device and method of manufacturing the same |
Apr. 29, 2008 |
| 7365421 |
IC chip package with isolated vias |
Apr. 29, 2008 |
| 7365413 |
Reduced power distribution mesh resistance using a modified swiss-cheese slotting pattern |
Apr. 29, 2008 |
| 7365001 |
Interconnect structures and methods of making thereof |
Apr. 29, 2008 |
| 7361994 |
System to control signal line capacitance |
Apr. 22, 2008 |
| 7361992 |
Semiconductor device including interconnects formed by damascene process and manufacturing method thereof |
Apr. 22, 2008 |
| 7361991 |
Closed air gap interconnect structure |
Apr. 22, 2008 |
| 7361989 |
Stacked imager package |
Apr. 22, 2008 |
| 7358613 |
Semiconductor device and method of manufacturing the same |
Apr. 15, 2008 |
| 7358612 |
Plasma treatment at film layer to reduce sheet resistance and to improve via contact resistance |
Apr. 15, 2008 |
| 7358602 |
Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer |
Apr. 15, 2008 |
| 7358170 |
Methods of forming conductive interconnects, and methods of depositing nickel |
Apr. 15, 2008 |
| 7355290 |
Interposer and method for fabricating the same |
Apr. 8, 2008 |
| 7355267 |
Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements |
Apr. 8, 2008 |
| 7355265 |
Semiconductor integrated circuit |
Apr. 8, 2008 |
| 7352066 |
Silicon based optical vias |
Apr. 1, 2008 |
| 7352061 |
Flexible core for enhancement of package interconnect reliability |
Apr. 1, 2008 |
| 7352060 |
Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate |
Apr. 1, 2008 |
| 7352053 |
Insulating layer having decreased dielectric constant and increased hardness |
Apr. 1, 2008 |
| 7352052 |
Semiconductor device and manufacturing method therefor |
Apr. 1, 2008 |
| 7348679 |
Electronic part having reinforcing member |
Mar. 25, 2008 |
| 7348677 |
Method of providing printed circuit board with conductive holes and board resulting therefrom |
Mar. 25, 2008 |
| 7348676 |
Semiconductor device having a metal wiring structure |
Mar. 25, 2008 |
| 7348675 |
Microcircuit fabrication and interconnection |
Mar. 25, 2008 |
| 7348672 |
Interconnects with improved reliability |
Mar. 25, 2008 |
| 7345365 |
Electronic component with die and passive device |
Mar. 18, 2008 |
| 7345352 |
Insulating tube, semiconductor device employing the tube, and method of manufacturing the same |
Mar. 18, 2008 |
| 7342317 |
Low coefficient of thermal expansion build-up layer packaging and method thereof |
Mar. 11, 2008 |
| 7342301 |
Connection device with actuating element for changing a conductive state of a via |
Mar. 11, 2008 |
| 7341938 |
Single mask via method and device |
Mar. 11, 2008 |
| 7339273 |
Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode |
Mar. 4, 2008 |
| 7339272 |
Semiconductor device with scattering bars adjacent conductive lines |
Mar. 4, 2008 |
| 7339271 |
Metal-metal oxide etch stop/barrier for integrated circuit interconnects |
Mar. 4, 2008 |
| 7339260 |
Wiring board providing impedance matching |
Mar. 4, 2008 |
| 7339256 |
Semiconductor device |
Mar. 4, 2008 |
| 7335989 |
Semiconductor device and production method therefor |
Feb. 26, 2008 |
| 7335972 |
Heterogeneously integrated microsystem-on-a-chip |
Feb. 26, 2008 |
| 7335970 |
Semiconductor device having a chip-size package |
Feb. 26, 2008 |
| 7335592 |
Wafer level package, multi-package stack, and method of manufacturing the same |
Feb. 26, 2008 |
| 7332812 |
Memory card with connecting portions for connection to an adapter |
Feb. 19, 2008 |
| 7332805 |
Electronic package with improved current carrying capability and method of forming the same |
Feb. 19, 2008 |
| 7332449 |
Method for forming dual damascenes with supercritical fluid treatments |
Feb. 19, 2008 |
| 7329953 |
Structure for reducing leakage currents and high contact resistance for embedded memory and method for making same |
Feb. 12, 2008 |
| 7327022 |
Assembly, contact and coupling interconnection for optoelectronics |
Feb. 5, 2008 |
| 7326907 |
Wiring substrate and radiation detector using same |
Feb. 5, 2008 |
| 7323785 |
Semiconductor device |
Jan. 29, 2008 |
| 7323784 |
Top via pattern for bond pad structure |
Jan. 29, 2008 |
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