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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6747356 |
Semiconductor device |
Jun. 8, 2004 |
| 6744067 |
Wafer-level testing apparatus and method |
Jun. 1, 2004 |
| 6744096 |
Non-volatile memory device having a bit line contact pad and method for manufacturing the same |
Jun. 1, 2004 |
| 6744118 |
Frame for semiconductor package |
Jun. 1, 2004 |
| 6744139 |
Semiconductor device |
Jun. 1, 2004 |
| 6740972 |
Electronic device having fibrous interface |
May. 25, 2004 |
| 6740975 |
Wiring substrate having no through holes formed in wiring correspondence regions |
May. 25, 2004 |
| 6740976 |
Semiconductor device including via contact plug with a discontinuous barrier layer |
May. 25, 2004 |
| 6740978 |
Chip package capable of reducing moisture penetration |
May. 25, 2004 |
| 6737745 |
Method for relieving bond stress in an under-bond-pad resistor |
May. 18, 2004 |
| 6737748 |
Stacked via with specially designed landing pad for integrated semiconductor structures |
May. 18, 2004 |
| 6737749 |
Resistive vias for controlling impedance and terminating I/O signals at the package level |
May. 18, 2004 |
| 6736306 |
Semiconductor chip package comprising enhanced pads |
May. 18, 2004 |
| 6734093 |
Method for placing active circuits beneath active bonding pads |
May. 11, 2004 |
| 6734539 |
Stacked module package |
May. 11, 2004 |
| 6734563 |
Post passivation interconnection schemes on top of the IC chips |
May. 11, 2004 |
| 6734564 |
Specially shaped contact via and integrated circuit therewith |
May. 11, 2004 |
| 6730527 |
Chip and defect tolerant method of mounting same to a substrate |
May. 4, 2004 |
| 6730985 |
Semiconductor integrated circuit device |
May. 4, 2004 |
| 6731008 |
Semiconductor device with conductive contact layer structure |
May. 4, 2004 |
| 6727580 |
Microelectronic spring contact elements |
Apr. 27, 2004 |
| 6727593 |
Semiconductor device with improved bonding |
Apr. 27, 2004 |
| 6722029 |
Method of mounting an electrical component to a support |
Apr. 20, 2004 |
| 6720205 |
Electronic device and method of manufacturing the same, and electronic instrument |
Apr. 13, 2004 |
| 6720245 |
Method of fabrication and device for electromagnetic-shielding structures in a damascene-based interconnect scheme |
Apr. 13, 2004 |
| 6720659 |
Semiconductor device having an adhesion layer |
Apr. 13, 2004 |
| 6720665 |
Enhanced pad design for substrate |
Apr. 13, 2004 |
| 6717237 |
Integrated chip diode |
Apr. 6, 2004 |
| 6717263 |
Semiconductor device having contact opening smaller than test probe, and manufacturing process and inspecting method thereof |
Apr. 6, 2004 |
| 6717264 |
High density integrated circuit package |
Apr. 6, 2004 |
| 6717266 |
Use of an alloying element to form a stable oxide layer on the surface of metal features |
Apr. 6, 2004 |
| 6717268 |
Electromigration-reliability improvement of dual damascene interconnects |
Apr. 6, 2004 |
| 6717271 |
Semiconductor device with mushroom electrode and manufacture method thereof |
Apr. 6, 2004 |
| 6713787 |
Surface light emitting devices |
Mar. 30, 2004 |
| 6713860 |
Electronic assembly and system with vertically connected capacitors |
Mar. 30, 2004 |
| 6713869 |
Wiring pattern of semiconductor device |
Mar. 30, 2004 |
| 6713879 |
Semiconductor substract with substantially matched lines |
Mar. 30, 2004 |
| 6713881 |
Semiconductor device and method of manufacturing same |
Mar. 30, 2004 |
| 6710387 |
Semiconductor device and method for fabricating the same |
Mar. 23, 2004 |
| 6710438 |
Enhanced chip scale package for wire bond dies |
Mar. 23, 2004 |
| 6710453 |
Integrated circuit containing redundant core and peripheral contacts |
Mar. 23, 2004 |
| 6707117 |
Method of providing semiconductor interconnects using silicide exclusion |
Mar. 16, 2004 |
| 6707157 |
Three dimensional semiconductor integrated circuit device having a piercing electrode |
Mar. 16, 2004 |
| 6703712 |
Microelectronic device layer deposited with multiple electrolytes |
Mar. 9, 2004 |
| 6700198 |
Resin for semiconductor wire |
Mar. 2, 2004 |
| 6700200 |
Reliable via structures having hydrophobic inner wall surfaces |
Mar. 2, 2004 |
| 6696759 |
Semiconductor device with diamond-like carbon layer as a polish-stop layer |
Feb. 24, 2004 |
| 6693342 |
Thin microelectronic substrates and methods of manufacture |
Feb. 17, 2004 |
| 6693357 |
Methods and semiconductor devices with wiring layer fill structures to improve planarization uniformity |
Feb. 17, 2004 |
| 6693360 |
Static type semiconductor memory device |
Feb. 17, 2004 |
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