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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.


Sub-classes under this class:

Class Number Class Name Patents
257/776 Cross-over arrangement, component or structure 674
257/775 Varying width or thickness of conductor 731
257/774 Via (interconnection hole) shape 2,280


Patents under this class:

Patent Number Title Of Patent Date Issued
7615864 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus Nov. 10, 2009
7612439 Semiconductor package having improved thermal performance Nov. 3, 2009
7608891 Thin film transistor, circuit apparatus and liquid crystal display Oct. 27, 2009
7605474 Structure of polymer-matrix conductive film and method for fabricating the same Oct. 20, 2009
7605473 Nonvolatile memory devices Oct. 20, 2009
7602068 Dual-damascene process to fabricate thick wire structure Oct. 13, 2009
7602064 Semiconductor device having an inspection hole striding a boundary Oct. 13, 2009
7602058 Flip-chip semiconductor device with improved power pad arrangement Oct. 13, 2009
7602019 Drive circuit and drain extended transistor for use therein Oct. 13, 2009
7601630 Semiconductor device and method for fabricating the same Oct. 13, 2009
7598617 Stack package utilizing through vias and re-distribution lines Oct. 6, 2009
7598609 Structure of polymer-matrix conductive film and method for fabricating the same Oct. 6, 2009
7596862 Method of making a circuitized substrate Oct. 6, 2009
7595562 Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device Sep. 29, 2009
7595561 Semiconductor device including multiple rows of peripheral circuit units Sep. 29, 2009
7595557 Semiconductor device and manufacturing method thereof Sep. 29, 2009
7595549 Surface mount semiconductor device Sep. 29, 2009
7592705 Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device Sep. 22, 2009
7592703 RF and MMIC stackable micro-modules Sep. 22, 2009
7592702 Via heat sink material Sep. 22, 2009
7592701 Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure Sep. 22, 2009
7592244 Semiconductor device and method of manufacturing the same Sep. 22, 2009
7589419 Side connectors for RFID chip Sep. 15, 2009
7589411 Device for electrical connection of an integrated circuit chip Sep. 15, 2009
7589388 Semiconductor device and method of manufacturing the same Sep. 15, 2009
7586199 Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types Sep. 8, 2009
7586188 Chip package and coreless package substrate thereof Sep. 8, 2009
7586187 Interconnect structure with stress buffering ability and the manufacturing method thereof Sep. 8, 2009
7586186 Ball grid array Sep. 8, 2009
7582974 Semiconductor device and method of manufacturing same Sep. 1, 2009
7579696 Semiconductor device Aug. 25, 2009
7579693 Mounting structure of ball grid array Aug. 25, 2009
7579692 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument Aug. 25, 2009
7579685 Wafer level packaging cap and fabrication method thereof Aug. 25, 2009
7579681 Super high density module with integrated wafer level packages Aug. 25, 2009
7576437 Printed circuit board of semiconductor package and method for mounting semiconductor package using the same Aug. 18, 2009
7576390 System for vertical DMOS with slots Aug. 18, 2009
7575994 Semiconductor device and manufacturing method of the same Aug. 18, 2009
7573135 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film Aug. 11, 2009
7572730 Method of manufacturing wiring substrate, liquid ejection head and image forming apparatus Aug. 11, 2009
7572681 Embedded electronic component package Aug. 11, 2009
7569938 Interconnections for integrated circuits Aug. 4, 2009
7569936 Semiconductor device and method of manufacturing the same Aug. 4, 2009
7567424 Electronic component Jul. 28, 2009
7566976 Semiconductor device and method for fabricating the same Jul. 28, 2009
7566585 Semiconductor component and method for production of a semiconductor component Jul. 28, 2009
7564137 Stackable integrated circuit structures and systems devices and methods related thereto Jul. 21, 2009
7564136 Integration scheme for Cu/low-k interconnects Jul. 21, 2009
7560819 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument Jul. 14, 2009
7560817 Interconnect including a pliable surface and use thereof Jul. 14, 2009



 
 
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