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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6806577 |
Fill pattern generation for spin-on glass and related self-planarization deposition |
Oct. 19, 2004 |
| 6806583 |
Light source |
Oct. 19, 2004 |
| 6803666 |
Semiconductor chip mounting substrate and semiconductor device using the same |
Oct. 12, 2004 |
| 6800883 |
CMOS basic cell and method for fabricating semiconductor integrated circuit using the same |
Oct. 5, 2004 |
| 6800941 |
Integrated chip package structure using ceramic substrate and method of manufacturing the same |
Oct. 5, 2004 |
| 6798067 |
Switching metal line configurations in metal layer structures |
Sep. 28, 2004 |
| 6798072 |
Flip chip assembly structure for semiconductor device and method of assembling therefor |
Sep. 28, 2004 |
| 6798076 |
Method and apparatus for encoding information in an IC package |
Sep. 28, 2004 |
| 6794758 |
Wiring with insulation pattern |
Sep. 21, 2004 |
| 6791189 |
Epoxy washer for retention of inverted SMT components |
Sep. 14, 2004 |
| 6791190 |
Self-aligned contact/borderless contact opening and method for forming same |
Sep. 14, 2004 |
| 6791191 |
Integrated circuits protected against reverse engineering and method for fabricating the same using vias without metal terminations |
Sep. 14, 2004 |
| 6787884 |
Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production |
Sep. 7, 2004 |
| 6787916 |
Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity |
Sep. 7, 2004 |
| 6787921 |
Array structure of solder balls able to control collapse |
Sep. 7, 2004 |
| 6787928 |
Integrated circuit device having pads structure formed thereon and method for forming the same |
Sep. 7, 2004 |
| 6784501 |
Process for forming metalized contacts to periphery transistors |
Aug. 31, 2004 |
| 6784530 |
Circuit component built-in module with embedded semiconductor chip and method of manufacturing |
Aug. 31, 2004 |
| 6784545 |
Semiconductor device having pad electrode connected to wire |
Aug. 31, 2004 |
| 6784554 |
Semiconductor device and manufacturing method thereof |
Aug. 31, 2004 |
| 6784557 |
Semiconductor device including a diffusion layer formed between electrode portions |
Aug. 31, 2004 |
| 6781235 |
Three-level unitary interconnect structure |
Aug. 24, 2004 |
| 6781238 |
Semiconductor device and method of fabricating the same |
Aug. 24, 2004 |
| 6781245 |
Array structure of solder balls able to control collapse |
Aug. 24, 2004 |
| 6776399 |
Chip-scale package |
Aug. 17, 2004 |
| 6777812 |
Semiconductor devices having protected plug contacts and upper interconnections |
Aug. 17, 2004 |
| 6777813 |
Fill pattern generation for spin-on-glass and related self-planarization deposition |
Aug. 17, 2004 |
| 6774456 |
Configuration of fuses in semiconductor structures with Cu metallization |
Aug. 10, 2004 |
| 6774471 |
Protected bond fingers |
Aug. 10, 2004 |
| 6774486 |
Circuit boards containing vias and methods for producing same |
Aug. 10, 2004 |
| 6774491 |
Conductive lines, coaxial lines, integrated circuitry, and methods of forming conductive lines, coaxial lines, and integrated circuitry |
Aug. 10, 2004 |
| 6774499 |
Non-leaded semiconductor package and method of fabricating the same |
Aug. 10, 2004 |
| 6770936 |
Thin film transistors, and liquid crystal display device and electronic apparatus using the same |
Aug. 3, 2004 |
| 6770974 |
Semiconductor device and its manufacturing method |
Aug. 3, 2004 |
| 6768142 |
Circuit component placement |
Jul. 27, 2004 |
| 6768196 |
Packaged microchip with isolation |
Jul. 27, 2004 |
| 6768204 |
Self-aligned conductive plugs in a semiconductor device |
Jul. 27, 2004 |
| 6768205 |
Thin-film circuit substrate |
Jul. 27, 2004 |
| 6768206 |
Organic substrate for flip chip bonding |
Jul. 27, 2004 |
| 6763580 |
Method and apparatus for securing an electrically conductive interconnect through a metallic substrate |
Jul. 20, 2004 |
| 6765256 |
Semiconductor device |
Jul. 20, 2004 |
| 6756666 |
Surface mount package including terminal on its side |
Jun. 29, 2004 |
| 6756671 |
Microelectronic device with a redistribution layer having a step shaped portion and method of making the same |
Jun. 29, 2004 |
| 6753605 |
Passivation scheme for bumped wafers |
Jun. 22, 2004 |
| 6753611 |
Semiconductor device, designing method thereof, and recording medium storing semiconductor designing program |
Jun. 22, 2004 |
| 6750539 |
Joining semiconductor units with bonding material |
Jun. 15, 2004 |
| 6750544 |
Metallization system for use in a semiconductor component |
Jun. 15, 2004 |
| 6747339 |
Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate |
Jun. 8, 2004 |
| 6747345 |
Exposed die molding apparatus |
Jun. 8, 2004 |
| 6747351 |
Semiconductor device and method of manufacturing of the same |
Jun. 8, 2004 |
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