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Class Information
Number: 257/763
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer of molybdenum, titanium, or tungsten
Description: Subject matter wherein a layered electrical contact or lead has at least one layer of molybdenum (Mo), titanium (Ti) or tungsten (W).


Sub-classes under this class:

Class Number Class Name Patents
257/764 Alloy containing molybdenum, titanium, or tungsten 545


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Patent Number Title Of Patent Date Issued
7626264 Substrate for device bonding and method for manufacturing same Dec. 1, 2009
7619258 Display device Nov. 17, 2009
7615839 Semiconductor device and manufacturing method thereof Nov. 10, 2009
7615867 Thin-film transistor, method of manufacturing the same, liquid crystal display panel having the same and electro-luminescence display panel having the same Nov. 10, 2009
7566972 Semiconductor device and method for manufacturing the semiconductor device Jul. 28, 2009
7566976 Semiconductor device and method for fabricating the same Jul. 28, 2009
7560581 Vapor deposition of tungsten nitride Jul. 14, 2009
7557446 Semiconductor device and a fabrication process thereof Jul. 7, 2009
7554128 Light-emitting apparatus Jun. 30, 2009
7550822 Dual-damascene metal wiring patterns for integrated circuit devices Jun. 23, 2009
7550851 Adhesion of tungsten nitride films to a silicon surface Jun. 23, 2009
7525197 Barrier process/structure for transistor trench contact applications Apr. 28, 2009
7521801 Semiconductor device Apr. 21, 2009
7511302 TFT array panel Mar. 31, 2009
7508077 Semiconductor device and method of manufacturing same Mar. 24, 2009
7508075 Self-aligned poly-metal structures Mar. 24, 2009
7508074 Etch stop layer in poly-metal structures Mar. 24, 2009
7504728 Integrated circuit having bond pad with improved thermal and mechanical properties Mar. 17, 2009
7485578 Semiconductor device Feb. 3, 2009
7459788 Ohmic electrode structure of nitride semiconductor device Dec. 2, 2008
7443032 Memory device with chemical vapor deposition of titanium for titanium silicide contacts Oct. 28, 2008
7414314 Semiconductor device and manufacturing method thereof Aug. 19, 2008
7402883 Back end of the line structures with liner and noble metal layer Jul. 22, 2008
7385292 Top layers of metal for high performance IC's Jun. 10, 2008
7379307 Wiring board and method for manufacturing the same, and semiconductor device May. 27, 2008
7372160 Barrier film deposition over metal for reduction in metal dishing after CMP May. 13, 2008
7372157 Semiconductor device including titanium wires and manufacturing method therefor May. 13, 2008
7371679 Semiconductor device with a metal line and method of forming the same May. 13, 2008
7365430 Semiconductor device and method of manufacturing the same Apr. 29, 2008
7361993 Terminal pad structures and methods of fabricating same Apr. 22, 2008
7323717 Semiconductor device Jan. 29, 2008
7321157 CoSb.sub.3-based thermoelectric device fabrication method Jan. 22, 2008
7307344 Semiconductor device including a discontinuous film and method for manufacturing the same Dec. 11, 2007
RE39932 Semiconductor interconnect formed over an insulation and having moisture resistant material Dec. 4, 2007
7303988 Methods of manufacturing multi-level metal lines in semiconductor devices Dec. 4, 2007
7301238 Structure and method of forming an enlarged head on a plug to eliminate the enclosure requirement Nov. 27, 2007
7301241 Semiconductor device for preventing defective filling of interconnection and cracking of insulating film Nov. 27, 2007
7298029 Semiconductor devices and manufacturing method therefor Nov. 20, 2007
7294851 Dense seed layer and method of formation Nov. 13, 2007
7294565 Method of fabricating a wire bond pad with Ni/Au metallization Nov. 13, 2007
7294858 Semiconductor device and method of manufacturing the same Nov. 13, 2007
7291928 Electric power semiconductor device Nov. 6, 2007
7288473 Metal layer in semiconductor device and method of forming the same Oct. 30, 2007
7279231 Electroless plating structure Oct. 9, 2007
7276795 Small grain size, conformal aluminum interconnects and method for their formation Oct. 2, 2007
7271099 Forming a conductive pattern on a substrate Sep. 18, 2007
7259443 Methods for forming patterns on a filled dielectric material on substrates Aug. 21, 2007
7253519 Chip packaging structure having redistribution layer with recess Aug. 7, 2007
7253501 High performance metallization cap layer Aug. 7, 2007
7245018 Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof Jul. 17, 2007

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18


 
 
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