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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6946747 |
Semiconductor device and its manufacturing method |
Sep. 20, 2005 |
| 6943437 |
Smart card or similar electronic device |
Sep. 13, 2005 |
| 6943446 |
Via construction for structural support |
Sep. 13, 2005 |
| 6943450 |
Packaged microelectronic devices and methods of forming same |
Sep. 13, 2005 |
| 6943453 |
Superconductor device and method of manufacturing the same |
Sep. 13, 2005 |
| 6940108 |
Slot design for metal interconnects |
Sep. 6, 2005 |
| 6940128 |
Semiconductor device for power MOS transistor module |
Sep. 6, 2005 |
| 6936926 |
Wiring structure in a semiconductor device |
Aug. 30, 2005 |
| 6933545 |
Hetero-bipolar transistor having the base interconnection provided on the normal mesa surface of the collector mesa |
Aug. 23, 2005 |
| 6933599 |
Electromagnetic noise shielding in semiconductor packages using caged interconnect structures |
Aug. 23, 2005 |
| 6933606 |
Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same |
Aug. 23, 2005 |
| 6930042 |
Method for producing a semiconductor component with at least one encapsulated chip on a substrate |
Aug. 16, 2005 |
| 6930395 |
Circuit substrate having improved connection reliability and a method for manufacturing the same |
Aug. 16, 2005 |
| 6930400 |
Grid array microelectronic packages with increased periphery |
Aug. 16, 2005 |
| 6927347 |
Printed circuit board having through-hole protected by barrier and method of manufacturing the same |
Aug. 9, 2005 |
| 6927491 |
Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board |
Aug. 9, 2005 |
| 6927498 |
Bond pad for flip chip package |
Aug. 9, 2005 |
| 6924555 |
Specially shaped contact via and integrated circuit therewith |
Aug. 2, 2005 |
| 6924558 |
Semiconductor device and method of fabricating the same, circuit board, and electronic instrument |
Aug. 2, 2005 |
| 6921976 |
Semiconductor device including an island-like dielectric member embedded in a conductive pattern |
Jul. 26, 2005 |
| 6921979 |
Semiconductor device having a bond pad and method therefor |
Jul. 26, 2005 |
| 6921981 |
Ball grid array package |
Jul. 26, 2005 |
| 6922499 |
MEMS driver circuit arrangement |
Jul. 26, 2005 |
| 6919227 |
Semiconductor part of component mounting, mounting structure and mounting method |
Jul. 19, 2005 |
| 6919636 |
Interconnects with a dielectric sealant layer |
Jul. 19, 2005 |
| 6919637 |
Interconnect structure for an integrated circuit and method of fabrication |
Jul. 19, 2005 |
| 6919644 |
Semiconductor device manufacturing method and semiconductor device manufactured thereby |
Jul. 19, 2005 |
| 6917105 |
Integrating chip scale packaging metallization into integrated circuit die structures |
Jul. 12, 2005 |
| 6917115 |
Alignment pattern for a semiconductor device manufacturing process |
Jul. 12, 2005 |
| 6917116 |
Electrical connection device between two tracks of an integrated circuit |
Jul. 12, 2005 |
| 6911729 |
Tape carrier semiconductor device |
Jun. 28, 2005 |
| 6912696 |
Smart card and circuitry layout thereof for reducing cross-talk |
Jun. 28, 2005 |
| 6908795 |
Method of fabricating an encapsulant lock feature in integrated circuit packaging |
Jun. 21, 2005 |
| 6909174 |
Reference plane of integrated circuit packages |
Jun. 21, 2005 |
| 6906411 |
Multilayer substrate module and portable wireless terminal |
Jun. 14, 2005 |
| 6906422 |
Microelectronic elements with deformable leads |
Jun. 14, 2005 |
| 6902950 |
Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby |
Jun. 7, 2005 |
| 6903365 |
Electronic device using carbon element linear structure and production method thereof |
Jun. 7, 2005 |
| 6903443 |
Semiconductor component and interconnect having conductive members and contacts on opposing sides |
Jun. 7, 2005 |
| 6903448 |
High performance leadframe in electronic package |
Jun. 7, 2005 |
| 6900532 |
Wafer level chip scale package |
May. 31, 2005 |
| 6900544 |
Integrated circuit package and printed circuit board arrangement |
May. 31, 2005 |
| 6900548 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
May. 31, 2005 |
| 6897507 |
Capacitor for high performance system-on-chip using post passivation device |
May. 24, 2005 |
| 6897549 |
Frame for semiconductor package |
May. 24, 2005 |
| 6897555 |
Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die |
May. 24, 2005 |
| 6897563 |
Current crowding reduction technique using selective current injection |
May. 24, 2005 |
| 6897570 |
Semiconductor device and method of manufacturing same |
May. 24, 2005 |
| 6894386 |
Apparatus and method for packaging circuits |
May. 17, 2005 |
| 6894393 |
Buried power bus utilized as a sinker for high current, high power semiconductor devices and a method for providing the same |
May. 17, 2005 |
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