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Class Information
Number: 257/772
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Solder composition
Description: Subject matter wherein the specific contact or lead material is a solder composition (i.e., a metal or metallic alloy that melts at relatively low temperatures).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7443038 |
Flip-chip image sensor packages |
Oct. 28, 2008 |
| 7439083 |
Technique for compensating for substrate shrinkage during manufacture of an electronic assembly |
Oct. 21, 2008 |
| 7436073 |
Junction structure for a terminal pad and solder, and semiconductor device having the same |
Oct. 14, 2008 |
| 7425765 |
Zinc-aluminum solder alloy |
Sep. 16, 2008 |
| 7402910 |
Solder, microelectromechanical component and device, and a process for producing a component or device |
Jul. 22, 2008 |
| 7391112 |
Capping copper bumps |
Jun. 24, 2008 |
| 7388296 |
Wiring substrate and bonding pad composition |
Jun. 17, 2008 |
| 7382005 |
Circuit component with bump formed over chip |
Jun. 3, 2008 |
| 7375429 |
Integrated circuit component and mounting method thereof |
May. 20, 2008 |
| 7372162 |
Multiple selectable function integrated circuit module |
May. 13, 2008 |
| 7361990 |
Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads |
Apr. 22, 2008 |
| 7355280 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
Apr. 8, 2008 |
| 7352055 |
Semiconductor package with controlled solder bump wetting |
Apr. 1, 2008 |
| 7339263 |
Integrated circuit packages, systems, and methods |
Mar. 4, 2008 |
| 7326636 |
Method and circuit structure employing a photo-imaged solder mask |
Feb. 5, 2008 |
| 7318962 |
Magnetically directed self-assembly of molecular electronic junctions comprising conductively coated ferromagnetic microparticles |
Jan. 15, 2008 |
| 7309647 |
Method of mounting an electroless nickel immersion gold flip chip package |
Dec. 18, 2007 |
| 7298049 |
Submount for mounting semiconductor device |
Nov. 20, 2007 |
| 7291549 |
Method and structure to reduce risk of gold embrittlement in solder joints |
Nov. 6, 2007 |
| 7279795 |
Stacked die semiconductor package |
Oct. 9, 2007 |
| 7274103 |
Semiconductor device and manufacturing method thereof |
Sep. 25, 2007 |
| 7268438 |
Semiconductor element including a wet prevention film |
Sep. 11, 2007 |
| 7265449 |
Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package |
Sep. 4, 2007 |
| 7262498 |
Assembly with a ring and bonding pads formed of a same material on a substrate |
Aug. 28, 2007 |
| 7259465 |
Semiconductor device with lead-free solder |
Aug. 21, 2007 |
| 7256496 |
Semiconductor device having adhesion increasing film to prevent peeling |
Aug. 14, 2007 |
| 7256501 |
Semiconductor device and manufacturing method of the same |
Aug. 14, 2007 |
| 7253519 |
Chip packaging structure having redistribution layer with recess |
Aug. 7, 2007 |
| 7253090 |
Chip scale surface mounted device and process of manufacture |
Aug. 7, 2007 |
| 7239023 |
Package assembly for electronic device |
Jul. 3, 2007 |
| 7235871 |
Stacked microelectronic dies |
Jun. 26, 2007 |
| 7233072 |
Electronic part and surface treatment method of the same |
Jun. 19, 2007 |
| 7224066 |
Bonding material and circuit device using the same |
May. 29, 2007 |
| 7224067 |
Intermetallic solder with low melting point |
May. 29, 2007 |
| 7218004 |
Fusing nanowires using in situ crystal growth |
May. 15, 2007 |
| 7215013 |
Semiconductor device and semiconductor apparatus |
May. 8, 2007 |
| 7215030 |
Lead-free semiconductor package |
May. 8, 2007 |
| 7208402 |
Method and apparatus for improved power routing |
Apr. 24, 2007 |
| 7202569 |
Semiconductor device and manufacturing method of the same |
Apr. 10, 2007 |
| 7199476 |
Electronic device |
Apr. 3, 2007 |
| 7196356 |
Submount and semiconductor device |
Mar. 27, 2007 |
| 7193326 |
Mold type semiconductor device |
Mar. 20, 2007 |
| 7190080 |
Semiconductor chip assembly with embedded metal pillar |
Mar. 13, 2007 |
| 7187083 |
Thermal interface material and solder preforms |
Mar. 6, 2007 |
| 7183652 |
Electronic component and electronic configuration |
Feb. 27, 2007 |
| 7180195 |
Method and apparatus for improved power routing |
Feb. 20, 2007 |
| 7161237 |
Flip chip packaging using recessed interposer terminals |
Jan. 9, 2007 |
| 7160796 |
Method for manufacturing wiring board and semiconductor device |
Jan. 9, 2007 |
| 7151050 |
Method for fabricating electrical connection structure of circuit board |
Dec. 19, 2006 |
| 7145236 |
Semiconductor device having solder bumps reliably reflow solderable |
Dec. 5, 2006 |
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