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Class Information
Number: 257/765
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer of an alloy containing aluminum
Description: Subject matter wherein a layered electrical contact or lead has at least one layer of an alloy containing aluminum (Al).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615868 |
Electrode, method for producing same and semiconductor device using same |
Nov. 10, 2009 |
| 7566964 |
Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures |
Jul. 28, 2009 |
| 7564061 |
Field effect transistor and production method thereof |
Jul. 21, 2009 |
| 7547916 |
Electronic circuit |
Jun. 16, 2009 |
| 7545040 |
Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device |
Jun. 9, 2009 |
| 7531904 |
Al-Ni-B alloy wiring material and element structure using the same |
May. 12, 2009 |
| 7518245 |
Contact structure of a semiconductor device |
Apr. 14, 2009 |
| 7507996 |
Contact structure of a wiring and a thin film transistor array panel including the same |
Mar. 24, 2009 |
| 7501706 |
Semiconductor devices to reduce stress on a metal interconnect |
Mar. 10, 2009 |
| 7495339 |
Connection structure and method for fabricating the same |
Feb. 24, 2009 |
| 7482693 |
Top layers of metal for high performance IC's |
Jan. 27, 2009 |
| 7470992 |
Barrier layer stack to prevent Ti diffusion |
Dec. 30, 2008 |
| 7456468 |
Semiconductor device including high-k insulating layer and method of manufacturing the same |
Nov. 25, 2008 |
| 7446392 |
Electronic device and method for manufacturing the same |
Nov. 4, 2008 |
| 7436065 |
Electrode contact structure |
Oct. 14, 2008 |
| 7425765 |
Zinc-aluminum solder alloy |
Sep. 16, 2008 |
| 7420277 |
System for heat dissipation in semiconductor devices |
Sep. 2, 2008 |
| 7358611 |
System and method for adjusting the ratio of deposition times to optimize via density and via fill in aluminum multilayer metallization |
Apr. 15, 2008 |
| 7335990 |
Process of forming a composite diffusion barrier in copper/organic low-k damascene technology |
Feb. 26, 2008 |
| 7323783 |
Electrode, method for producing same and semiconductor device using same |
Jan. 29, 2008 |
| 7307344 |
Semiconductor device including a discontinuous film and method for manufacturing the same |
Dec. 11, 2007 |
| 7303988 |
Methods of manufacturing multi-level metal lines in semiconductor devices |
Dec. 4, 2007 |
| RE39932 |
Semiconductor interconnect formed over an insulation and having moisture resistant material |
Dec. 4, 2007 |
| 7301241 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 27, 2007 |
| 7298021 |
Electronic device and method for manufacturing the same |
Nov. 20, 2007 |
| 7294565 |
Method of fabricating a wire bond pad with Ni/Au metallization |
Nov. 13, 2007 |
| 7294570 |
Contact integration method |
Nov. 13, 2007 |
| 7294851 |
Dense seed layer and method of formation |
Nov. 13, 2007 |
| 7294858 |
Semiconductor device and method of manufacturing the same |
Nov. 13, 2007 |
| 7276795 |
Small grain size, conformal aluminum interconnects and method for their formation |
Oct. 2, 2007 |
| 7253501 |
High performance metallization cap layer |
Aug. 7, 2007 |
| 7253519 |
Chip packaging structure having redistribution layer with recess |
Aug. 7, 2007 |
| 7235844 |
Power composite integrated semiconductor device and manufacturing method thereof |
Jun. 26, 2007 |
| 7226858 |
Submicron contact fill using a CVD TiN barrier and high temperature PVD aluminum alloy deposition |
Jun. 5, 2007 |
| 7224065 |
Contact/via force fill techniques and resulting structures |
May. 29, 2007 |
| 7224066 |
Bonding material and circuit device using the same |
May. 29, 2007 |
| 7215029 |
Multilayer interconnection structure of a semiconductor |
May. 8, 2007 |
| 7193326 |
Mold type semiconductor device |
Mar. 20, 2007 |
| 7189645 |
System and method for adjusting the ratio of deposition times to optimize via density and via fill in aluminum multilayer metallization |
Mar. 13, 2007 |
| 7166921 |
Aluminum alloy film for wiring and sputter target material for forming the film |
Jan. 23, 2007 |
| 7161211 |
Aluminum-containing film derived from using hydrogen and oxygen gas in sputter deposition |
Jan. 9, 2007 |
| 7154180 |
Electronic device, method of manufacture of the same, and sputtering target |
Dec. 26, 2006 |
| 7135770 |
Semiconductor element with conductive columnar projection and a semiconductor device with conductive columnar projection |
Nov. 14, 2006 |
| 7129582 |
Reducing the migration of grain boundaries |
Oct. 31, 2006 |
| 7119440 |
Back end IC wiring with improved electro-migration resistance |
Oct. 10, 2006 |
| 7098539 |
Electronic device, method of manufacture of the same, and sputtering target |
Aug. 29, 2006 |
| 7091609 |
Semiconductor devices including an alloy layer and a wetting layer on an interlayer dielectric |
Aug. 15, 2006 |
| 7087998 |
Control of air gap position in a dielectric layer |
Aug. 8, 2006 |
| 7078733 |
Aluminum alloyed layered structure for an optical device |
Jul. 18, 2006 |
| 7064441 |
Semiconductor device and method of manufacturing the same |
Jun. 20, 2006 |
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