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Class Information
Number: 257/765
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer of an alloy containing aluminum
Description: Subject matter wherein a layered electrical contact or lead has at least one layer of an alloy containing aluminum (Al).

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8710673 Wiring structure in a semiconductor device, method of forming the wiring structure, semiconductor device including the wiring structure and method of manufacturing the semiconductor device Apr. 29, 2014
8653663 Barrier layer for copper interconnect Feb. 18, 2014
8648465 Semiconductor interconnect structure having enhanced performance and reliability Feb. 11, 2014
8598703 Semiconductor device Dec. 3, 2013
8592977 Integrated circuit (IC) chip and method for fabricating the same Nov. 26, 2013
8546944 Multilayer dielectric memory device Oct. 1, 2013
8525330 Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer Sep. 3, 2013
8519539 Metal wire for a semiconductor device formed with a metal layer without voids therein and a method for forming the same Aug. 27, 2013
8513115 Method of forming an interconnect structure having an enlarged region Aug. 20, 2013
8508046 Circuit substrate and method of manufacturing same Aug. 13, 2013
8466569 Increasing exposure tool alignment signal strength for a ferroelectric capacitor layer Jun. 18, 2013
8426972 Semiconductor device and method for manufacturing the same Apr. 23, 2013
8422207 Al alloy film for display device, display device, and sputtering target Apr. 16, 2013
8384222 Semiconductor device and manufacturing method thereof Feb. 26, 2013
8378490 Semiconductor apparatus including a metal alloy between a first contact and a second contact Feb. 19, 2013
8368211 Solderable top metalization and passivation for source mounted package Feb. 5, 2013
8358006 Semiconductor device Jan. 22, 2013
8354692 Vertical semiconductor power switch, electronic component and methods of producing the same Jan. 15, 2013
8338954 Semiconductor apparatus and fabrication method thereof Dec. 25, 2012
8319343 Routing under bond pad for the replacement of an interconnect layer Nov. 27, 2012
8314494 Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices Nov. 20, 2012
8299614 Interconnection structure, a thin film transistor substrate, and a manufacturing method thereof, as well as a display device Oct. 30, 2012
8283760 Lead frame interconnect scheme with high power density Oct. 9, 2012
8274070 Semiconductor light-emitting element including an auxiliary electrode Sep. 25, 2012
8263491 Substrate with feedthrough and method for producing the same Sep. 11, 2012
RE43590 Aluminum alloy electrode for semiconductor devices Aug. 21, 2012
8242611 Bonding metallurgy for three-dimensional interconnect Aug. 14, 2012
8232643 Lead free solder interconnections for integrated circuits Jul. 31, 2012
8198731 Protective layer for bond pads Jun. 12, 2012
8188600 Semiconductor device and method of fabricating the same May. 29, 2012
8183144 Method of manufacturing semiconductor device May. 22, 2012
8169040 Semiconductor device and method for manufacturing the same May. 1, 2012
8158476 Integrated circuit fabrication Apr. 17, 2012
8125085 Semiconductor device having wiring with oxide layer of impurity from the wiring Feb. 28, 2012
8120067 Power and ground routing of integrated circuit devices with improved IR drop and chip performance Feb. 21, 2012
8101871 Aluminum bond pads with enhanced wire bond stability Jan. 24, 2012
8097533 Method of manufacturing semiconductor device Jan. 17, 2012
8084864 Electromigration resistant aluminum-based metal interconnect structure Dec. 27, 2011
8076212 Semiconductor device and method for manufacturing the same Dec. 13, 2011
8076778 Method for preventing Al-Cu bottom damage using TiN liner Dec. 13, 2011
8076780 Semiconductor device with pads of enhanced moisture blocking ability Dec. 13, 2011
8072004 Power and ground routing of integrated circuit devices with improved IR drop and chip performance Dec. 6, 2011
8053896 IC chip coating material and vacuum fluorescent display device using same Nov. 8, 2011
8049336 Interconnect structure Nov. 1, 2011
8022542 Semiconductor device having improved metal wiring Sep. 20, 2011
7999346 Semiconductor device and method of manufacturing the same Aug. 16, 2011
7977794 Aluminum metal line of a semiconductor device and method of fabricating the same Jul. 12, 2011
7960738 Silicon carbide semiconductor device and manufacturing method therefor Jun. 14, 2011
7960834 Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body Jun. 14, 2011
7960737 Silicon carbide semiconductor device and manufacturing method therefor Jun. 14, 2011

1 2 3 4 5 6 7 8 9 10 11

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