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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6888249 |
Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same |
May. 3, 2005 |
| 6888250 |
Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium |
May. 3, 2005 |
| 6885046 |
Semiconductor integrated circuit configured to supply sufficient internal current |
Apr. 26, 2005 |
| 6885102 |
Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts |
Apr. 26, 2005 |
| 6885107 |
Flip-chip image sensor packages and methods of fabrication |
Apr. 26, 2005 |
| 6885109 |
Semiconductor device having a step-like section on the back side of the substrate, and method for manufacturing the same |
Apr. 26, 2005 |
| 6882044 |
High speed electronic interconnection using a detachable substrate |
Apr. 19, 2005 |
| 6879039 |
Ball grid array package substrates and method of making the same |
Apr. 12, 2005 |
| 6879040 |
Surface mountable electronic device |
Apr. 12, 2005 |
| 6879047 |
Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor |
Apr. 12, 2005 |
| 6879049 |
Damascene interconnection and semiconductor device |
Apr. 12, 2005 |
| 6879494 |
Circuit package for electronic systems |
Apr. 12, 2005 |
| 6876066 |
Packaged microelectronic devices and methods of forming same |
Apr. 5, 2005 |
| 6876080 |
Etch stop for copper damascene process |
Apr. 5, 2005 |
| 6876084 |
Chip package structure |
Apr. 5, 2005 |
| 6873053 |
Semiconductor device with smoothed pad portion |
Mar. 29, 2005 |
| 6873055 |
Integrated circuit arrangement with field-shaping electrical conductor |
Mar. 29, 2005 |
| 6873056 |
Electrode-to-electrode bond structure |
Mar. 29, 2005 |
| 6870236 |
Integrated resistor network for multi-functional use in constant current or constant voltage operation of a pressure sensor |
Mar. 22, 2005 |
| 6870255 |
Integrated circuit wiring architectures to support independent designs |
Mar. 22, 2005 |
| 6870267 |
Off-center solder ball attach assembly |
Mar. 22, 2005 |
| 6867494 |
Semiconductor module |
Mar. 15, 2005 |
| 6867505 |
Semiconductor device, a method for making the same, and an LCD monitor comprising the same |
Mar. 15, 2005 |
| 6864576 |
Large line conductive pads for interconnection of stackable circuitry |
Mar. 8, 2005 |
| 6864579 |
Carrier with a metal area and at least one chip configured on the metal area |
Mar. 8, 2005 |
| 6864586 |
Padless high density circuit board |
Mar. 8, 2005 |
| 6864589 |
X/Y alignment vernier formed on a substrate |
Mar. 8, 2005 |
| 6861670 |
Semiconductor device having multi-layer wiring |
Mar. 1, 2005 |
| 6861694 |
Semiconductor device and method for fabricating the same |
Mar. 1, 2005 |
| 6861740 |
Flip-chip die and flip-chip package substrate |
Mar. 1, 2005 |
| 6861757 |
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
Mar. 1, 2005 |
| 6858928 |
Multi-directional wiring on a single metal layer |
Feb. 22, 2005 |
| 6858937 |
Backend metallization method and device obtained therefrom |
Feb. 22, 2005 |
| 6858944 |
Bonding pad metal layer geometry design |
Feb. 22, 2005 |
| 6858946 |
Semiconductor device |
Feb. 22, 2005 |
| 6859916 |
Polygonal vias |
Feb. 22, 2005 |
| 6856022 |
Semiconductor device |
Feb. 15, 2005 |
| 6856025 |
Chip and wafer integration process using vertical connections |
Feb. 15, 2005 |
| 6853078 |
Semiconductor device and method for fabricating the same |
Feb. 8, 2005 |
| 6853080 |
Electronic device and method of manufacturing the same, and electronic instrument |
Feb. 8, 2005 |
| 6849888 |
Semiconductor memory device, nonvolatile memory device and magnetic memory device provided with memory elements and interconnections |
Feb. 1, 2005 |
| 6849948 |
Contact structure and manufacturing method thereof |
Feb. 1, 2005 |
| 6849955 |
High density integrated circuit packages and method for the same |
Feb. 1, 2005 |
| 6847096 |
Semiconductor wafer having discharge structure to substrate |
Jan. 25, 2005 |
| 6847123 |
Vertically staggered bondpad array |
Jan. 25, 2005 |
| 6847124 |
Semiconductor device and fabrication method thereof |
Jan. 25, 2005 |
| 6844214 |
Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication |
Jan. 18, 2005 |
| 6844620 |
Power layout structure of main bridge chip substrate and motherboard |
Jan. 18, 2005 |
| 6844625 |
Method for producing input/output permutation of several conductive strips with parallel branches of an integrated circuit and resulting circuit |
Jan. 18, 2005 |
| 6844629 |
Display panel with bypassing lines |
Jan. 18, 2005 |
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