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Class Information
Number: 257/766
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer containing chromium or nickel
Description: Subject matter wherein a layered electrical contact or lead has at least one layer containing chromium (Cr) or nickel (Ni).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615491 |
Defectivity and process control of electroless deposition in microelectronics applications |
Nov. 10, 2009 |
| 7615867 |
Thin-film transistor, method of manufacturing the same, liquid crystal display panel having the same and electro-luminescence display panel having the same |
Nov. 10, 2009 |
| 7611987 |
Defectivity and process control of electroless deposition in microelectronics applications |
Nov. 3, 2009 |
| 7611988 |
Defectivity and process control of electroless deposition in microelectronics applications |
Nov. 3, 2009 |
| 7579696 |
Semiconductor device |
Aug. 25, 2009 |
| 7575994 |
Semiconductor device and manufacturing method of the same |
Aug. 18, 2009 |
| 7554202 |
Semiconductor integrated circuit device |
Jun. 30, 2009 |
| 7547972 |
Laminated structure, very-large-scale integrated circuit wiring board, and method of formation thereof |
Jun. 16, 2009 |
| 7545043 |
Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same |
Jun. 9, 2009 |
| 7473642 |
Method for fabricating conductive layer |
Jan. 6, 2009 |
| 7474003 |
Semiconductor integrated circuit device |
Jan. 6, 2009 |
| 7470993 |
Semiconductor component with passivation layer |
Dec. 30, 2008 |
| 7432584 |
Leadframe for use in a semiconductor package |
Oct. 7, 2008 |
| 7411303 |
Semiconductor assembly having substrate with electroplated contact pads |
Aug. 12, 2008 |
| 7410899 |
Defectivity and process control of electroless deposition in microelectronics applications |
Aug. 12, 2008 |
| 7385294 |
Semiconductor device having nickel silicide and method of fabricating nickel silicide |
Jun. 10, 2008 |
| 7375414 |
High permeability layered films to reduce noise in high speed interconnects |
May. 20, 2008 |
| 7368326 |
Methods and apparatus to reduce growth formations on plated conductive leads |
May. 6, 2008 |
| 7358170 |
Methods of forming conductive interconnects, and methods of depositing nickel |
Apr. 15, 2008 |
| 7303988 |
Methods of manufacturing multi-level metal lines in semiconductor devices |
Dec. 4, 2007 |
| 7268425 |
Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
Sep. 11, 2007 |
| 7253501 |
High performance metallization cap layer |
Aug. 7, 2007 |
| 7253519 |
Chip packaging structure having redistribution layer with recess |
Aug. 7, 2007 |
| 7250682 |
Semiconductor integrated circuit device |
Jul. 31, 2007 |
| 7233072 |
Electronic part and surface treatment method of the same |
Jun. 19, 2007 |
| 7227231 |
Semiconductor integrated circuit device |
Jun. 5, 2007 |
| 7224066 |
Bonding material and circuit device using the same |
May. 29, 2007 |
| 7208828 |
Semiconductor package with wire bonded stacked dice and multi-layer metal bumps |
Apr. 24, 2007 |
| 7202556 |
Semiconductor package having substrate with multi-layer metal bumps |
Apr. 10, 2007 |
| 7166921 |
Aluminum alloy film for wiring and sputter target material for forming the film |
Jan. 23, 2007 |
| 7164205 |
Semiconductor carrier film, and semiconductor device and liquid crystal module using the same |
Jan. 16, 2007 |
| 7154180 |
Electronic device, method of manufacture of the same, and sputtering target |
Dec. 26, 2006 |
| 7135773 |
Integrated circuit chip utilizing carbon nanotube composite interconnection vias |
Nov. 14, 2006 |
| 7135770 |
Semiconductor element with conductive columnar projection and a semiconductor device with conductive columnar projection |
Nov. 14, 2006 |
| 7129534 |
Magneto-resistive memory and method of manufacturing the same |
Oct. 31, 2006 |
| 7115992 |
Electrode structure for use in an integrated circuit |
Oct. 3, 2006 |
| 7105928 |
Copper wiring with high temperature superconductor (HTS) layer |
Sep. 12, 2006 |
| 7102229 |
Capacitor containing high purity tantalum |
Sep. 5, 2006 |
| 7098539 |
Electronic device, method of manufacture of the same, and sputtering target |
Aug. 29, 2006 |
| 7078809 |
Chemical leadframe roughening process and resulting leadframe and integrated circuit package |
Jul. 18, 2006 |
| 7075113 |
Semiconductor device and method for fabricating the same |
Jul. 11, 2006 |
| 7067924 |
Nickel bonding cap over copper metalized bondpads |
Jun. 27, 2006 |
| 7052922 |
Stable electroless fine pitch interconnect plating |
May. 30, 2006 |
| 7045831 |
Semiconductor device |
May. 16, 2006 |
| 7034398 |
Semiconductor device having contact plug and buried conductive film therein |
Apr. 25, 2006 |
| 7002253 |
Semiconductor device and design method thereof |
Feb. 21, 2006 |
| 6998690 |
Gallium nitride based III-V group compound semiconductor device and method of producing the same |
Feb. 14, 2006 |
| 6995475 |
I/C chip suitable for wire bonding |
Feb. 7, 2006 |
| 6992397 |
Electroless nickel immersion gold semiconductor flip chip package |
Jan. 31, 2006 |
| 6992389 |
Barrier for interconnect and method |
Jan. 31, 2006 |
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