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Class Information
Number: 257/763
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer of molybdenum, titanium, or tungsten
Description: Subject matter wherein a layered electrical contact or lead has at least one layer of molybdenum (Mo), titanium (Ti) or tungsten (W).
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626264 |
Substrate for device bonding and method for manufacturing same |
Dec. 1, 2009 |
| 7619258 |
Display device |
Nov. 17, 2009 |
| 7615839 |
Semiconductor device and manufacturing method thereof |
Nov. 10, 2009 |
| 7615867 |
Thin-film transistor, method of manufacturing the same, liquid crystal display panel having the same and electro-luminescence display panel having the same |
Nov. 10, 2009 |
| 7566972 |
Semiconductor device and method for manufacturing the semiconductor device |
Jul. 28, 2009 |
| 7566976 |
Semiconductor device and method for fabricating the same |
Jul. 28, 2009 |
| 7560581 |
Vapor deposition of tungsten nitride |
Jul. 14, 2009 |
| 7557446 |
Semiconductor device and a fabrication process thereof |
Jul. 7, 2009 |
| 7554128 |
Light-emitting apparatus |
Jun. 30, 2009 |
| 7550822 |
Dual-damascene metal wiring patterns for integrated circuit devices |
Jun. 23, 2009 |
| 7550851 |
Adhesion of tungsten nitride films to a silicon surface |
Jun. 23, 2009 |
| 7525197 |
Barrier process/structure for transistor trench contact applications |
Apr. 28, 2009 |
| 7521801 |
Semiconductor device |
Apr. 21, 2009 |
| 7511302 |
TFT array panel |
Mar. 31, 2009 |
| 7508077 |
Semiconductor device and method of manufacturing same |
Mar. 24, 2009 |
| 7508075 |
Self-aligned poly-metal structures |
Mar. 24, 2009 |
| 7508074 |
Etch stop layer in poly-metal structures |
Mar. 24, 2009 |
| 7504728 |
Integrated circuit having bond pad with improved thermal and mechanical properties |
Mar. 17, 2009 |
| 7485578 |
Semiconductor device |
Feb. 3, 2009 |
| 7459788 |
Ohmic electrode structure of nitride semiconductor device |
Dec. 2, 2008 |
| 7443032 |
Memory device with chemical vapor deposition of titanium for titanium silicide contacts |
Oct. 28, 2008 |
| 7414314 |
Semiconductor device and manufacturing method thereof |
Aug. 19, 2008 |
| 7402883 |
Back end of the line structures with liner and noble metal layer |
Jul. 22, 2008 |
| 7385292 |
Top layers of metal for high performance IC's |
Jun. 10, 2008 |
| 7379307 |
Wiring board and method for manufacturing the same, and semiconductor device |
May. 27, 2008 |
| 7372160 |
Barrier film deposition over metal for reduction in metal dishing after CMP |
May. 13, 2008 |
| 7372157 |
Semiconductor device including titanium wires and manufacturing method therefor |
May. 13, 2008 |
| 7371679 |
Semiconductor device with a metal line and method of forming the same |
May. 13, 2008 |
| 7365430 |
Semiconductor device and method of manufacturing the same |
Apr. 29, 2008 |
| 7361993 |
Terminal pad structures and methods of fabricating same |
Apr. 22, 2008 |
| 7323717 |
Semiconductor device |
Jan. 29, 2008 |
| 7321157 |
CoSb.sub.3-based thermoelectric device fabrication method |
Jan. 22, 2008 |
| 7307344 |
Semiconductor device including a discontinuous film and method for manufacturing the same |
Dec. 11, 2007 |
| RE39932 |
Semiconductor interconnect formed over an insulation and having moisture resistant material |
Dec. 4, 2007 |
| 7303988 |
Methods of manufacturing multi-level metal lines in semiconductor devices |
Dec. 4, 2007 |
| 7301238 |
Structure and method of forming an enlarged head on a plug to eliminate the enclosure requirement |
Nov. 27, 2007 |
| 7301241 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 27, 2007 |
| 7298029 |
Semiconductor devices and manufacturing method therefor |
Nov. 20, 2007 |
| 7294851 |
Dense seed layer and method of formation |
Nov. 13, 2007 |
| 7294565 |
Method of fabricating a wire bond pad with Ni/Au metallization |
Nov. 13, 2007 |
| 7294858 |
Semiconductor device and method of manufacturing the same |
Nov. 13, 2007 |
| 7291928 |
Electric power semiconductor device |
Nov. 6, 2007 |
| 7288473 |
Metal layer in semiconductor device and method of forming the same |
Oct. 30, 2007 |
| 7279231 |
Electroless plating structure |
Oct. 9, 2007 |
| 7276795 |
Small grain size, conformal aluminum interconnects and method for their formation |
Oct. 2, 2007 |
| 7271099 |
Forming a conductive pattern on a substrate |
Sep. 18, 2007 |
| 7259443 |
Methods for forming patterns on a filled dielectric material on substrates |
Aug. 21, 2007 |
| 7253519 |
Chip packaging structure having redistribution layer with recess |
Aug. 7, 2007 |
| 7253501 |
High performance metallization cap layer |
Aug. 7, 2007 |
| 7245018 |
Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof |
Jul. 17, 2007 |
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