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Class Information
Number: 257/764
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer of molybdenum, titanium, or tungsten > Alloy containing molybdenum, titanium, or tungsten
Description: Subject matter wherein at least one layer containing molybdenum, titanium, or tungsten contains an alloy thereof.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
8685851 MOS device with memory function and manufacturing method thereof Apr. 1, 2014
8648465 Semiconductor interconnect structure having enhanced performance and reliability Feb. 11, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8617984 Tungsten metallization: structure and fabrication of same Dec. 31, 2013
8610289 Semiconductor component and method for producing a metal-semiconductor contact Dec. 17, 2013
8564132 Tungsten metallization: structure and fabrication of same Oct. 22, 2013
8551890 Showerhead for CVD depositions Oct. 8, 2013
8551248 Showerhead for CVD depositions Oct. 8, 2013
8541882 Stacked IC device with recessed conductive layers adjacent to interlevel conductors Sep. 24, 2013
8536709 Wafer with eutectic bonding carrier and method of manufacturing the same Sep. 17, 2013
8466569 Increasing exposure tool alignment signal strength for a ferroelectric capacitor layer Jun. 18, 2013
8456009 Semiconductor structure having an air-gap region and a method of manufacturing the same Jun. 4, 2013
8446012 Interconnect structures May. 21, 2013
8426971 Top tri-metal system for silicon power semiconductor devices Apr. 23, 2013
8415207 Module including a sintered joint bonding a semiconductor chip to a copper surface Apr. 9, 2013
8415657 Enhanced work function layer supporting growth of rutile phase titanium oxide Apr. 9, 2013
8405109 Low resistance electrode and compound semiconductor light emitting device including the same Mar. 26, 2013
8395266 Semiconductor memory device Mar. 12, 2013
8390134 Semiconductor device having surface protective films on bond pad Mar. 5, 2013
8378490 Semiconductor apparatus including a metal alloy between a first contact and a second contact Feb. 19, 2013
8377803 Methods and systems for forming thin films Feb. 19, 2013
8373070 Metal structure of flexible multi-layer substrate and manufacturing method thereof Feb. 12, 2013
8361897 Method for depositing a thin film electrode and thin film stack Jan. 29, 2013
8354702 Inexpensive electrode materials to facilitate rutile phase titanium oxide Jan. 15, 2013
8344511 Method for manufacturing a semiconductor device having a silicide region comprised of a silicide of a nickel alloy Jan. 1, 2013
8344438 Electrode of an integrated circuit Jan. 1, 2013
8319341 Semiconductor device with gate structure Nov. 27, 2012
8318590 Methods and systems for forming thin films Nov. 27, 2012
8314494 Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices Nov. 20, 2012
8304907 Top layers of metal for integrated circuits Nov. 6, 2012
8298930 Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof Oct. 30, 2012
8283760 Lead frame interconnect scheme with high power density Oct. 9, 2012
8278218 Electrical conductor line having a multilayer diffusion barrier for use in a semiconductor device and method for forming the same Oct. 2, 2012
8253233 Module including a sintered joint bonding a semiconductor chip to a copper surface Aug. 28, 2012
8232643 Lead free solder interconnections for integrated circuits Jul. 31, 2012
8222740 Zinc oxide based composites and methods for their fabrication Jul. 17, 2012
8125086 Substrate for semiconductor package Feb. 28, 2012
8120181 Post passivation interconnection process and structures Feb. 21, 2012
8053895 Metal line of semiconductor device having a multilayer molybdenum diffusion barrier and method for forming the same Nov. 8, 2011
8039939 Embedded wiring board, semiconductor package including the same and method of fabricating the same Oct. 18, 2011
8030772 Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region Oct. 4, 2011
8026542 Low resistance peripheral local interconnect contacts with selective wet strip of titanium Sep. 27, 2011
8022544 Chip structure Sep. 20, 2011
8008778 Semiconductor device Aug. 30, 2011
8008775 Post passivation interconnection structures Aug. 30, 2011
7999387 Semiconductor element connected to printed circuit board Aug. 16, 2011
7960746 Low resistance electrode and compound semiconductor light emitting device including the same Jun. 14, 2011
7956473 Semiconductor device Jun. 7, 2011
7923836 BLM structure for application to copper pad Apr. 12, 2011
7911060 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation Mar. 22, 2011

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