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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7307351 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
Dec. 11, 2007 |
| 7307347 |
Resin-encapsulated package, lead member for the same and method of fabricating the lead member |
Dec. 11, 2007 |
| 7307339 |
Semiconductor device having curved leads offset from the center of bonding pads |
Dec. 11, 2007 |
| 7307337 |
Resin-molded semiconductor device having posts with bumps and method for fabricating the same |
Dec. 11, 2007 |
| RE39932 |
Semiconductor interconnect formed over an insulation and having moisture resistant material |
Dec. 4, 2007 |
| 7304372 |
Semiconductor package |
Dec. 4, 2007 |
| 7301241 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 27, 2007 |
| 7301237 |
Semiconductor device |
Nov. 27, 2007 |
| 7301236 |
Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy via |
Nov. 27, 2007 |
| 7301229 |
Electrostatic discharge (ESD) protection for integrated circuit packages |
Nov. 27, 2007 |
| 7298029 |
Semiconductor devices and manufacturing method therefor |
Nov. 20, 2007 |
| 7294930 |
Semiconductor device and manufacturing process therefor |
Nov. 13, 2007 |
| 7294389 |
Microstructure array and a microlens array |
Nov. 13, 2007 |
| 7291930 |
Input and output circuit of an integrated circuit chip |
Nov. 6, 2007 |
| 7291923 |
Tapered signal lines |
Nov. 6, 2007 |
| 7291921 |
Structure of a micro electro mechanical system and the manufacturing method thereof |
Nov. 6, 2007 |
| 7291917 |
Integrated circuitry |
Nov. 6, 2007 |
| 7291916 |
Signal transmission structure and circuit substrate thereof |
Nov. 6, 2007 |
| 7291915 |
Circuit board and method of manufacturing the same |
Nov. 6, 2007 |
| 7291910 |
Semiconductor chip assemblies, methods of making same and components for same |
Nov. 6, 2007 |
| 7291904 |
Downsized package for electric wave device |
Nov. 6, 2007 |
| 7285862 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Oct. 23, 2007 |
| 7285858 |
Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate |
Oct. 23, 2007 |
| 7285850 |
Support elements for semiconductor devices with peripherally located bond pads |
Oct. 23, 2007 |
| 7282802 |
Modified via bottom structure for reliability enhancement |
Oct. 16, 2007 |
| 7282796 |
Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts |
Oct. 16, 2007 |
| 7279794 |
Semiconductor device and electronic device, and methods for manufacturing thereof |
Oct. 9, 2007 |
| 7279787 |
Microelectronic complex having clustered conductive members |
Oct. 9, 2007 |
| 7279778 |
Semiconductor package having a high-speed signal input/output terminal |
Oct. 9, 2007 |
| 7276787 |
Silicon chip carrier with conductive through-vias and method for fabricating same |
Oct. 2, 2007 |
| 7274105 |
Thermal conductive electronics substrate and assembly |
Sep. 25, 2007 |
| 7274102 |
Contacting device, testing method and corresponding production method |
Sep. 25, 2007 |
| 7274092 |
Semiconductor component and method of assembling the same |
Sep. 25, 2007 |
| 7274086 |
Memory device power distribution in memory assemblies |
Sep. 25, 2007 |
| 7271499 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
Sep. 18, 2007 |
| 7271492 |
Photo mask set for forming multi-layered interconnection lines and semiconductor device fabricated using the same |
Sep. 18, 2007 |
| 7271490 |
Semiconductor device having dummy wiring layers and a method for manufacturing the same |
Sep. 18, 2007 |
| 7271489 |
Post passivation interconnection schemes on top of the IC chips |
Sep. 18, 2007 |
| 7271471 |
Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus |
Sep. 18, 2007 |
| 7271427 |
Liquid crystal display device, illumination device backlight unit |
Sep. 18, 2007 |
| 7269813 |
Off-width pitch for improved circuit card routing |
Sep. 11, 2007 |
| 7268434 |
Semiconductor device and method of manufacturing the same |
Sep. 11, 2007 |
| 7268422 |
Method of making a semiconductor device adapted to remove noise from a signal |
Sep. 11, 2007 |
| 7266888 |
Method for fabricating a warpage-preventive circuit board |
Sep. 11, 2007 |
| 7265449 |
Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package |
Sep. 4, 2007 |
| 7265399 |
Asymetric layout structures for transistors and methods of fabricating the same |
Sep. 4, 2007 |
| 7262509 |
Microelectronic assembly having a perimeter around a MEMS device |
Aug. 28, 2007 |
| 7262507 |
Semiconductor-mounted device and method for producing same |
Aug. 28, 2007 |
| 7262500 |
Interconnection structure |
Aug. 28, 2007 |
| 7262473 |
Metal to polysilicon contact in oxygen environment |
Aug. 28, 2007 |
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