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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6700198 |
Resin for semiconductor wire |
Mar. 2, 2004 |
| 6700200 |
Reliable via structures having hydrophobic inner wall surfaces |
Mar. 2, 2004 |
| 6696759 |
Semiconductor device with diamond-like carbon layer as a polish-stop layer |
Feb. 24, 2004 |
| 6693342 |
Thin microelectronic substrates and methods of manufacture |
Feb. 17, 2004 |
| 6693357 |
Methods and semiconductor devices with wiring layer fill structures to improve planarization uniformity |
Feb. 17, 2004 |
| 6693360 |
Static type semiconductor memory device |
Feb. 17, 2004 |
| 6690093 |
Metal contact structure in semiconductor device and method for forming the same |
Feb. 10, 2004 |
| 6686651 |
Multi-layer leadframe structure |
Feb. 3, 2004 |
| 6683378 |
System for singulating semiconductor components utilizing alignment pins |
Jan. 27, 2004 |
| 6680514 |
Contact capping local interconnect |
Jan. 20, 2004 |
| 6680526 |
Socket with low inductance side contacts for a microelectronic device package |
Jan. 20, 2004 |
| 6680527 |
Monolithic semiconducting ceramic electronic component |
Jan. 20, 2004 |
| 6680536 |
Probe unit having resilient metal leads |
Jan. 20, 2004 |
| 6680544 |
Flip-chip bump arrangement for decreasing impedance |
Jan. 20, 2004 |
| 6677669 |
Semiconductor package including two semiconductor die disposed within a common clip |
Jan. 13, 2004 |
| 6677676 |
Semiconductor device having steady substrate potential |
Jan. 13, 2004 |
| 6670215 |
Semiconductor device and manufacturing method thereof |
Dec. 30, 2003 |
| 6670704 |
Device for electronic packaging, pin jig fixture |
Dec. 30, 2003 |
| 6670712 |
Semiconductor device |
Dec. 30, 2003 |
| 6667554 |
Expanded implantation of contact holes |
Dec. 23, 2003 |
| 6664138 |
Method for fabricating a circuit device |
Dec. 16, 2003 |
| 6664620 |
Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
Dec. 16, 2003 |
| 6664638 |
Semiconductor integrated circuit having reduced cross-talk noise |
Dec. 16, 2003 |
| 6664641 |
Wiring structure for an integrated circuit |
Dec. 16, 2003 |
| 6661101 |
Semiconductor device |
Dec. 9, 2003 |
| 6657293 |
Chip scale package in which layout of wiring lines is improved |
Dec. 2, 2003 |
| 6657303 |
Integrated circuit with low solubility metal-conductor interconnect cap |
Dec. 2, 2003 |
| 6657305 |
Semiconductor recessed mask interconnect technology |
Dec. 2, 2003 |
| 6657306 |
Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method |
Dec. 2, 2003 |
| 6657307 |
Semiconductor integrated circuit having functional macro with improved power line connection structure |
Dec. 2, 2003 |
| 6657313 |
Dielectric interposer for chip to substrate soldering |
Dec. 2, 2003 |
| 6653728 |
Tray for ball grid array semiconductor packages |
Nov. 25, 2003 |
| 6653739 |
Semiconductor device |
Nov. 25, 2003 |
| 6653564 |
Conductor strip arrangement for a molded electronic component and process for molding |
Nov. 25, 2003 |
| 6649961 |
Supporting gate contacts over source region on MOSFET devices |
Nov. 18, 2003 |
| 6650021 |
Recessed bond pad |
Nov. 18, 2003 |
| 6645857 |
Key hole filling |
Nov. 11, 2003 |
| 6646520 |
Integrated circuit interconnect system |
Nov. 11, 2003 |
| 6642582 |
Circuit structure with a parasitic transistor having high threshold voltage |
Nov. 4, 2003 |
| 6642601 |
Low current substantially silicide fuse for integrated circuits |
Nov. 4, 2003 |
| 6642611 |
Storage apparatus, card type storage apparatus, and electronic apparatus |
Nov. 4, 2003 |
| 6642624 |
Ball grid array type semiconductor device |
Nov. 4, 2003 |
| 6635957 |
Leadless plastic chip carrier with etch back pad singulation and die attach pad array |
Oct. 21, 2003 |
| 6635968 |
Semiconductor device having improved alignment of an electrode terminal on a semiconductor chip and a conductor coupled to the electrode terminal |
Oct. 21, 2003 |
| 6633087 |
Low-capacitance bonding pad for semiconductor device |
Oct. 14, 2003 |
| 6627993 |
Semiconductor device having an electrical contact and a dielectric lining in a contact region |
Sep. 30, 2003 |
| 6624446 |
Thin film transistor for liquid crystal display and method of manufacturing the same |
Sep. 23, 2003 |
| 6624514 |
Semiconductor device and manufacturing method thereof |
Sep. 23, 2003 |
| 6624519 |
Aluminum based alloy bridge structure and method of forming same |
Sep. 23, 2003 |
| 6624524 |
Laser alignment target |
Sep. 23, 2003 |
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