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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7262473 |
Metal to polysilicon contact in oxygen environment |
Aug. 28, 2007 |
| 7259459 |
Semiconductor module and DC-DC converter |
Aug. 21, 2007 |
| 7256502 |
Metal interconnections for semiconductor devices including a buffer layer on a trench sidewall |
Aug. 14, 2007 |
| 7256497 |
Semiconductor device with a barrier layer and a metal layer |
Aug. 14, 2007 |
| 7253525 |
Semiconductor device including contact holes between adjacent conductor patterns and method for fabricating the same |
Aug. 7, 2007 |
| 7253520 |
CSP semiconductor device having signal and radiation bump groups |
Aug. 7, 2007 |
| 7253519 |
Chip packaging structure having redistribution layer with recess |
Aug. 7, 2007 |
| 7253516 |
Electronic device and carrier substrate for same |
Aug. 7, 2007 |
| 7253513 |
High-frequency switch device and electronic device using the same |
Aug. 7, 2007 |
| 7250681 |
Semiconductor device and a method of manufacturing the semiconductor device |
Jul. 31, 2007 |
| 7250679 |
Semiconductor device and method for fabricating the same |
Jul. 31, 2007 |
| 7247943 |
Integrated circuit with at least one bump |
Jul. 24, 2007 |
| 7247941 |
Printed circuit board assembly with strain-alleviating structures |
Jul. 24, 2007 |
| 7247932 |
Chip package with capacitor |
Jul. 24, 2007 |
| 7247931 |
Semiconductor package and leadframe therefor having angled corners |
Jul. 24, 2007 |
| 7247877 |
Integrated carbon nanotube sensors |
Jul. 24, 2007 |
| 7247556 |
Control of wafer warpage during backend processing |
Jul. 24, 2007 |
| 7245022 |
Semiconductor module with improved interposer structure and method for forming the same |
Jul. 17, 2007 |
| 7245019 |
Semiconductor device with improved wiring arrangement utilizing a projecting portion and a method of manufacturing the same |
Jul. 17, 2007 |
| 7245016 |
Circuit layout structure |
Jul. 17, 2007 |
| 7244977 |
Longitudinal MISFET manufacturing method, longitudinal MISFET, semiconductor storage device manufacturing method, and semiconductor storage device |
Jul. 17, 2007 |
| 7242102 |
Bond pad structure for copper metallization having increased reliability and method for fabricating same |
Jul. 10, 2007 |
| 7242082 |
Stackable layer containing ball grid array package |
Jul. 10, 2007 |
| 7239028 |
Semiconductor device with signal line having decreased characteristic impedance |
Jul. 3, 2007 |
| 7235881 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
Jun. 26, 2007 |
| 7235879 |
Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument |
Jun. 26, 2007 |
| 7233052 |
Semiconductor device including fine dummy patterns |
Jun. 19, 2007 |
| 7230340 |
Post passivation interconnection schemes on top of the IC chips |
Jun. 12, 2007 |
| 7230339 |
Copper ring solder mask defined ball grid array pad |
Jun. 12, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7227266 |
Interconnect structure to reduce stress induced voiding effect |
Jun. 5, 2007 |
| 7227260 |
Method and system for a pad structure for use with a semiconductor package |
Jun. 5, 2007 |
| 7227254 |
Integrated circuit package |
Jun. 5, 2007 |
| 7227200 |
Metal I/O ring structure providing on-chip decoupling capacitance |
Jun. 5, 2007 |
| 7224063 |
Dual-damascene metallization interconnection |
May. 29, 2007 |
| 7224060 |
Integrated circuit with protective moat |
May. 29, 2007 |
| 7223992 |
Thermal conducting trench in a semiconductor structure |
May. 29, 2007 |
| 7221048 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
May. 22, 2007 |
| 7217997 |
Ground arch for wirebond ball grid arrays |
May. 15, 2007 |
| 7215031 |
Multi chip package |
May. 8, 2007 |
| 7211903 |
Semiconductor device and manufacturing method of them |
May. 1, 2007 |
| 7211897 |
Semiconductor device and method for fabricating the same |
May. 1, 2007 |
| 7211850 |
Semiconductor device with specifically shaped contact holes |
May. 1, 2007 |
| 7208843 |
Routing design to minimize electromigration damage to solder bumps |
Apr. 24, 2007 |
| 7208829 |
Semiconductor component |
Apr. 24, 2007 |
| 7208827 |
Encasing arrangement for a semiconductor component |
Apr. 24, 2007 |
| 7205671 |
Semiconductor device |
Apr. 17, 2007 |
| 7205660 |
Wafer level chip scale package having a gap and method for manufacturing the same |
Apr. 17, 2007 |
| 7205649 |
Ball grid array copper balancing |
Apr. 17, 2007 |
| 7205646 |
Electronic device and chip package |
Apr. 17, 2007 |
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