| |
 |
|
Class Information
Number: 257/771
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Alloy containing aluminum
Description: Subject matter wherein the specific contact or lead material is an alloy containing aluminum (Al).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8669652 |
Lead component and method for manufacturing the same, and semiconductor package |
Mar. 11, 2014 |
| 8653668 |
Copper bonding wire for semiconductor device and bonding structure thereof |
Feb. 18, 2014 |
| 8629559 |
Stress reduction apparatus with an inverted cup-shaped layer |
Jan. 14, 2014 |
| 8525330 |
Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer |
Sep. 3, 2013 |
| 8519539 |
Metal wire for a semiconductor device formed with a metal layer without voids therein and a method for forming the same |
Aug. 27, 2013 |
| 8476645 |
LED thermal management |
Jul. 2, 2013 |
| 8466569 |
Increasing exposure tool alignment signal strength for a ferroelectric capacitor layer |
Jun. 18, 2013 |
| 8450209 |
p+ Polysilicon material on aluminum for non-volatile memory device and method |
May. 28, 2013 |
| 8446003 |
Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate |
May. 21, 2013 |
| 8426972 |
Semiconductor device and method for manufacturing the same |
Apr. 23, 2013 |
| 8395261 |
Semiconductor device |
Mar. 12, 2013 |
| 8390125 |
Through-silicon via formed with a post passivation interconnect structure |
Mar. 5, 2013 |
| 8378490 |
Semiconductor apparatus including a metal alloy between a first contact and a second contact |
Feb. 19, 2013 |
| 8350303 |
Display device and sputtering target for producing the same |
Jan. 8, 2013 |
| 8338954 |
Semiconductor apparatus and fabrication method thereof |
Dec. 25, 2012 |
| 8324731 |
Integrated circuit device |
Dec. 4, 2012 |
| 8242602 |
Composite solder TIM for electronic package |
Aug. 14, 2012 |
| 8217397 |
Thin film transistor substrate and display device |
Jul. 10, 2012 |
| 8169040 |
Semiconductor device and method for manufacturing the same |
May. 1, 2012 |
| 8115264 |
Semiconductor device having a metal gate with a low sheet resistance and method of fabricating metal gate of the same |
Feb. 14, 2012 |
| 8101871 |
Aluminum bond pads with enhanced wire bond stability |
Jan. 24, 2012 |
| 8088688 |
p+ polysilicon material on aluminum for non-volatile memory device and method |
Jan. 3, 2012 |
| 8084861 |
Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure |
Dec. 27, 2011 |
| 8076781 |
Semiconductor device and manufacturing method of the same |
Dec. 13, 2011 |
| 8076778 |
Method for preventing Al-Cu bottom damage using TiN liner |
Dec. 13, 2011 |
| 8072004 |
Power and ground routing of integrated circuit devices with improved IR drop and chip performance |
Dec. 6, 2011 |
| 8044500 |
Power module substrate, method for manufacturing power module substrate, and power module |
Oct. 25, 2011 |
| 7960835 |
Fabrication of metal film stacks having improved bottom critical dimension |
Jun. 14, 2011 |
| 7944056 |
Hillock-free aluminum layer and method of forming the same |
May. 17, 2011 |
| 7928575 |
Electronic device, method of manufacture of the same, and sputtering target |
Apr. 19, 2011 |
| 7893532 |
External contact material for external contacts of a semiconductor device and method of making the same |
Feb. 22, 2011 |
| 7830001 |
Cu-Mo substrate and method for producing same |
Nov. 9, 2010 |
| 7786553 |
Method of fabricating semiconductor device |
Aug. 31, 2010 |
| 7781767 |
Thin film transistor substrate and display device |
Aug. 24, 2010 |
| 7755198 |
Al-Ni-based alloy wiring material and element structure using the same |
Jul. 13, 2010 |
| 7750470 |
Methods for planarization of dielectric layer around metal patterns for optical efficiency enhancement |
Jul. 6, 2010 |
| 7741720 |
Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards |
Jun. 22, 2010 |
| 7737503 |
Semiconductor device and method for manufacturing the same |
Jun. 15, 2010 |
| 7724536 |
Circuit device |
May. 25, 2010 |
| 7679140 |
Structure of strained silicon on insulator and method of manufacturing the same |
Mar. 16, 2010 |
| 7655957 |
Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
Feb. 2, 2010 |
| 7642655 |
Semiconductor device and method of manufacture thereof |
Jan. 5, 2010 |
| 7638800 |
Wire for a display device, a method for manufacturing the same, a thin film transistor array panel including the wire, and a method for manufacturing the same |
Dec. 29, 2009 |
| 7622809 |
Display device and sputtering target for producing the same |
Nov. 24, 2009 |
| 7615868 |
Electrode, method for producing same and semiconductor device using same |
Nov. 10, 2009 |
| 7531904 |
Al-Ni-B alloy wiring material and element structure using the same |
May. 12, 2009 |
| 7521276 |
Compliant terminal mountings with vented spaces and methods |
Apr. 21, 2009 |
| 7501706 |
Semiconductor devices to reduce stress on a metal interconnect |
Mar. 10, 2009 |
| 7425765 |
Zinc-aluminum solder alloy |
Sep. 16, 2008 |
| 7411219 |
Uniform contact |
Aug. 12, 2008 |
|
|
|
