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Class Information
Number: 257/767
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Resistive to electromigration or diffusion of the contact or lead material
Description: Subject matter wherein an electrical contact or lead material is adapted to resist electromigration of the contact or lead material, or diffusion of the contact or lead material into the material to which the contact is attached.










Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8710660 Hybrid interconnect scheme including aluminum metal line in low-k dielectric Apr. 29, 2014
8669177 Semiconductor device and method for manufacturing semiconductor device Mar. 11, 2014
8669182 Metal cap with ultra-low .kappa. dielectric material for circuit interconnect applications Mar. 11, 2014
8659156 Interconnect structure with an electromigration and stress migration enhancement liner Feb. 25, 2014
8653664 Barrier layers for copper interconnect Feb. 18, 2014
8642444 Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera Feb. 4, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8624395 Redundancy design with electro-migration immunity and method of manufacture Jan. 7, 2014
8592107 Method and apparatus of providing overlay Nov. 26, 2013
8580687 Semiconductor structure and method for making same Nov. 12, 2013
8446012 Interconnect structures May. 21, 2013
8432031 Semiconductor die including a current routing line having non-metallic slots Apr. 30, 2013
8432037 Semiconductor device with a line and method of fabrication thereof Apr. 30, 2013
8426307 Reducing resistivity in interconnect structures of integrated circuits Apr. 23, 2013
8378490 Semiconductor apparatus including a metal alloy between a first contact and a second contact Feb. 19, 2013
8354751 Interconnect structure for electromigration enhancement Jan. 15, 2013
8329360 Method and apparatus of providing overlay Dec. 11, 2012
8278759 Structures for measuring misalignment of patterns Oct. 2, 2012
8247905 Formation of vertical devices by electroplating Aug. 21, 2012
8232643 Lead free solder interconnections for integrated circuits Jul. 31, 2012
8222086 Integrated semiconductor substrate structure using incompatible processes Jul. 17, 2012
8188600 Semiconductor device and method of fabricating the same May. 29, 2012
8159068 Semiconductor device Apr. 17, 2012
8138603 Redundancy design with electro-migration immunity Mar. 20, 2012
8138604 Metal cap with ultra-low k dielectric material for circuit interconnect applications Mar. 20, 2012
8119520 Semiconductor device and method for manufacturing the same Feb. 21, 2012
8120180 Semiconductor device including ruthenium electrode and method for fabricating the same Feb. 21, 2012
8115264 Semiconductor device having a metal gate with a low sheet resistance and method of fabricating metal gate of the same Feb. 14, 2012
8102049 Semiconductor device including through electrode and method of manufacturing the same Jan. 24, 2012
8102668 Semiconductor device package with internal device protection Jan. 24, 2012
8093729 Electrically conductive interconnect system and method Jan. 10, 2012
8084864 Electromigration resistant aluminum-based metal interconnect structure Dec. 27, 2011
8080879 Electrode structures for LEDs with increased active area Dec. 20, 2011
8072075 CuSiN/SiN diffusion barrier for copper in integrated-circuit devices Dec. 6, 2011
8053863 Electrical fuse and semiconductor device Nov. 8, 2011
8053895 Metal line of semiconductor device having a multilayer molybdenum diffusion barrier and method for forming the same Nov. 8, 2011
8056039 Interconnect structure for integrated circuits having improved electromigration characteristics Nov. 8, 2011
7994640 Nanoparticle cap layer Aug. 9, 2011
7977798 Integrated circuit having a semiconductor substrate with a barrier layer Jul. 12, 2011
7956463 Large grain size conductive structure for narrow interconnect openings Jun. 7, 2011
7956469 Light emitting device and method of manufacturing the same Jun. 7, 2011
7951708 Copper interconnect structure with amorphous tantalum iridium diffusion barrier May. 31, 2011
7944041 Integrated semiconductor substrate structure using incompatible processes May. 17, 2011
7936069 Semiconductor device with a line and method of fabrication thereof May. 3, 2011
7932609 Semiconductor device having groove-shaped via-hole Apr. 26, 2011
7923839 Semiconductor device and method for fabricating semiconductor device Apr. 12, 2011
7919832 Stack resistor structure for integrated circuits Apr. 5, 2011
7919845 Formation of a hybrid integrated circuit device Apr. 5, 2011
7910967 Ferroelectric capacitor having three-dimensional structure, nonvolatile memory device having the same and method of fabricating the same Mar. 22, 2011
7875976 Semiconductor device including a silicide layer and a dielectric layer Jan. 25, 2011

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