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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.










Sub-classes under this class:

Class Number Class Name Patents
257/776 Cross-over arrangement, component or structure 938
257/775 Varying width or thickness of conductor 1,000
257/774 Via (interconnection hole) shape 3,891


Patents under this class:

Patent Number Title Of Patent Date Issued
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8710674 Internal wiring structure of semiconductor device Apr. 29, 2014
8710672 Semiconductor device and method of manufacturing the same Apr. 29, 2014
8710671 Multi-level integrated circuit, device and method for modeling multi-level integrated circuits Apr. 29, 2014
8710669 Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer Apr. 29, 2014
8710667 Semiconductor device Apr. 29, 2014
8710666 Semiconductor device and method for fabricating the same Apr. 29, 2014
8710665 Electronic component, a semiconductor wafer and a method for producing an electronic component Apr. 29, 2014
8710664 Wafer-level chip scale package Apr. 29, 2014
8710660 Hybrid interconnect scheme including aluminum metal line in low-k dielectric Apr. 29, 2014
8710658 Under bump passive components in wafer level packaging Apr. 29, 2014
8710655 Die packages and systems having the die packages Apr. 29, 2014
8710644 Semiconductor unit having a power semiconductor and semiconductor apparatus using the same Apr. 29, 2014
8709873 Leadless integrated circuit packaging system and method of manufacture thereof Apr. 29, 2014
8704531 Loop element and noise analyzer Apr. 22, 2014
8704377 Compliant conductive nano-particle electrical interconnect Apr. 22, 2014
8704358 Method for forming an integrated circuit Apr. 22, 2014
8704356 High temperature interconnect assemblies for high temperature electronics utilizing transition pads Apr. 22, 2014
8704342 Resin sealing type semiconductor device and method of manufacturing the same, and lead frame Apr. 22, 2014
8703599 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Apr. 22, 2014
8703538 Integrated circuit packaging system with external wire connection and method of manufacture thereof Apr. 22, 2014
8693879 Discrete bootstrapping in an optical receiver to prevent signal feedback Apr. 8, 2014
8692385 Device for connecting nano-objects to external electrical systems, and method for producing said device Apr. 8, 2014
8692382 Chip package Apr. 8, 2014
8692380 Integrated circuit system with sub-geometry removal and method of manufacture thereof Apr. 8, 2014
8692379 Integrated circuit connector access region Apr. 8, 2014
8692378 UBM structures for wafer level chip scale packaging Apr. 8, 2014
8692377 Integrated circuit packaging system with plated leads and method of manufacture thereof Apr. 8, 2014
8692351 Dummy shoulder structure for line stress reduction Apr. 8, 2014
8691377 Semiconductor device Apr. 8, 2014
8686564 Semiconductor device Apr. 1, 2014
8686563 Methods of forming fine patterns in the fabrication of semiconductor devices Apr. 1, 2014
8686536 Electrical fuse structure and method of formation Apr. 1, 2014
8681596 Seek-scan probe (SSP) memory with sharp probe tips formed at CMOS-compatible temperatures Mar. 25, 2014
8680691 Semiconductor device having semiconductor member and mounting member Mar. 25, 2014
8680682 Barrier for through-silicon via Mar. 25, 2014
8680681 Bond pad configurations for controlling semiconductor chip package interactions Mar. 25, 2014
8680677 Carbon nanotube-based conductive connections for integrated circuit devices Mar. 25, 2014
8680660 Brace for bond wire Mar. 25, 2014
8680654 Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods Mar. 25, 2014
8674512 Method to align mask patterns Mar. 18, 2014
8674511 Method of forming a semiconductor device with a contact pad on a sloped silicon dioxide surface Mar. 18, 2014
8674510 Three-dimensional integrated circuit structure having improved power and thermal management Mar. 18, 2014
8674506 Structures and methods to reduce maximum current density in a solder ball Mar. 18, 2014
8673772 Biosensor chip and a method of manufacturing the same Mar. 18, 2014
8669666 Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element Mar. 11, 2014
8669175 Semiconductor device and manufacturing of the semiconductor device Mar. 11, 2014
8664776 Interconnection tape providing a serial electrode pad connection in a semiconductor device Mar. 4, 2014
8664774 Bondwire configuration for reduced crosstalk Mar. 4, 2014
8664767 Conductive routings in integrated circuits using under bump metallization Mar. 4, 2014











 
 
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