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Class Information
Number: 257/767
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Resistive to electromigration or diffusion of the contact or lead material
Description: Subject matter wherein an electrical contact or lead material is adapted to resist electromigration of the contact or lead material, or diffusion of the contact or lead material into the material to which the contact is attached.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7446392 |
Electronic device and method for manufacturing the same |
Nov. 4, 2008 |
| 7436066 |
Semiconductor element |
Oct. 14, 2008 |
| 7422977 |
Copper adhesion improvement device and method |
Sep. 9, 2008 |
| 7414275 |
Multi-level interconnections for an integrated circuit chip |
Aug. 19, 2008 |
| 7397126 |
Semiconductor device |
Jul. 8, 2008 |
| 7372160 |
Barrier film deposition over metal for reduction in metal dishing after CMP |
May. 13, 2008 |
| 7339274 |
Metallization performance in electronic devices |
Mar. 4, 2008 |
| 7339270 |
Semiconductor device and method for fabricating the same |
Mar. 4, 2008 |
| 7332814 |
Bondwire utilized for coulomb counting and safety circuits |
Feb. 19, 2008 |
| 7327031 |
Semiconductor device and method of manufacturing the same |
Feb. 5, 2008 |
| 7303988 |
Methods of manufacturing multi-level metal lines in semiconductor devices |
Dec. 4, 2007 |
| 7301239 |
Wiring structure to minimize stress induced void formation |
Nov. 27, 2007 |
| 7301241 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 27, 2007 |
| 7298021 |
Electronic device and method for manufacturing the same |
Nov. 20, 2007 |
| 7276796 |
Formation of oxidation-resistant seed layer for interconnect applications |
Oct. 2, 2007 |
| 7271700 |
Thin film resistor with current density enhancing layer (CDEL) |
Sep. 18, 2007 |
| 7271097 |
Method for manufacturing a semiconductor protection element and a semiconductor device |
Sep. 18, 2007 |
| 7265450 |
Semiconductor device and method for fabricating the same |
Sep. 4, 2007 |
| 7262473 |
Metal to polysilicon contact in oxygen environment |
Aug. 28, 2007 |
| 7242097 |
Electromigration barrier layers for solder joints |
Jul. 10, 2007 |
| 7238626 |
Chemically and electrically stabilized polymer films |
Jul. 3, 2007 |
| 7235844 |
Power composite integrated semiconductor device and manufacturing method thereof |
Jun. 26, 2007 |
| 7233071 |
Low-k dielectric layer based upon carbon nanostructures |
Jun. 19, 2007 |
| 7224063 |
Dual-damascene metallization interconnection |
May. 29, 2007 |
| 7224009 |
Method for forming a low leakage contact in a CMOS imager |
May. 29, 2007 |
| 7215029 |
Multilayer interconnection structure of a semiconductor |
May. 8, 2007 |
| 7205667 |
Semiconductor device having copper wiring |
Apr. 17, 2007 |
| 7196420 |
Method and structure for creating ultra low resistance damascene copper wiring |
Mar. 27, 2007 |
| 7193327 |
Barrier structure for semiconductor devices |
Mar. 20, 2007 |
| 7187079 |
Stacked memory cell having diffusion barriers |
Mar. 6, 2007 |
| 7187080 |
Semiconductor device with a conductive layer including a copper layer with a dopant |
Mar. 6, 2007 |
| 7164206 |
Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer |
Jan. 16, 2007 |
| 7164205 |
Semiconductor carrier film, and semiconductor device and liquid crystal module using the same |
Jan. 16, 2007 |
| 7164207 |
Wiring structure for semiconductor device |
Jan. 16, 2007 |
| 7151315 |
Method of a non-metal barrier copper damascene integration |
Dec. 19, 2006 |
| 7145241 |
Semiconductor device having a multilayer interconnection structure and fabrication process thereof |
Dec. 5, 2006 |
| 7141880 |
Metal line stacking structure in semiconductor device and formation method thereof |
Nov. 28, 2006 |
| 7129582 |
Reducing the migration of grain boundaries |
Oct. 31, 2006 |
| 7115997 |
Seedless wirebond pad plating |
Oct. 3, 2006 |
| 7088000 |
Method and structure to wire electronic devices |
Aug. 8, 2006 |
| 7087999 |
Semiconductor protection element, semiconductor device and method for manufacturing same |
Aug. 8, 2006 |
| 7081676 |
Structure for controlling the interface roughness of cobalt disilicide |
Jul. 25, 2006 |
| 7061115 |
Interconnect line selectively isolated from an underlying contact plug |
Jun. 13, 2006 |
| 7042099 |
Semiconductor device containing a dummy wire |
May. 9, 2006 |
| 7034398 |
Semiconductor device having contact plug and buried conductive film therein |
Apr. 25, 2006 |
| 7030493 |
Semiconductor device having layered interconnect structure with a copper or platinum conducting film and a neighboring film |
Apr. 18, 2006 |
| 7030492 |
Under bump metallurgic layer |
Apr. 18, 2006 |
| 6992389 |
Barrier for interconnect and method |
Jan. 31, 2006 |
| 6989599 |
Semiconductor device with layered interconnect structure |
Jan. 24, 2006 |
| 6979882 |
Electronic device and method for manufacturing the same |
Dec. 27, 2005 |
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