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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7405473 |
Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing |
Jul. 29, 2008 |
| 7405470 |
Adaptable electronic storage apparatus |
Jul. 29, 2008 |
| 7405419 |
Unidirectionally conductive materials for interconnection |
Jul. 29, 2008 |
| 7405362 |
Semiconductor devices having more than two-rows of pad structures and methods of fabricating the same |
Jul. 29, 2008 |
| 7405109 |
Method of fabricating the routing of electrical signals |
Jul. 29, 2008 |
| 7402863 |
Trench FET with reduced mesa width and source contact inside active trench |
Jul. 22, 2008 |
| 7400041 |
Compliant multi-composition interconnects |
Jul. 15, 2008 |
| 7397138 |
Semiconductor device |
Jul. 8, 2008 |
| 7397136 |
Multi-chip module and single-chip module for chips and proximity connectors |
Jul. 8, 2008 |
| 7397128 |
Semiconductor device and method of manufacturing the same |
Jul. 8, 2008 |
| 7397127 |
Bonding and probing pad structures |
Jul. 8, 2008 |
| 7397117 |
Chip package with die and substrate |
Jul. 8, 2008 |
| 7394164 |
Semiconductor device having bumps in a same row for staggered probing |
Jul. 1, 2008 |
| 7394159 |
Delamination reduction between vias and conductive pads |
Jul. 1, 2008 |
| 7394153 |
Encapsulation of electronic devices |
Jul. 1, 2008 |
| 7391122 |
Techniques for flip chip package migration |
Jun. 24, 2008 |
| 7391120 |
Increasing the adhesion of an adhesive connection in housings |
Jun. 24, 2008 |
| 7391117 |
Method for fabricating semiconductor components with conductive spring contacts |
Jun. 24, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7385283 |
Three dimensional integrated circuit and method of making the same |
Jun. 10, 2008 |
| 7382054 |
Method for forming self-aligned contacts and local interconnects simultaneously |
Jun. 3, 2008 |
| 7382052 |
Post passivation interconnection schemes on top of IC chip |
Jun. 3, 2008 |
| 7382050 |
Semiconductor device and method for producing the same |
Jun. 3, 2008 |
| 7382037 |
Semiconductor device with a peeling prevention layer |
Jun. 3, 2008 |
| 7378745 |
Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns |
May. 27, 2008 |
| 7378743 |
Circuit board and electronic assembly |
May. 27, 2008 |
| 7378742 |
Compliant interconnects for semiconductors and micromachines |
May. 27, 2008 |
| 7378737 |
Structures and methods to enhance copper metallization |
May. 27, 2008 |
| 7375432 |
Via attached to a bond pad utilizing a tapered interconnect |
May. 20, 2008 |
| 7375431 |
Solder bump formation in electronics packaging |
May. 20, 2008 |
| 7375430 |
Semiconductor device and method of manufacture thereof |
May. 20, 2008 |
| 7375426 |
Semiconductor package |
May. 20, 2008 |
| 7375411 |
Method and structure for forming relatively dense conductive layers |
May. 20, 2008 |
| 7372164 |
Semiconductor device with parallel interconnects |
May. 13, 2008 |
| 7372162 |
Multiple selectable function integrated circuit module |
May. 13, 2008 |
| 7372161 |
Post passivation interconnection schemes on top of the IC chips |
May. 13, 2008 |
| 7372153 |
Integrated circuit package bond pad having plurality of conductive members |
May. 13, 2008 |
| 7368821 |
BGA semiconductor chip package and mounting structure thereof |
May. 6, 2008 |
| 7368806 |
Flip chip package with anti-floating structure |
May. 6, 2008 |
| 7368803 |
System and method for protecting microelectromechanical systems array using back-plate with non-flat portion |
May. 6, 2008 |
| 7365441 |
Semiconductor device fabricating apparatus and semiconductor device fabricating method |
Apr. 29, 2008 |
| 7365436 |
Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same |
Apr. 29, 2008 |
| 7365434 |
Semiconductor device and manufacturing method for the same |
Apr. 29, 2008 |
| 7365413 |
Reduced power distribution mesh resistance using a modified swiss-cheese slotting pattern |
Apr. 29, 2008 |
| 7365384 |
Trench buried bit line memory devices and methods thereof |
Apr. 29, 2008 |
| 7361987 |
Circuit device with at least partial packaging and method for forming |
Apr. 22, 2008 |
| 7361568 |
Embedded capacitors and methods for their fabrication and connection |
Apr. 22, 2008 |
| 7358602 |
Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer |
Apr. 15, 2008 |
| 7357017 |
Wafer level capped sensor |
Apr. 15, 2008 |
| 7356920 |
Micro-machined structure production using encapsulation |
Apr. 15, 2008 |
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