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Class Information
Number: 257/774
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Via (interconnection hole) shape
Description: Subject matter wherein the shape or configuration of an electrical contact or lead is determined by the shape of a hole through an insulating layer through which the contact extends.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6913950 |
Semiconductor device with chamfered substrate and method of making the same |
Jul. 5, 2005 |
| 6909128 |
Capacitance reduction by tunnel formation for use with a semiconductor device |
Jun. 21, 2005 |
| 6909174 |
Reference plane of integrated circuit packages |
Jun. 21, 2005 |
| 6909189 |
Semiconductor device with dummy structure |
Jun. 21, 2005 |
| 6909190 |
Dual-damascene dielectric structures |
Jun. 21, 2005 |
| 6909194 |
Electronic assembly having semiconductor component with polymer support member and method of fabrication |
Jun. 21, 2005 |
| 6909195 |
Trench etch process for low-k dielectrics |
Jun. 21, 2005 |
| 6909196 |
Method and structures for reduced parasitic capacitance in integrated circuit metallizations |
Jun. 21, 2005 |
| 6906419 |
Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same |
Jun. 14, 2005 |
| 6903431 |
Substrate method and apparatus |
Jun. 7, 2005 |
| 6903442 |
Semiconductor component having backside pin contacts |
Jun. 7, 2005 |
| 6903443 |
Semiconductor component and interconnect having conductive members and contacts on opposing sides |
Jun. 7, 2005 |
| 6900532 |
Wafer level chip scale package |
May. 31, 2005 |
| 6900533 |
Apparatus for routing electrical signals |
May. 31, 2005 |
| 6900534 |
Direct attach chip scale package |
May. 31, 2005 |
| 6900546 |
Semiconductor memory device and method for manufacturing the same |
May. 31, 2005 |
| 6900548 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
May. 31, 2005 |
| 6897476 |
Test structure for determining electromigration and interlayer dielectric failure |
May. 24, 2005 |
| 6897479 |
ITO film contact structure, TFT substrate and manufacture thereof |
May. 24, 2005 |
| 6897555 |
Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die |
May. 24, 2005 |
| 6897557 |
Integrated electrical connector |
May. 24, 2005 |
| 6897561 |
Semiconductor power device having a diamond shaped metal interconnect scheme |
May. 24, 2005 |
| 6897563 |
Current crowding reduction technique using selective current injection |
May. 24, 2005 |
| 6897564 |
Plasma display panel having trench discharge cells with one or more electrodes formed therein and extended to outside of the trench |
May. 24, 2005 |
| 6894378 |
Electronic component with stacked semiconductor chips |
May. 17, 2005 |
| 6894392 |
Scaleable integrated data processing device |
May. 17, 2005 |
| 6894394 |
Semiconductor device, circuit board, electronic apparatus, and method for manufacturing semiconductor device |
May. 17, 2005 |
| 6891239 |
Integrated sensor and electronics package |
May. 10, 2005 |
| 6891258 |
Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit |
May. 10, 2005 |
| 6891260 |
Integrated circuit package substrate with high density routing mechanism |
May. 10, 2005 |
| 6891269 |
Embedded electroconductive layer structure |
May. 10, 2005 |
| 6891272 |
Multi-path via interconnection structures and methods for manufacturing the same |
May. 10, 2005 |
| 6887802 |
Method of manufacturing semiconductor device and semiconductor device |
May. 3, 2005 |
| 6888224 |
Methods and systems for fabricating electrical connections to semiconductor structures incorporating low-k dielectric materials |
May. 3, 2005 |
| 6888230 |
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device |
May. 3, 2005 |
| 6888243 |
Semiconductor device |
May. 3, 2005 |
| 6888245 |
Semiconductor device |
May. 3, 2005 |
| 6888247 |
Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same |
May. 3, 2005 |
| 6888251 |
Metal spacer in single and dual damascene processing |
May. 3, 2005 |
| 6888252 |
Method of forming a conductive contact |
May. 3, 2005 |
| 6888253 |
Inexpensive wafer level MMIC chip packaging |
May. 3, 2005 |
| 6884650 |
Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same |
Apr. 26, 2005 |
| 6884944 |
Multi-layer printed wiring boards having blind vias |
Apr. 26, 2005 |
| 6885098 |
Routing for multilayer ceramic substrates to reduce excessive via depth |
Apr. 26, 2005 |
| 6885102 |
Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts |
Apr. 26, 2005 |
| 6885105 |
Semiconductor device with copper wirings |
Apr. 26, 2005 |
| 6885109 |
Semiconductor device having a step-like section on the back side of the substrate, and method for manufacturing the same |
Apr. 26, 2005 |
| 6881974 |
Probe card for testing microelectronic components |
Apr. 19, 2005 |
| 6882038 |
Plating tail design for IC packages |
Apr. 19, 2005 |
| 6882041 |
Thermally enhanced metal capped BGA package |
Apr. 19, 2005 |
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