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Class Information
Number: 257/767
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Resistive to electromigration or diffusion of the contact or lead material
Description: Subject matter wherein an electrical contact or lead material is adapted to resist electromigration of the contact or lead material, or diffusion of the contact or lead material into the material to which the contact is attached.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7598614 |
Low leakage metal-containing cap process using oxidation |
Oct. 6, 2009 |
| 7586198 |
Innerlayer panels and printed wiring boards with embedded fiducials |
Sep. 8, 2009 |
| 7547972 |
Laminated structure, very-large-scale integrated circuit wiring board, and method of formation thereof |
Jun. 16, 2009 |
| 7533193 |
Apparatus and method for reducing electromigration |
May. 12, 2009 |
| 7511378 |
Enhancement of performance of a conductive wire in a multilayered substrate |
Mar. 31, 2009 |
| 7508082 |
Semiconductor device and method of manufacturing the same |
Mar. 24, 2009 |
| 7504674 |
Electronic apparatus having a core conductive structure within an insulating layer |
Mar. 17, 2009 |
| 7495317 |
Semiconductor package with ferrite shielding structure |
Feb. 24, 2009 |
| 7495338 |
Metal capped copper interconnect |
Feb. 24, 2009 |
| 7446392 |
Electronic device and method for manufacturing the same |
Nov. 4, 2008 |
| 7436066 |
Semiconductor element |
Oct. 14, 2008 |
| 7422977 |
Copper adhesion improvement device and method |
Sep. 9, 2008 |
| 7414275 |
Multi-level interconnections for an integrated circuit chip |
Aug. 19, 2008 |
| 7397126 |
Semiconductor device |
Jul. 8, 2008 |
| 7372160 |
Barrier film deposition over metal for reduction in metal dishing after CMP |
May. 13, 2008 |
| 7339274 |
Metallization performance in electronic devices |
Mar. 4, 2008 |
| 7339270 |
Semiconductor device and method for fabricating the same |
Mar. 4, 2008 |
| 7332814 |
Bondwire utilized for coulomb counting and safety circuits |
Feb. 19, 2008 |
| 7327031 |
Semiconductor device and method of manufacturing the same |
Feb. 5, 2008 |
| 7303988 |
Methods of manufacturing multi-level metal lines in semiconductor devices |
Dec. 4, 2007 |
| 7301241 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 27, 2007 |
| 7301239 |
Wiring structure to minimize stress induced void formation |
Nov. 27, 2007 |
| 7298021 |
Electronic device and method for manufacturing the same |
Nov. 20, 2007 |
| 7276796 |
Formation of oxidation-resistant seed layer for interconnect applications |
Oct. 2, 2007 |
| 7271097 |
Method for manufacturing a semiconductor protection element and a semiconductor device |
Sep. 18, 2007 |
| 7271700 |
Thin film resistor with current density enhancing layer (CDEL) |
Sep. 18, 2007 |
| 7265450 |
Semiconductor device and method for fabricating the same |
Sep. 4, 2007 |
| 7262473 |
Metal to polysilicon contact in oxygen environment |
Aug. 28, 2007 |
| 7242097 |
Electromigration barrier layers for solder joints |
Jul. 10, 2007 |
| 7238626 |
Chemically and electrically stabilized polymer films |
Jul. 3, 2007 |
| 7235844 |
Power composite integrated semiconductor device and manufacturing method thereof |
Jun. 26, 2007 |
| 7233071 |
Low-k dielectric layer based upon carbon nanostructures |
Jun. 19, 2007 |
| 7224063 |
Dual-damascene metallization interconnection |
May. 29, 2007 |
| 7224009 |
Method for forming a low leakage contact in a CMOS imager |
May. 29, 2007 |
| 7215029 |
Multilayer interconnection structure of a semiconductor |
May. 8, 2007 |
| 7205667 |
Semiconductor device having copper wiring |
Apr. 17, 2007 |
| 7196420 |
Method and structure for creating ultra low resistance damascene copper wiring |
Mar. 27, 2007 |
| 7193327 |
Barrier structure for semiconductor devices |
Mar. 20, 2007 |
| 7187080 |
Semiconductor device with a conductive layer including a copper layer with a dopant |
Mar. 6, 2007 |
| 7187079 |
Stacked memory cell having diffusion barriers |
Mar. 6, 2007 |
| 7164205 |
Semiconductor carrier film, and semiconductor device and liquid crystal module using the same |
Jan. 16, 2007 |
| 7164206 |
Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer |
Jan. 16, 2007 |
| 7164207 |
Wiring structure for semiconductor device |
Jan. 16, 2007 |
| 7151315 |
Method of a non-metal barrier copper damascene integration |
Dec. 19, 2006 |
| 7145241 |
Semiconductor device having a multilayer interconnection structure and fabrication process thereof |
Dec. 5, 2006 |
| 7141880 |
Metal line stacking structure in semiconductor device and formation method thereof |
Nov. 28, 2006 |
| 7129582 |
Reducing the migration of grain boundaries |
Oct. 31, 2006 |
| 7115997 |
Seedless wirebond pad plating |
Oct. 3, 2006 |
| 7088000 |
Method and structure to wire electronic devices |
Aug. 8, 2006 |
| 7087999 |
Semiconductor protection element, semiconductor device and method for manufacturing same |
Aug. 8, 2006 |
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