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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6548907 |
Semiconductor device having a matrix array of contacts and a fabrication process thereof |
Apr. 15, 2003 |
| 6548908 |
Structure and method for planar lateral oxidation in passive devices |
Apr. 15, 2003 |
| 6545363 |
Contactor having conductive particles in a hole as a contact electrode |
Apr. 8, 2003 |
| 6545364 |
Circuit device and method of manufacturing the same |
Apr. 8, 2003 |
| 6541853 |
Electrically conductive path through a dielectric material |
Apr. 1, 2003 |
| 6541862 |
Semiconductor device including a plurality of interconnection layers, manufacturing method thereof and method of designing semiconductor circuit used in the manufacturing method |
Apr. 1, 2003 |
| 6541864 |
Semiconductor device with tapered contact hole and wire groove |
Apr. 1, 2003 |
| 6541865 |
Porous dielectric material and electronic devices fabricated therewith |
Apr. 1, 2003 |
| 6541867 |
Microelectronic connector with planar elastomer sockets |
Apr. 1, 2003 |
| 6538330 |
Multilevel semiconductor-on-insulator structures and circuits |
Mar. 25, 2003 |
| 6534854 |
Pin grid array package with controlled impedance pins |
Mar. 18, 2003 |
| 6534856 |
Sockets for "springed" semiconductor devices |
Mar. 18, 2003 |
| 6534878 |
Optimizing the power connection between chip and circuit board for a power switch |
Mar. 18, 2003 |
| 6531766 |
Semiconductor package and production method thereof |
Mar. 11, 2003 |
| 6531778 |
Semiconductor device and method of production thereof |
Mar. 11, 2003 |
| 6531782 |
Method of placing die to minimize die-to-die routing complexity on a substrate |
Mar. 11, 2003 |
| 6531783 |
Method of via formation for multilevel interconnect integrated circuits |
Mar. 11, 2003 |
| 6528343 |
Semiconductor device its manufacturing method and electronic device |
Mar. 4, 2003 |
| 6528887 |
Conductive equipotential landing pads formed on the underside of a MEMS device |
Mar. 4, 2003 |
| 6528888 |
Integrated circuit and method |
Mar. 4, 2003 |
| 6525417 |
Integrated circuits having reduced step height by using dummy conductive lines |
Feb. 25, 2003 |
| 6521981 |
Semiconductor device and manufacturing method thereof |
Feb. 18, 2003 |
| 6522011 |
Low capacitance wiring layout and method for making same |
Feb. 18, 2003 |
| 6522012 |
Semiconductor device with HIHG resistivity |
Feb. 18, 2003 |
| 6522021 |
Semiconductor device |
Feb. 18, 2003 |
| 6518654 |
Packages for semiconductor die |
Feb. 11, 2003 |
| 6518664 |
Semiconductor integrated circuit device and manufacturing method of that |
Feb. 11, 2003 |
| 6518675 |
Wafer level package and method for manufacturing the same |
Feb. 11, 2003 |
| 6518676 |
Metal interconnections and active matrix substrate using the same |
Feb. 11, 2003 |
| 6515354 |
Micro-BGA beam lead connection with cantilevered beam leads |
Feb. 4, 2003 |
| 6515369 |
High performance system-on-chip using post passivation process |
Feb. 4, 2003 |
| 6512289 |
Direct current regulation on integrated circuits under high current design conditions |
Jan. 28, 2003 |
| 6512298 |
Semiconductor device and method for producing the same |
Jan. 28, 2003 |
| 6509644 |
Grid array package with reduced power and ground impedance under high frequency |
Jan. 21, 2003 |
| 6507106 |
Semiconductor module with a number of semiconductor chips and a conductive connection between the semiconductor chips by flexible tapes |
Jan. 14, 2003 |
| 6504254 |
Semiconductor device with dummy wiring layers |
Jan. 7, 2003 |
| 6501131 |
Transistors having independently adjustable parameters |
Dec. 31, 2002 |
| 6498308 |
Semiconductor module |
Dec. 24, 2002 |
| 6495869 |
Method of manufacturing a double-heterojunction bipolar transistor on III-V material |
Dec. 17, 2002 |
| 6495911 |
Scalable high frequency integrated circuit package |
Dec. 17, 2002 |
| 6492200 |
Semiconductor chip package and fabrication method thereof |
Dec. 10, 2002 |
| 6492714 |
Semiconductor device and semiconductor module |
Dec. 10, 2002 |
| 6492729 |
Configuration and method for connecting conductor tracks |
Dec. 10, 2002 |
| 6492736 |
Power mesh bridge |
Dec. 10, 2002 |
| 6489684 |
Reduction of electromigration in dual damascene connector |
Dec. 3, 2002 |
| 6489673 |
Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers |
Dec. 3, 2002 |
| 6489675 |
Optical semiconductor component with an optically transparent protective layer |
Dec. 3, 2002 |
| 6489676 |
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin |
Dec. 3, 2002 |
| 6485814 |
High density thin film circuit board and method of production thereof |
Nov. 26, 2002 |
| 6486565 |
Semiconductor device |
Nov. 26, 2002 |
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