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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6614056 |
Scalable led with improved current spreading structures |
Sep. 2, 2003 |
| 6614111 |
Semiconductor device using bumps, method for fabricating same, and method for forming bumps |
Sep. 2, 2003 |
| 6614113 |
Semiconductor device and method for producing the same |
Sep. 2, 2003 |
| 6614117 |
Method for metallization of a semiconductor substrate and related structure |
Sep. 2, 2003 |
| 6614120 |
Semiconductor device |
Sep. 2, 2003 |
| 6608372 |
Surface mountable chip type semiconductor device and manufacturing method |
Aug. 19, 2003 |
| 6608382 |
Metal bump |
Aug. 19, 2003 |
| 6608385 |
Contact structure and production method thereof and probe contact assembly using same |
Aug. 19, 2003 |
| 6608386 |
Sub-nanoscale electronic devices and processes |
Aug. 19, 2003 |
| 6605532 |
Structure for an electrical contact to a thin film in a semiconductor structure and method for making the same |
Aug. 12, 2003 |
| 6603145 |
High temperature circuit apparatus |
Aug. 5, 2003 |
| 6603178 |
Semiconductor integrated circuit device and method of manufacture thereof |
Aug. 5, 2003 |
| 6600191 |
Method of fabricating conductive straps to interconnect contacts to corresponding digit lines by employing an angled sidewall implant and semiconductor devices fabricated thereby |
Jul. 29, 2003 |
| 6600217 |
Mounting substrate and mounting method for semiconductor device |
Jul. 29, 2003 |
| 6600221 |
Semiconductor device with stacked semiconductor chips |
Jul. 29, 2003 |
| 6600225 |
Semiconductor device with elongated interconnecting member and fabrication method thereof |
Jul. 29, 2003 |
| 6596634 |
Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument |
Jul. 22, 2003 |
| 6593622 |
Power mosfet with integrated drivers in a common package |
Jul. 15, 2003 |
| 6593648 |
Semiconductor device and method of making the same, circuit board and electronic equipment |
Jul. 15, 2003 |
| 6593658 |
Chip package capable of reducing moisture penetration |
Jul. 15, 2003 |
| 6590290 |
Stacked via in copper/polyimide BEOL |
Jul. 8, 2003 |
| 6586830 |
Semiconductor device with an interposer |
Jul. 1, 2003 |
| 6586839 |
Approach to structurally reinforcing the mechanical performance of silicon level interconnect layers |
Jul. 1, 2003 |
| 6586841 |
Mechanical landing pad formed on the underside of a MEMS device |
Jul. 1, 2003 |
| 6583030 |
Method for producing an integrated circuit processed on both sides |
Jun. 24, 2003 |
| 6583509 |
Semiconductor processing techniques |
Jun. 24, 2003 |
| 6583514 |
Semiconductor device with a binary alloy bonding layer |
Jun. 24, 2003 |
| 6583516 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
Jun. 24, 2003 |
| 6579738 |
Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials |
Jun. 17, 2003 |
| 6580174 |
Vented vias for via in pad technology yield improvements |
Jun. 17, 2003 |
| 6580176 |
Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation |
Jun. 17, 2003 |
| 6577010 |
Stepped photoresist profile and opening formed using the profile |
Jun. 10, 2003 |
| 6573584 |
Thin film electronic device and circuit board mounting the same |
Jun. 3, 2003 |
| 6570181 |
Semiconductor metal interconnect reliability test structure |
May. 27, 2003 |
| 6570258 |
Method for reducing capacitive coupling between conductive lines |
May. 27, 2003 |
| 6566738 |
Lead-over-chip leadframes |
May. 20, 2003 |
| 6566888 |
Repair of resistive electrical connections in an integrated circuit |
May. 20, 2003 |
| 6563221 |
Connection structures for integrated circuits and processes for their formation |
May. 13, 2003 |
| 6559527 |
Process for forming cone shaped solder for chip interconnection |
May. 6, 2003 |
| 6559541 |
Connection structure for semiconductor electrode terminals |
May. 6, 2003 |
| 6555902 |
Multiple stacked-chip packaging structure |
Apr. 29, 2003 |
| 6555910 |
Use of small openings in large topography features to improve dielectric thickness control and a method of manufacture thereof |
Apr. 29, 2003 |
| 6555913 |
Electronic component having a coil conductor with photosensitive conductive paste |
Apr. 29, 2003 |
| 6555914 |
Integrated circuit package via |
Apr. 29, 2003 |
| 6555915 |
Integrated circuit having interconnect to a substrate and method therefor |
Apr. 29, 2003 |
| 6555916 |
Integrated circuit prepared by selectively cleaning copper substrates, in-situ, to remove copper oxides |
Apr. 29, 2003 |
| 6552420 |
Redundant pinout configuration for signal enhancement in IC packages |
Apr. 22, 2003 |
| 6552435 |
Integrated circuit with conductive lines disposed within isolation regions |
Apr. 22, 2003 |
| 6548857 |
Low resistance contact structure for a select transistor of EEPROM memory cells in a NO-DPCC process |
Apr. 15, 2003 |
| 6548902 |
Semiconductor integrated circuit device, circuit design apparatus, and circuit design method |
Apr. 15, 2003 |
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