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Class Information
Number: 257/764
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer of molybdenum, titanium, or tungsten > Alloy containing molybdenum, titanium, or tungsten
Description: Subject matter wherein at least one layer containing molybdenum, titanium, or tungsten contains an alloy thereof.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459788 |
Ohmic electrode structure of nitride semiconductor device |
Dec. 2, 2008 |
| 7443032 |
Memory device with chemical vapor deposition of titanium for titanium silicide contacts |
Oct. 28, 2008 |
| 7385294 |
Semiconductor device having nickel silicide and method of fabricating nickel silicide |
Jun. 10, 2008 |
| 7372160 |
Barrier film deposition over metal for reduction in metal dishing after CMP |
May. 13, 2008 |
| 7368823 |
Semiconductor device and method of manufacturing the same |
May. 6, 2008 |
| 7361993 |
Terminal pad structures and methods of fabricating same |
Apr. 22, 2008 |
| 7307344 |
Semiconductor device including a discontinuous film and method for manufacturing the same |
Dec. 11, 2007 |
| 7303988 |
Methods of manufacturing multi-level metal lines in semiconductor devices |
Dec. 4, 2007 |
| RE39932 |
Semiconductor interconnect formed over an insulation and having moisture resistant material |
Dec. 4, 2007 |
| 7301238 |
Structure and method of forming an enlarged head on a plug to eliminate the enclosure requirement |
Nov. 27, 2007 |
| 7294851 |
Dense seed layer and method of formation |
Nov. 13, 2007 |
| 7276801 |
Designs and methods for conductive bumps |
Oct. 2, 2007 |
| 7253519 |
Chip packaging structure having redistribution layer with recess |
Aug. 7, 2007 |
| 7253501 |
High performance metallization cap layer |
Aug. 7, 2007 |
| 7245018 |
Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof |
Jul. 17, 2007 |
| 7235844 |
Power composite integrated semiconductor device and manufacturing method thereof |
Jun. 26, 2007 |
| 7164207 |
Wiring structure for semiconductor device |
Jan. 16, 2007 |
| 7161211 |
Aluminum-containing film derived from using hydrogen and oxygen gas in sputter deposition |
Jan. 9, 2007 |
| 7148570 |
Low resistivity titanium silicide on heavily doped semiconductor |
Dec. 12, 2006 |
| 7148572 |
Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation |
Dec. 12, 2006 |
| 7141880 |
Metal line stacking structure in semiconductor device and formation method thereof |
Nov. 28, 2006 |
| 7135770 |
Semiconductor element with conductive columnar projection and a semiconductor device with conductive columnar projection |
Nov. 14, 2006 |
| 7126220 |
Miniaturized contact spring |
Oct. 24, 2006 |
| 7119443 |
Semiconductor integrated circuit device having a conductive film which contains metal atoms bondable to a halogen element |
Oct. 10, 2006 |
| 7105928 |
Copper wiring with high temperature superconductor (HTS) layer |
Sep. 12, 2006 |
| 7095121 |
Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices |
Aug. 22, 2006 |
| 7091609 |
Semiconductor devices including an alloy layer and a wetting layer on an interlayer dielectric |
Aug. 15, 2006 |
| 7087997 |
Copper to aluminum interlayer interconnect using stud and via liner |
Aug. 8, 2006 |
| 7084504 |
Boron incorporated diffusion barrier material |
Aug. 1, 2006 |
| 7067917 |
Gradient barrier layer for copper back-end-of-line technology |
Jun. 27, 2006 |
| 7067920 |
Semiconductor device and method of fabricating the same |
Jun. 27, 2006 |
| 7067928 |
Method of forming a bonding pad structure |
Jun. 27, 2006 |
| 7053462 |
Planarization of metal container structures |
May. 30, 2006 |
| 7045842 |
Integrated circuit devices having self-aligned contact structures |
May. 16, 2006 |
| 7042099 |
Semiconductor device containing a dummy wire |
May. 9, 2006 |
| 7034398 |
Semiconductor device having contact plug and buried conductive film therein |
Apr. 25, 2006 |
| 7030418 |
Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver |
Apr. 18, 2006 |
| 7026714 |
Copper interconnect systems which use conductive, metal-based cap layers |
Apr. 11, 2006 |
| 7009298 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer |
Mar. 7, 2006 |
| 7002201 |
Semiconductor device and manufacturing method thereof |
Feb. 21, 2006 |
| 6969911 |
Wiring structure of semiconductor device and production method of the device |
Nov. 29, 2005 |
| 6964921 |
Method for forming bit line of flash device |
Nov. 15, 2005 |
| 6960836 |
Reinforced bond pad |
Nov. 1, 2005 |
| 6960831 |
Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad |
Nov. 1, 2005 |
| 6955986 |
Atomic layer deposition methods for forming a multi-layer adhesion-barrier layer for integrated circuits |
Oct. 18, 2005 |
| 6949457 |
Barrier enhancement |
Sep. 27, 2005 |
| 6946681 |
Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof |
Sep. 20, 2005 |
| 6940172 |
Chemical vapor deposition of titanium |
Sep. 6, 2005 |
| 6936923 |
Method to form very a fine pitch solder bump using methods of electroplating |
Aug. 30, 2005 |
| 6924554 |
Wirebond structure and method to connect to a microelectronic die |
Aug. 2, 2005 |
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