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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7560819 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
Jul. 14, 2009 |
| 7560817 |
Interconnect including a pliable surface and use thereof |
Jul. 14, 2009 |
| 7560807 |
Arrangement of semiconductor memory devices and semiconductor memory module comprising an arrangement of semiconductor memory devices |
Jul. 14, 2009 |
| 7560802 |
Electrical connections in substrates |
Jul. 14, 2009 |
| 7560766 |
Nonvolatile semiconductor memory |
Jul. 14, 2009 |
| 7559139 |
Method for manufacturing a probe unit |
Jul. 14, 2009 |
| 7557453 |
Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device |
Jul. 7, 2009 |
| 7557451 |
Electro-optical device and electronic apparatus |
Jul. 7, 2009 |
| 7557436 |
Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes |
Jul. 7, 2009 |
| 7554198 |
Flexible joint methodology to attach a die on an organic substrate |
Jun. 30, 2009 |
| 7554197 |
High frequency IC package and method for fabricating the same |
Jun. 30, 2009 |
| 7554189 |
Wireless communication module |
Jun. 30, 2009 |
| 7554169 |
Semiconductor device and method of manufacturing the same |
Jun. 30, 2009 |
| 7550855 |
Vertically spaced plural microsprings |
Jun. 23, 2009 |
| 7550849 |
Conductive structures including titanium-tungsten base layers |
Jun. 23, 2009 |
| 7550830 |
Stacked semiconductor package having fan-out structure through wire bonding |
Jun. 23, 2009 |
| 7547974 |
Wiring substrate with improvement in tensile strength of traces |
Jun. 16, 2009 |
| 7547973 |
Tamper-resistant semiconductor device |
Jun. 16, 2009 |
| 7547965 |
Package and package module of the package |
Jun. 16, 2009 |
| 7547630 |
Method for stacking semiconductor chips |
Jun. 16, 2009 |
| 7545046 |
Semiconductor devices having a trench in a side portion of a conducting line pattern and methods of forming the same |
Jun. 9, 2009 |
| 7541678 |
Printed wiring board, information processing apparatus, and method of manufacturing the printed wiring board |
Jun. 2, 2009 |
| 7541670 |
Semiconductor device having terminals |
Jun. 2, 2009 |
| 7541625 |
Semiconductor integrated circuit |
Jun. 2, 2009 |
| 7538442 |
Semiconductor chip and semiconductor device |
May. 26, 2009 |
| 7538438 |
Substrate warpage control and continuous electrical enhancement |
May. 26, 2009 |
| 7538437 |
Infrared receiver chip |
May. 26, 2009 |
| 7538436 |
Press pack power semiconductor module |
May. 26, 2009 |
| 7538435 |
Wafer structure and bumping process |
May. 26, 2009 |
| 7538428 |
Semiconductor device |
May. 26, 2009 |
| 7538417 |
Semiconductor device with signal line having decreased characteristic impedance |
May. 26, 2009 |
| 7535113 |
Reduced inductance in ball grid array packages |
May. 19, 2009 |
| 7535108 |
Electronic component including reinforcing member |
May. 19, 2009 |
| 7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure |
May. 19, 2009 |
| 7535044 |
Semiconductor device, method for manufacturing a semiconductor device and mask for manufacturing a semiconductor device |
May. 19, 2009 |
| 7531906 |
Flip chip packaging using recessed interposer terminals |
May. 12, 2009 |
| 7531903 |
Interconnection structure used in a pad region of a semiconductor substrate |
May. 12, 2009 |
| 7528491 |
Semiconductor components and assemblies including vias of varying lateral dimensions |
May. 5, 2009 |
| 7528474 |
Stacked semiconductor package assembly having hollowed substrate |
May. 5, 2009 |
| 7525200 |
Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device |
Apr. 28, 2009 |
| 7525190 |
Printed wiring board with wiring pattern having narrow width portion |
Apr. 28, 2009 |
| 7525186 |
Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same |
Apr. 28, 2009 |
| 7521807 |
Semiconductor device with inclined through holes |
Apr. 21, 2009 |
| 7521805 |
Post passivation interconnection schemes on top of the IC chips |
Apr. 21, 2009 |
| 7521804 |
Semiconductor device preventing electrical short and method of manufacturing the same |
Apr. 21, 2009 |
| 7521797 |
Method of manufacturing substrate joint body, substrate joint body and electrooptical device |
Apr. 21, 2009 |
| 7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces |
Apr. 21, 2009 |
| 7521276 |
Compliant terminal mountings with vented spaces and methods |
Apr. 21, 2009 |
| 7518248 |
Inductive filters and methods of fabrication therefor |
Apr. 14, 2009 |
| 7518247 |
Semiconductor device and its manufacturing method |
Apr. 14, 2009 |
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