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Class Information
Number: 257/768
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Refractory or platinum group metal or alloy or silicide thereof
Description: Subject matter wherein the specified contact or lead material is a refractory metal or a platinum group metal, i.e., a metal found in groups IVA, VA, VIA or VIIIA (other than iron (Fe), nickel (Ni) or cobalt (Co)) of the periodic table of the elements or a silicide (i.e., a binary compound of silicon), usually with a more electropositive element or radical, thereof.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7449782 |
Self-aligned metal to form contacts to Ge containing substrates and structure formed thereby |
Nov. 11, 2008 |
| 7436067 |
Methods for forming conductive structures and structures regarding same |
Oct. 14, 2008 |
| 7432202 |
Method of substrate manufacture that decreases the package resistance |
Oct. 7, 2008 |
| 7429781 |
Memory package |
Sep. 30, 2008 |
| 7422707 |
Highly conductive composition for wafer coating |
Sep. 9, 2008 |
| 7420227 |
Cu-metalized compound semiconductor device |
Sep. 2, 2008 |
| 7420998 |
Semiconductor laser device |
Sep. 2, 2008 |
| 7414291 |
Semiconductor device and method of manufacturing the same |
Aug. 19, 2008 |
| 7399702 |
Methods of forming silicide |
Jul. 15, 2008 |
| 7385287 |
Preventing damage to low-k materials during resist stripping |
Jun. 10, 2008 |
| 7368823 |
Semiconductor device and method of manufacturing the same |
May. 6, 2008 |
| 7348265 |
Semiconductor device having a silicided gate electrode and method of manufacture therefor |
Mar. 25, 2008 |
| 7332435 |
Silicide structure for ultra-shallow junction for MOS devices |
Feb. 19, 2008 |
| 7323783 |
Electrode, method for producing same and semiconductor device using same |
Jan. 29, 2008 |
| 7303988 |
Methods of manufacturing multi-level metal lines in semiconductor devices |
Dec. 4, 2007 |
| 7291920 |
Semiconductor structures |
Nov. 6, 2007 |
| 7256498 |
Resistance-reduced semiconductor device and methods for fabricating the same |
Aug. 14, 2007 |
| 7244996 |
Structure of a field effect transistor having metallic silicide and manufacturing method thereof |
Jul. 17, 2007 |
| 7230304 |
Electric contacts and method of manufacturing thereof, and vacuum interrupter and vacuum circuit breaker using thereof |
Jun. 12, 2007 |
| 7180109 |
Field effect transistor and method of fabrication |
Feb. 20, 2007 |
| 7161246 |
Interconnect alloys and methods and apparatus using same |
Jan. 9, 2007 |
| 7157798 |
Selective refractory metal and nitride capping |
Jan. 2, 2007 |
| 7115997 |
Seedless wirebond pad plating |
Oct. 3, 2006 |
| 7098503 |
Circuitry and capacitors comprising roughened platinum layers |
Aug. 29, 2006 |
| 7078733 |
Aluminum alloyed layered structure for an optical device |
Jul. 18, 2006 |
| 7038318 |
Compound structure for reduced contact resistance |
May. 2, 2006 |
| 7009279 |
Semiconductor device configured for suppressed germanium diffusion from a germanium-doped regions and a method for fabrication thereof |
Mar. 7, 2006 |
| 6998714 |
Selectively coating bond pads |
Feb. 14, 2006 |
| 6998649 |
Semiconductor light-emitting device |
Feb. 14, 2006 |
| 6989599 |
Semiconductor device with layered interconnect structure |
Jan. 24, 2006 |
| 6949827 |
Semiconductor device with novel film composition |
Sep. 27, 2005 |
| 6919636 |
Interconnects with a dielectric sealant layer |
Jul. 19, 2005 |
| 6917112 |
Conductive semiconductor structures containing metal oxide regions |
Jul. 12, 2005 |
| 6917111 |
Semiconductor device having cell plugs |
Jul. 12, 2005 |
| 6906420 |
Semiconductor device |
Jun. 14, 2005 |
| 6906370 |
Semiconductor component having a material reinforced contact area |
Jun. 14, 2005 |
| 6896976 |
Tin antimony solder for MOSFET with TiNiAg back metal |
May. 24, 2005 |
| 6891274 |
Under-bump-metallurgy layer for improving adhesion |
May. 10, 2005 |
| 6882052 |
Plasma enhanced liner |
Apr. 19, 2005 |
| 6873020 |
High/low work function metal alloys for integrated circuit electrodes |
Mar. 29, 2005 |
| 6872639 |
Fabrication of semiconductor devices with transition metal boride films as diffusion barriers |
Mar. 29, 2005 |
| 6867130 |
Enhanced silicidation of polysilicon gate electrodes |
Mar. 15, 2005 |
| 6853081 |
Method for fabricating semiconductor integrated circuit |
Feb. 8, 2005 |
| 6841879 |
Semiconductor device |
Jan. 11, 2005 |
| 6835980 |
Semiconductor device with novel film composition |
Dec. 28, 2004 |
| 6833625 |
Self-aligned barrier formed with an alloy having at least two dopant elements for minimized resistance of interconnect |
Dec. 21, 2004 |
| 6830820 |
Chemical vapor deposition of titanium |
Dec. 14, 2004 |
| 6822307 |
Semiconductor triode device having a compound-semiconductor channel layer |
Nov. 23, 2004 |
| 6812569 |
Semiconductor device using bumps, method for fabricating same, and method for forming bumps |
Nov. 2, 2004 |
| 6806573 |
Low angle, low energy physical vapor deposition of alloys |
Oct. 19, 2004 |
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