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Class Information
Number: 257/773
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration
Description: Subject matter in which an electrical contact or lead has a specific configuration or shape.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615864 |
Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus |
Nov. 10, 2009 |
| 7612439 |
Semiconductor package having improved thermal performance |
Nov. 3, 2009 |
| 7608891 |
Thin film transistor, circuit apparatus and liquid crystal display |
Oct. 27, 2009 |
| 7605474 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 20, 2009 |
| 7605473 |
Nonvolatile memory devices |
Oct. 20, 2009 |
| 7602068 |
Dual-damascene process to fabricate thick wire structure |
Oct. 13, 2009 |
| 7602064 |
Semiconductor device having an inspection hole striding a boundary |
Oct. 13, 2009 |
| 7602058 |
Flip-chip semiconductor device with improved power pad arrangement |
Oct. 13, 2009 |
| 7602019 |
Drive circuit and drain extended transistor for use therein |
Oct. 13, 2009 |
| 7601630 |
Semiconductor device and method for fabricating the same |
Oct. 13, 2009 |
| 7598617 |
Stack package utilizing through vias and re-distribution lines |
Oct. 6, 2009 |
| 7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 6, 2009 |
| 7596862 |
Method of making a circuitized substrate |
Oct. 6, 2009 |
| 7595562 |
Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device |
Sep. 29, 2009 |
| 7595561 |
Semiconductor device including multiple rows of peripheral circuit units |
Sep. 29, 2009 |
| 7595557 |
Semiconductor device and manufacturing method thereof |
Sep. 29, 2009 |
| 7595549 |
Surface mount semiconductor device |
Sep. 29, 2009 |
| 7592705 |
Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device |
Sep. 22, 2009 |
| 7592703 |
RF and MMIC stackable micro-modules |
Sep. 22, 2009 |
| 7592702 |
Via heat sink material |
Sep. 22, 2009 |
| 7592701 |
Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure |
Sep. 22, 2009 |
| 7592244 |
Semiconductor device and method of manufacturing the same |
Sep. 22, 2009 |
| 7589419 |
Side connectors for RFID chip |
Sep. 15, 2009 |
| 7589411 |
Device for electrical connection of an integrated circuit chip |
Sep. 15, 2009 |
| 7589388 |
Semiconductor device and method of manufacturing the same |
Sep. 15, 2009 |
| 7586199 |
Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types |
Sep. 8, 2009 |
| 7586188 |
Chip package and coreless package substrate thereof |
Sep. 8, 2009 |
| 7586187 |
Interconnect structure with stress buffering ability and the manufacturing method thereof |
Sep. 8, 2009 |
| 7586186 |
Ball grid array |
Sep. 8, 2009 |
| 7582974 |
Semiconductor device and method of manufacturing same |
Sep. 1, 2009 |
| 7579696 |
Semiconductor device |
Aug. 25, 2009 |
| 7579693 |
Mounting structure of ball grid array |
Aug. 25, 2009 |
| 7579692 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
Aug. 25, 2009 |
| 7579685 |
Wafer level packaging cap and fabrication method thereof |
Aug. 25, 2009 |
| 7579681 |
Super high density module with integrated wafer level packages |
Aug. 25, 2009 |
| 7576437 |
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same |
Aug. 18, 2009 |
| 7576390 |
System for vertical DMOS with slots |
Aug. 18, 2009 |
| 7575994 |
Semiconductor device and manufacturing method of the same |
Aug. 18, 2009 |
| 7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Aug. 11, 2009 |
| 7572730 |
Method of manufacturing wiring substrate, liquid ejection head and image forming apparatus |
Aug. 11, 2009 |
| 7572681 |
Embedded electronic component package |
Aug. 11, 2009 |
| 7569938 |
Interconnections for integrated circuits |
Aug. 4, 2009 |
| 7569936 |
Semiconductor device and method of manufacturing the same |
Aug. 4, 2009 |
| 7567424 |
Electronic component |
Jul. 28, 2009 |
| 7566976 |
Semiconductor device and method for fabricating the same |
Jul. 28, 2009 |
| 7566585 |
Semiconductor component and method for production of a semiconductor component |
Jul. 28, 2009 |
| 7564137 |
Stackable integrated circuit structures and systems devices and methods related thereto |
Jul. 21, 2009 |
| 7564136 |
Integration scheme for Cu/low-k interconnects |
Jul. 21, 2009 |
| 7560819 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
Jul. 14, 2009 |
| 7560817 |
Interconnect including a pliable surface and use thereof |
Jul. 14, 2009 |
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