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Class Information
Number: 257/766
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer containing chromium or nickel
Description: Subject matter wherein a layered electrical contact or lead has at least one layer containing chromium (Cr) or nickel (Ni).

Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
8658914 Electronic component device and method for manufacturing the same Feb. 25, 2014
8647974 Method of fabricating a semiconductor chip with supportive terminal pad Feb. 11, 2014
8637392 Solder interconnect with non-wettable sidewall pillars and methods of manufacture Jan. 28, 2014
8633589 Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques Jan. 21, 2014
8623752 Ohmic electrode for SiC semiconductor, method of manufacturing ohmic electrode for SiC semiconductor, semiconductor device, and method of manufacturing semiconductor device Jan. 7, 2014
8587112 Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack Nov. 19, 2013
8581379 Lead frame and semiconductor device Nov. 12, 2013
8541096 Printed circuit board and method of manufacturing the same Sep. 24, 2013
8456010 Semiconductor device Jun. 4, 2013
8431484 Stable electroless fine pitch interconnect plating Apr. 30, 2013
8426971 Top tri-metal system for silicon power semiconductor devices Apr. 23, 2013
8405109 Low resistance electrode and compound semiconductor light emitting device including the same Mar. 26, 2013
8378490 Semiconductor apparatus including a metal alloy between a first contact and a second contact Feb. 19, 2013
8354692 Vertical semiconductor power switch, electronic component and methods of producing the same Jan. 15, 2013
8344455 Semiconductor device and fabrication method for the same Jan. 1, 2013
8338954 Semiconductor apparatus and fabrication method thereof Dec. 25, 2012
8324621 Semiconductor device having oxide semiconductor layer Dec. 4, 2012
RE43807 Microcircuit package having ductile layer Nov. 20, 2012
8314494 Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices Nov. 20, 2012
8314500 Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers Nov. 20, 2012
8287992 Flexible board Oct. 16, 2012
8288867 Semiconductor constructions Oct. 16, 2012
8283760 Lead frame interconnect scheme with high power density Oct. 9, 2012
8273631 Method of fabricating n-channel metal-oxide semiconductor transistor Sep. 25, 2012
8247836 Nickel tin bonding system with barrier layer for semiconductor wafers and devices Aug. 21, 2012
8237262 Method and system for innovative substrate/package design for a high performance integrated circuit chipset Aug. 7, 2012
8232655 Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack Jul. 31, 2012
8232643 Lead free solder interconnections for integrated circuits Jul. 31, 2012
8222740 Zinc oxide based composites and methods for their fabrication Jul. 17, 2012
8148231 Method of fabricating capacitor Apr. 3, 2012
8148819 Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device Apr. 3, 2012
8101871 Aluminum bond pads with enhanced wire bond stability Jan. 24, 2012
8076781 Semiconductor device and manufacturing method of the same Dec. 13, 2011
8026583 Flip-chip module and method for the production thereof Sep. 27, 2011
8022550 Semiconductor integrated circuit device Sep. 20, 2011
8013362 Semiconductor integrated circuit and multi-chip module Sep. 6, 2011
7960746 Low resistance electrode and compound semiconductor light emitting device including the same Jun. 14, 2011
7956445 Packaged integrated circuit having gold removed from a lead frame Jun. 7, 2011
7956442 Backside connection to TSVs having redistribution lines Jun. 7, 2011
7956472 Packaging substrate having electrical connection structure and method for fabricating the same Jun. 7, 2011
7936065 Semiconductor devices and method of manufacturing them May. 3, 2011
7932593 Multipackage module having stacked packages with asymmetrically arranged die and molding Apr. 26, 2011
7879722 Semiconductor device and method of manufacturing the same Feb. 1, 2011
7875545 Silicon-rich nickel-silicide ohmic contacts for SiC semiconductor devices Jan. 25, 2011
7867816 Method and system for innovative substrate/package design for a high performance integrated circuit chipset Jan. 11, 2011
7855454 Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures Dec. 21, 2010
7855459 Modified gold-tin system with increased melting temperature for wafer bonding Dec. 21, 2010
7851913 Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart Dec. 14, 2010
7834461 Semiconductor apparatus Nov. 16, 2010
7825516 Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures Nov. 2, 2010

1 2 3 4 5 6 7 8 9

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