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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6489673 |
Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers |
Dec. 3, 2002 |
| 6489675 |
Optical semiconductor component with an optically transparent protective layer |
Dec. 3, 2002 |
| 6489676 |
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin |
Dec. 3, 2002 |
| 6485814 |
High density thin film circuit board and method of production thereof |
Nov. 26, 2002 |
| 6486565 |
Semiconductor device |
Nov. 26, 2002 |
| 6483176 |
Semiconductor with multilayer wiring structure that offer high speed performance |
Nov. 19, 2002 |
| 6479884 |
Interim oxidation of silsesquioxane dielectric for dual damascene process |
Nov. 12, 2002 |
| 6479900 |
Semiconductor device and method of manufacturing the same |
Nov. 12, 2002 |
| 6479901 |
Semiconductor device having interconnected external electrode pads and wire bonding pads |
Nov. 12, 2002 |
| 6476465 |
Integrated circuit package for mounting |
Nov. 5, 2002 |
| 6476476 |
Integrated circuit package including pin and barrel interconnects |
Nov. 5, 2002 |
| 6476490 |
Contact openings, electrical connections and interconnections for integrated circuitry |
Nov. 5, 2002 |
| 6476495 |
Transistor which can minimize the DC resistance of the wiring and lead formed on a semiconductor chip |
Nov. 5, 2002 |
| 6476497 |
Concentric metal density power routing |
Nov. 5, 2002 |
| 6476503 |
Semiconductor device having columnar electrode and method of manufacturing same |
Nov. 5, 2002 |
| 6476504 |
Adhesive pattern for attaching semiconductor chip onto substrate |
Nov. 5, 2002 |
| 6476506 |
Packaged semiconductor with multiple rows of bond pads and method therefor |
Nov. 5, 2002 |
| 6472708 |
Trench MOSFET with structure having low gate charge |
Oct. 29, 2002 |
| 6472721 |
Dual damascene interconnect structures that include radio frequency capacitors and inductors |
Oct. 29, 2002 |
| 6472749 |
Semiconductor device having a shortened wiring length to reduce the size of a chip |
Oct. 29, 2002 |
| 6472763 |
Semiconductor device with bumps for pads |
Oct. 29, 2002 |
| 6469360 |
Integrated circuit devices providing reduced electric fields during fabrication thereof |
Oct. 22, 2002 |
| 6469364 |
Programmable interconnection system for electrical circuits |
Oct. 22, 2002 |
| 6469388 |
Structure for contact formation using a silicon-germanium alloy |
Oct. 22, 2002 |
| 6465811 |
Low-capacitance bond pads for high speed devices |
Oct. 15, 2002 |
| 6465890 |
Integrated circuit package having offset segmentation of package power and/or ground planes and methods for reducing delamination in integrated circuit packages |
Oct. 15, 2002 |
| 6465891 |
Integrated-circuit package with a quick-to-count finger layout design on substrate |
Oct. 15, 2002 |
| 6465896 |
Coils integrated in IC-package |
Oct. 15, 2002 |
| 6462395 |
Semiconductor device and method of producing the same |
Oct. 8, 2002 |
| 6462407 |
Electronic device having a multiplicity of contact bumps |
Oct. 8, 2002 |
| 6462408 |
Contact member stacking system and method |
Oct. 8, 2002 |
| 6462419 |
Semiconductor device and method for manufacturing the same |
Oct. 8, 2002 |
| 6459157 |
Semiconductor device and double-sided multi-chip package |
Oct. 1, 2002 |
| 6459343 |
Integrated circuit interconnect system forming a multi-pole filter |
Oct. 1, 2002 |
| 6455921 |
Fabricating plug and near-zero overlap interconnect line |
Sep. 24, 2002 |
| 6455942 |
Method and apparatus for strapping a plurality of polysilicon lines in a semiconductor integrated circuit device |
Sep. 24, 2002 |
| 6455943 |
Bonding pad structure of semiconductor device having improved bondability |
Sep. 24, 2002 |
| 6452262 |
Layout of Vdd and Vss balls in a four layer PBGA |
Sep. 17, 2002 |
| 6452277 |
Semiconductor device and manufacturing method thereof |
Sep. 17, 2002 |
| 6449838 |
Method of mounting a semiconductor device to a substrate |
Sep. 17, 2002 |
| 6448650 |
Fine pitch system and method for reinforcing bond pads in semiconductor devices |
Sep. 10, 2002 |
| 6448663 |
Semiconductor device, semiconductor device mounting structure, liquid crystal device, and electronic apparatus |
Sep. 10, 2002 |
| 6445056 |
Semiconductor capacitor device |
Sep. 3, 2002 |
| 6445064 |
Semiconductor device |
Sep. 3, 2002 |
| 6440850 |
Structure for an electrical contact to a thin film in a semiconductor structure and method for making the same |
Aug. 27, 2002 |
| 6441473 |
Flip chip semiconductor device |
Aug. 27, 2002 |
| 6441493 |
Circuit board having interconnection ball lands and ball grid array (BGA) package using the circuit board |
Aug. 27, 2002 |
| 6441502 |
Member for mounting of semiconductor |
Aug. 27, 2002 |
| 6437451 |
Test interconnect for semiconductor components having bumped and planar contacts |
Aug. 20, 2002 |
| 6437452 |
Bumpless flip chip assembly with strips-in-via and plating |
Aug. 20, 2002 |
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