| |
 |
|
Class Information
Number: 257/774
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Via (interconnection hole) shape
Description: Subject matter wherein the shape or configuration of an electrical contact or lead is determined by the shape of a hole through an insulating layer through which the contact extends.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7564136 |
Integration scheme for Cu/low-k interconnects |
Jul. 21, 2009 |
| 7564135 |
Semiconductor device having self-aligned contact and method of fabricating the same |
Jul. 21, 2009 |
| 7564118 |
Chip and wafer integration process using vertical connections |
Jul. 21, 2009 |
| 7564115 |
Tapered through-silicon via structure |
Jul. 21, 2009 |
| 7560814 |
Semiconductor device that improves electrical connection reliability |
Jul. 14, 2009 |
| 7560802 |
Electrical connections in substrates |
Jul. 14, 2009 |
| 7560744 |
Package optical chip with conductive pillars |
Jul. 14, 2009 |
| 7557450 |
Wiring substrate and electronic parts packaging structure |
Jul. 7, 2009 |
| 7557449 |
Flexible via design to improve reliability |
Jul. 7, 2009 |
| 7557444 |
Power-via structure for integration in advanced logic/smart-power technologies |
Jul. 7, 2009 |
| 7557436 |
Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes |
Jul. 7, 2009 |
| 7557304 |
Printed circuit board having closed vias |
Jul. 7, 2009 |
| 7554198 |
Flexible joint methodology to attach a die on an organic substrate |
Jun. 30, 2009 |
| 7554193 |
Semiconductor device |
Jun. 30, 2009 |
| 7554189 |
Wireless communication module |
Jun. 30, 2009 |
| 7554185 |
Flip chip and wire bond semiconductor package |
Jun. 30, 2009 |
| 7554184 |
Image sensor chip package |
Jun. 30, 2009 |
| 7553764 |
Silicon wafer having through-wafer vias |
Jun. 30, 2009 |
| 7553757 |
Semiconductor device and method of manufacturing the same |
Jun. 30, 2009 |
| 7553703 |
Methods of forming an interconnect structure |
Jun. 30, 2009 |
| 7553699 |
Method of fabricating microelectronic devices |
Jun. 30, 2009 |
| 7550853 |
Electrical isolation of monolithic circuits using a conductive through-hole in the substrate |
Jun. 23, 2009 |
| 7550849 |
Conductive structures including titanium-tungsten base layers |
Jun. 23, 2009 |
| 7550835 |
Chip stack package utilizing a dummy pattern die between stacked chips for reducing package size |
Jun. 23, 2009 |
| 7550321 |
Substrate having a functionally gradient coefficient of thermal expansion |
Jun. 23, 2009 |
| 7547929 |
Semiconductor HBT MMIC device and semiconductor module |
Jun. 16, 2009 |
| 7547630 |
Method for stacking semiconductor chips |
Jun. 16, 2009 |
| 7545047 |
Semiconductor device with a wiring substrate and method for producing the same |
Jun. 9, 2009 |
| 7545046 |
Semiconductor devices having a trench in a side portion of a conducting line pattern and methods of forming the same |
Jun. 9, 2009 |
| 7545045 |
Dummy via for reducing proximity effect and method of using the same |
Jun. 9, 2009 |
| 7545044 |
Semiconductor device and radiation detector employing it |
Jun. 9, 2009 |
| 7545039 |
Structure for reducing stress for vias and fabricating method thereof |
Jun. 9, 2009 |
| 7545035 |
Semiconductor device having several assembled integrated-circuit chips and method of assembling and electrically connecting the integrated-circuit chips |
Jun. 9, 2009 |
| 7538434 |
Copper interconnection with conductive polymer layer and method of forming the same |
May. 26, 2009 |
| 7538433 |
Semiconductor device |
May. 26, 2009 |
| 7538424 |
System and method for dissipating heat from a semiconductor module |
May. 26, 2009 |
| 7538413 |
Semiconductor components having through interconnects |
May. 26, 2009 |
| 7537959 |
Chip stack package and manufacturing method thereof |
May. 26, 2009 |
| 7535108 |
Electronic component including reinforcing member |
May. 19, 2009 |
| 7535107 |
Tiled construction of layered materials |
May. 19, 2009 |
| 7535096 |
Glass substrate and capacitance-type pressure sensor using the same |
May. 19, 2009 |
| 7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure |
May. 19, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7534722 |
Back-to-front via process |
May. 19, 2009 |
| 7531906 |
Flip chip packaging using recessed interposer terminals |
May. 12, 2009 |
| 7531876 |
Semiconductor device having power semiconductor elements |
May. 12, 2009 |
| 7531785 |
Circuit device and method of manufacturing the same |
May. 12, 2009 |
| 7531455 |
Method for forming storage node contact in semiconductor device using nitride-based hard mask |
May. 12, 2009 |
| 7528493 |
Interconnect structure and method of fabrication of same |
May. 5, 2009 |
| 7528492 |
Test patterns for detecting misalignment of through-wafer vias |
May. 5, 2009 |
|
|
|
