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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7361987 |
Circuit device with at least partial packaging and method for forming |
Apr. 22, 2008 |
| 7361568 |
Embedded capacitors and methods for their fabrication and connection |
Apr. 22, 2008 |
| 7358602 |
Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer |
Apr. 15, 2008 |
| 7357017 |
Wafer level capped sensor |
Apr. 15, 2008 |
| 7356920 |
Micro-machined structure production using encapsulation |
Apr. 15, 2008 |
| 7355283 |
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging |
Apr. 8, 2008 |
| 7352060 |
Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate |
Apr. 1, 2008 |
| 7351918 |
Surface-mount base for electronic element |
Apr. 1, 2008 |
| 7348680 |
Electronic device and use thereof |
Mar. 25, 2008 |
| 7348679 |
Electronic part having reinforcing member |
Mar. 25, 2008 |
| 7348674 |
Low capacitance wiring layout |
Mar. 25, 2008 |
| 7345368 |
Semiconductor device and the manufacturing method for the same |
Mar. 18, 2008 |
| 7345367 |
Magnetic memory device and producing method thereof |
Mar. 18, 2008 |
| 7345245 |
Robust high density substrate design for thermal cycling reliability |
Mar. 18, 2008 |
| 7342316 |
Cross-fill pattern for metal fill levels, power supply filtering, and analog circuit shielding |
Mar. 11, 2008 |
| 7341887 |
Integrated circuit die configuration for packaging |
Mar. 11, 2008 |
| 7339274 |
Metallization performance in electronic devices |
Mar. 4, 2008 |
| 7339273 |
Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode |
Mar. 4, 2008 |
| 7339227 |
Nonvolatile semiconductor memory |
Mar. 4, 2008 |
| 7335985 |
Method and system for electrically coupling a chip to chip package |
Feb. 26, 2008 |
| 7335972 |
Heterogeneously integrated microsystem-on-a-chip |
Feb. 26, 2008 |
| 7335580 |
Lamellar-derived microelectronic component array and method of fabrication |
Feb. 26, 2008 |
| 7332817 |
Die and die-package interface metallization and bump design and arrangement |
Feb. 19, 2008 |
| 7332815 |
Semiconductor device |
Feb. 19, 2008 |
| 7332810 |
Integrated circuit device and method of producing the same |
Feb. 19, 2008 |
| 7332799 |
Packaged chip having features for improved signal transmission on the package |
Feb. 19, 2008 |
| 7332430 |
Method for improving the mechanical properties of BOC module arrangements |
Feb. 19, 2008 |
| 7331106 |
Underfill method |
Feb. 19, 2008 |
| 7329952 |
Method of fabricating a semiconductor device |
Feb. 12, 2008 |
| 7329899 |
Wafer-level redistribution circuit |
Feb. 12, 2008 |
| 7327042 |
Interconnection structure of electric conductive wirings |
Feb. 5, 2008 |
| 7327032 |
Semiconductor package accomplishing fan-out structure through wire bonding |
Feb. 5, 2008 |
| 7327030 |
Apparatus and method incorporating discrete passive components in an electronic package |
Feb. 5, 2008 |
| 7325299 |
Method of making a circuitized substrate |
Feb. 5, 2008 |
| 7323788 |
Semiconductor device and manufacturing method of them |
Jan. 29, 2008 |
| 7323785 |
Semiconductor device |
Jan. 29, 2008 |
| 7321170 |
High frequency semiconductor device |
Jan. 22, 2008 |
| 7321169 |
Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus |
Jan. 22, 2008 |
| 7321164 |
Stack structure with semiconductor chip embedded in carrier |
Jan. 22, 2008 |
| 7319272 |
Ball assignment system |
Jan. 15, 2008 |
| 7319049 |
Method of manufacturing an electronic parts packaging structure |
Jan. 15, 2008 |
| 7317254 |
Semiconductor device mounting structure for reducing thermal stress and warpage |
Jan. 8, 2008 |
| 7315085 |
Ball grid array package and method thereof |
Jan. 1, 2008 |
| 7315083 |
Circuit device and manufacturing method thereof |
Jan. 1, 2008 |
| 7315072 |
Semiconductor device capable of suppressing current concentration in pad and its manufacture method |
Jan. 1, 2008 |
| 7312530 |
Semiconductor device with multilayered metal pattern |
Dec. 25, 2007 |
| 7312143 |
Wafer level chip scale package having a gap and method for manufacturing the same |
Dec. 25, 2007 |
| 7309904 |
Semiconductor device, magnetic sensor, and magnetic sensor unit |
Dec. 18, 2007 |
| 7307354 |
Integrated circuit (IC) carrier assembly incorporating an integrated circuit (IC) retainer |
Dec. 11, 2007 |
| 7307352 |
Semiconductor package having changed substrate design using special wire bonding |
Dec. 11, 2007 |
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