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Class Information
Number: 257/763
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer of molybdenum, titanium, or tungsten
Description: Subject matter wherein a layered electrical contact or lead has at least one layer of molybdenum (Mo), titanium (Ti) or tungsten (W).










Sub-classes under this class:

Class Number Class Name Patents
257/764 Alloy containing molybdenum, titanium, or tungsten 612


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Patent Number Title Of Patent Date Issued
8710673 Wiring structure in a semiconductor device, method of forming the wiring structure, semiconductor device including the wiring structure and method of manufacturing the semiconductor device Apr. 29, 2014
8710660 Hybrid interconnect scheme including aluminum metal line in low-k dielectric Apr. 29, 2014
8691672 Method for the selective oxidation of silicon nanoparticle semiconductor films in the presence of titanium Apr. 8, 2014
8686562 Refractory metal nitride capped electrical contact and method for frabricating same Apr. 1, 2014
8680682 Barrier for through-silicon via Mar. 25, 2014
8674349 Resin film forming sheet for chip, and method for manufacturing semiconductor chip Mar. 18, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8617984 Tungsten metallization: structure and fabrication of same Dec. 31, 2013
8618662 Devices containing carbon nanomaterial electrical interconnects overcoated with metal nitride films and methods for production thereof Dec. 31, 2013
8614510 Semiconductor device including a metal wiring with a metal cap Dec. 24, 2013
8610277 Bridge type pad structure of a semiconductor device Dec. 17, 2013
8592928 Magnetic random access memory and method of manufacturing the same Nov. 26, 2013
8592985 Methods of forming conductive structures and methods of forming DRAM cells Nov. 26, 2013
8564132 Tungsten metallization: structure and fabrication of same Oct. 22, 2013
8559216 Nonvolatile semiconductor memory device Oct. 15, 2013
8551248 Showerhead for CVD depositions Oct. 8, 2013
8551890 Showerhead for CVD depositions Oct. 8, 2013
8546947 Chip structure and process for forming the same Oct. 1, 2013
8541882 Stacked IC device with recessed conductive layers adjacent to interlevel conductors Sep. 24, 2013
8536706 Method for fabricating semiconductor device and semiconductor device Sep. 17, 2013
8519539 Metal wire for a semiconductor device formed with a metal layer without voids therein and a method for forming the same Aug. 27, 2013
8519541 Semiconductor device having plural conductive layers disposed within dielectric layer Aug. 27, 2013
8513058 Semiconductor device and method for producing the same Aug. 20, 2013
8507379 Semiconductor device and manufacturing method thereof Aug. 13, 2013
8492808 Semiconductor device and manufacturing method thereof Jul. 23, 2013
8487440 Backside processing of semiconductor devices Jul. 16, 2013
8461043 Barrier layer for integrated circuit contacts Jun. 11, 2013
8461681 Layered structure for corrosion resistant interconnect contacts Jun. 11, 2013
8432037 Semiconductor device with a line and method of fabrication thereof Apr. 30, 2013
8426971 Top tri-metal system for silicon power semiconductor devices Apr. 23, 2013
8415657 Enhanced work function layer supporting growth of rutile phase titanium oxide Apr. 9, 2013
8384221 Semiconductor device, LED head and method of manufacturing the same Feb. 26, 2013
8377803 Methods and systems for forming thin films Feb. 19, 2013
8378252 Method and apparatus for hybrid resolution feedback of a motion stage Feb. 19, 2013
8378490 Semiconductor apparatus including a metal alloy between a first contact and a second contact Feb. 19, 2013
8373069 Electronic component mounting substrate and method for manufacturing electronic component mounting substrate Feb. 12, 2013
8367546 Methods for forming all tungsten contacts and lines Feb. 5, 2013
8361897 Method for depositing a thin film electrode and thin film stack Jan. 29, 2013
8354751 Interconnect structure for electromigration enhancement Jan. 15, 2013
8354702 Inexpensive electrode materials to facilitate rutile phase titanium oxide Jan. 15, 2013
8354692 Vertical semiconductor power switch, electronic component and methods of producing the same Jan. 15, 2013
8344509 Method for fabricating semiconductor device and semiconductor device Jan. 1, 2013
8344511 Method for manufacturing a semiconductor device having a silicide region comprised of a silicide of a nickel alloy Jan. 1, 2013
8344513 Barrier for through-silicon via Jan. 1, 2013
8329311 Nanoprinted device comprising metallic patterns and method of nanoprinting metallic patterns Dec. 11, 2012
8324098 Via and method of forming the via with a substantially planar top surface that is suitable for carbon nanotube applications Dec. 4, 2012
8324621 Semiconductor device having oxide semiconductor layer Dec. 4, 2012
8318590 Methods and systems for forming thin films Nov. 27, 2012
8304873 Manufacturing method for display device and display device Nov. 6, 2012
8283760 Lead frame interconnect scheme with high power density Oct. 9, 2012

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