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Class Information
Number: 257/771
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Alloy containing aluminum
Description: Subject matter wherein the specific contact or lead material is an alloy containing aluminum (Al).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7425765 |
Zinc-aluminum solder alloy |
Sep. 16, 2008 |
| 7411219 |
Uniform contact |
Aug. 12, 2008 |
| 7247552 |
Integrated circuit having structural support for a flip-chip interconnect pad and method therefor |
Jul. 24, 2007 |
| 7242098 |
Barrier film integrity on porous low k dielectrics by application of a hydrocarbon plasma treatment |
Jul. 10, 2007 |
| 7235844 |
Power composite integrated semiconductor device and manufacturing method thereof |
Jun. 26, 2007 |
| 7235310 |
Hillock-free aluminum layer and method of forming the same |
Jun. 26, 2007 |
| 7224065 |
Contact/via force fill techniques and resulting structures |
May. 29, 2007 |
| 7215029 |
Multilayer interconnection structure of a semiconductor |
May. 8, 2007 |
| 7193326 |
Mold type semiconductor device |
Mar. 20, 2007 |
| 7166921 |
Aluminum alloy film for wiring and sputter target material for forming the film |
Jan. 23, 2007 |
| 7154180 |
Electronic device, method of manufacture of the same, and sputtering target |
Dec. 26, 2006 |
| 7141861 |
Semiconductor device and manufacturing method there |
Nov. 28, 2006 |
| 7129582 |
Reducing the migration of grain boundaries |
Oct. 31, 2006 |
| 7119418 |
Supercritical fluid-assisted deposition of materials on semiconductor substrates |
Oct. 10, 2006 |
| 7098539 |
Electronic device, method of manufacture of the same, and sputtering target |
Aug. 29, 2006 |
| 7078733 |
Aluminum alloyed layered structure for an optical device |
Jul. 18, 2006 |
| 7071563 |
Barrier layer for interconnect structures of a semiconductor wafer and method for depositing the barrier layer |
Jul. 4, 2006 |
| 7045831 |
Semiconductor device |
May. 16, 2006 |
| 6979882 |
Electronic device and method for manufacturing the same |
Dec. 27, 2005 |
| 6955980 |
Reducing the migration of grain boundaries |
Oct. 18, 2005 |
| 6929726 |
Sputtering target, Al interconnection film, and electronic component |
Aug. 16, 2005 |
| 6930355 |
Silicided trench gate power mosfets ultrasonically bonded to a surface source electrode |
Aug. 16, 2005 |
| 6891277 |
Semiconductor device alignment mark having oxidation prevention cover film |
May. 10, 2005 |
| 6885064 |
Contact structure of wiring and a method for manufacturing the same |
Apr. 26, 2005 |
| 6878465 |
Under bump metallurgy for Lead-Tin bump over copper pad |
Apr. 12, 2005 |
| 6867496 |
Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument |
Mar. 15, 2005 |
| 6864579 |
Carrier with a metal area and at least one chip configured on the metal area |
Mar. 8, 2005 |
| 6861756 |
Semiconductor integrated circuit device and fabrication process thereof |
Mar. 1, 2005 |
| 6861759 |
Semiconductor apparatus of which reliability of interconnections is improved and manufacturing method of the same |
Mar. 1, 2005 |
| 6855977 |
Memory device with a self-assembled polymer film and method of making the same |
Feb. 15, 2005 |
| 6856018 |
Semiconductor device and method of manufacture thereof |
Feb. 15, 2005 |
| 6853077 |
Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same |
Feb. 8, 2005 |
| 6844628 |
Electronic device and method for manufacturing the same |
Jan. 18, 2005 |
| 6838774 |
Interlocking conductor method for bonding wafers to produce stacked integrated circuits |
Jan. 4, 2005 |
| 6833623 |
Enhanced barrier liner formation for via |
Dec. 21, 2004 |
| 6815326 |
Method of manufacturing semiconductor electrode and semiconductor device provided with electrodes manufactured by the method |
Nov. 9, 2004 |
| 6791188 |
Thin film aluminum alloy and sputtering target to form the same |
Sep. 14, 2004 |
| 6777810 |
Interconnection alloy for integrated circuits |
Aug. 17, 2004 |
| 6768203 |
Open-bottomed via liner structure and method for fabricating same |
Jul. 27, 2004 |
| 6762501 |
Low stress integrated circuit copper interconnect structures |
Jul. 13, 2004 |
| 6736947 |
Sputtering target, A1 interconnection film, and electronic component |
May. 18, 2004 |
| 6717191 |
Aluminum-beryllium alloys for air bridges |
Apr. 6, 2004 |
| 6690092 |
Multilayer interconnection structure of a semiconductor device |
Feb. 10, 2004 |
| 6690077 |
Antireflective coating and field emission display device, semiconductor device and wiring line comprising same |
Feb. 10, 2004 |
| 6686661 |
Thin film transistor having a copper alloy wire |
Feb. 3, 2004 |
| 6650017 |
Electrical wiring of semiconductor device enabling increase in electromigration (EM) lifetime |
Nov. 18, 2003 |
| 6646346 |
Integrated circuit metallization using a titanium/aluminum alloy |
Nov. 11, 2003 |
| 6624519 |
Aluminum based alloy bridge structure and method of forming same |
Sep. 23, 2003 |
| 6614105 |
Chip-type semiconductor device |
Sep. 2, 2003 |
| 6614119 |
Semiconductor device and method of fabricating the same |
Sep. 2, 2003 |
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