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Class Information
Number: 257/774
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Via (interconnection hole) shape
Description: Subject matter wherein the shape or configuration of an electrical contact or lead is determined by the shape of a hole through an insulating layer through which the contact extends.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619311 |
Memory cell device with coplanar electrode surface and method |
Nov. 17, 2009 |
| 7615487 |
Power delivery package having through wafer vias |
Nov. 10, 2009 |
| 7614141 |
Fabricating substrates having low inductance via arrangements |
Nov. 10, 2009 |
| 7612454 |
Semiconductor device with improved contact fuse |
Nov. 3, 2009 |
| 7612451 |
Reducing resistivity in interconnect structures by forming an inter-layer |
Nov. 3, 2009 |
| 7605475 |
Semiconductor device |
Oct. 20, 2009 |
| 7605458 |
Method and apparatus for integrating capacitors in stacked integrated circuits |
Oct. 20, 2009 |
| 7605085 |
Method of manufacturing interconnecting structure with vias |
Oct. 20, 2009 |
| 7605080 |
Semiconductor device and method of manufacturing the same |
Oct. 20, 2009 |
| 7602064 |
Semiconductor device having an inspection hole striding a boundary |
Oct. 13, 2009 |
| 7602055 |
Semiconductor device and method for fabricating the same |
Oct. 13, 2009 |
| 7598617 |
Stack package utilizing through vias and re-distribution lines |
Oct. 6, 2009 |
| 7598616 |
Interconnect structure |
Oct. 6, 2009 |
| 7595559 |
Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip |
Sep. 29, 2009 |
| 7595558 |
Semiconductor device and method of manufacturing the same |
Sep. 29, 2009 |
| 7595557 |
Semiconductor device and manufacturing method thereof |
Sep. 29, 2009 |
| 7595556 |
Semiconductor device and method for manufacturing the same |
Sep. 29, 2009 |
| 7595554 |
Interconnect structure with dielectric air gaps |
Sep. 29, 2009 |
| 7595549 |
Surface mount semiconductor device |
Sep. 29, 2009 |
| 7592704 |
Etched interposer for integrated circuit devices |
Sep. 22, 2009 |
| 7592703 |
RF and MMIC stackable micro-modules |
Sep. 22, 2009 |
| 7592700 |
Semiconductor chip and method of manufacturing semiconductor chip |
Sep. 22, 2009 |
| 7589425 |
Method of manufacturing a semiconductor device having damascene structures with air gaps |
Sep. 15, 2009 |
| 7589424 |
Thin silicon based substrate |
Sep. 15, 2009 |
| 7589411 |
Device for electrical connection of an integrated circuit chip |
Sep. 15, 2009 |
| 7589410 |
Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package |
Sep. 15, 2009 |
| 7589394 |
Interposer |
Sep. 15, 2009 |
| 7589390 |
Shielded through-via |
Sep. 15, 2009 |
| 7589379 |
Power semiconductor and method of fabrication |
Sep. 15, 2009 |
| 7589011 |
Semiconductor device and method of forming intermetal dielectric layer |
Sep. 15, 2009 |
| 7586196 |
Apparatus for an improved air gap interconnect structure |
Sep. 8, 2009 |
| 7582972 |
Semiconductor device and fabrication method thereof |
Sep. 1, 2009 |
| 7582971 |
Semiconductor device and manufacturing method of the same |
Sep. 1, 2009 |
| 7582959 |
Driver module structure with flexible circuit board |
Sep. 1, 2009 |
| 7579685 |
Wafer level packaging cap and fabrication method thereof |
Aug. 25, 2009 |
| 7576435 |
Low-cost and ultra-fine integrated circuit packaging technique |
Aug. 18, 2009 |
| 7576433 |
Semiconductor memory device and manufacturing method thereof |
Aug. 18, 2009 |
| 7576421 |
Semiconductor device having a multi-layered semiconductor substrate |
Aug. 18, 2009 |
| 7576401 |
Direct glass attached on die optical module |
Aug. 18, 2009 |
| 7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Aug. 11, 2009 |
| 7573116 |
Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device |
Aug. 11, 2009 |
| 7572730 |
Method of manufacturing wiring substrate, liquid ejection head and image forming apparatus |
Aug. 11, 2009 |
| 7569486 |
Spin on glass (SOG) etch improvement method |
Aug. 4, 2009 |
| 7566976 |
Semiconductor device and method for fabricating the same |
Jul. 28, 2009 |
| 7566973 |
Semiconductor device and method of manufacturing the same |
Jul. 28, 2009 |
| 7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate |
Jul. 28, 2009 |
| 7564137 |
Stackable integrated circuit structures and systems devices and methods related thereto |
Jul. 21, 2009 |
| 7564136 |
Integration scheme for Cu/low-k interconnects |
Jul. 21, 2009 |
| 7564135 |
Semiconductor device having self-aligned contact and method of fabricating the same |
Jul. 21, 2009 |
| 7564118 |
Chip and wafer integration process using vertical connections |
Jul. 21, 2009 |
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