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Browse by Category: Main > Physics
Class Information
Number: 257/762
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer containing silver or copper
Description: Subject matter wherein a layered electrical contact or lead has at least one layer which contains copper (Cu) or silver (Ag).










Patents under this class:

Patent Number Title Of Patent Date Issued
8710663 Method of manufacturing semiconductor device and semiconductor device Apr. 29, 2014
8710660 Hybrid interconnect scheme including aluminum metal line in low-k dielectric Apr. 29, 2014
8692384 Semiconductor device with through silicon via and alignment mark Apr. 8, 2014
8691688 Method of manufacturing semiconductor structure Apr. 8, 2014
8685851 MOS device with memory function and manufacturing method thereof Apr. 1, 2014
8669182 Metal cap with ultra-low .kappa. dielectric material for circuit interconnect applications Mar. 11, 2014
8664759 Integrated circuit with heat conducting structures for localized thermal control Mar. 4, 2014
8659160 Die structure, manufacturing method and substrate thereof Feb. 25, 2014
8653668 Copper bonding wire for semiconductor device and bonding structure thereof Feb. 18, 2014
8653667 Power MOSFET having selectively silvered pads for clip and bond wire attach Feb. 18, 2014
8653665 Barrier layer, film forming method, and processing system Feb. 18, 2014
8653663 Barrier layer for copper interconnect Feb. 18, 2014
8648465 Semiconductor interconnect structure having enhanced performance and reliability Feb. 11, 2014
8633592 Hybrid interconnect technology Jan. 21, 2014
8633589 Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques Jan. 21, 2014
8624397 Electrode layer structure for a thin-film transistor and process for manufacture thereof Jan. 7, 2014
8618677 Wirebonded semiconductor package Dec. 31, 2013
8614510 Semiconductor device including a metal wiring with a metal cap Dec. 24, 2013
8610285 3D IC packaging structures and methods with a metal pillar Dec. 17, 2013
8610279 Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods Dec. 17, 2013
8610276 Metal cap for back end of line (BEOL) interconnects, design structure and method of manufacture Dec. 17, 2013
8610274 Die structure, die arrangement and method of processing a die Dec. 17, 2013
8593817 Power semiconductor module and method for operating a power semiconductor module Nov. 26, 2013
8592996 Semiconductor device and method of manufacturing the same Nov. 26, 2013
8592984 Semiconductor integrated circuit device and method of manufacturing the same Nov. 26, 2013
8592977 Integrated circuit (IC) chip and method for fabricating the same Nov. 26, 2013
8592861 Display device and manufacturing method of the display device Nov. 26, 2013
8580687 Semiconductor structure and method for making same Nov. 12, 2013
8552559 Very thick metal interconnection scheme in IC chips Oct. 8, 2013
8552558 Conductive compositions and processes for use in the manufacture of semiconductor devices Oct. 8, 2013
8552543 Semiconductor package Oct. 8, 2013
8546947 Chip structure and process for forming the same Oct. 1, 2013
8546944 Multilayer dielectric memory device Oct. 1, 2013
8545998 Electroless deposition of platinum on copper Oct. 1, 2013
8536706 Method for fabricating semiconductor device and semiconductor device Sep. 17, 2013
8536058 Method of growing electrical conductors Sep. 17, 2013
8525341 Printed circuit board having different sub-core layers and semicondutor package comprising the same Sep. 3, 2013
8519536 Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow process Aug. 27, 2013
8513810 Semiconductor device and method of manufacturing same Aug. 20, 2013
8513808 Semiconductor device having trench-isolated element formation region Aug. 20, 2013
8513805 Manufacturing of a semiconductor device and the manufacturing method Aug. 20, 2013
8513778 Semiconductor device Aug. 20, 2013
8508046 Circuit substrate and method of manufacturing same Aug. 13, 2013
8508037 Bumpless build-up layer and laminated core hybrid structures and methods of assembling same Aug. 13, 2013
8497580 Noble metal cap for interconnect structures Jul. 30, 2013
8492808 Semiconductor device and manufacturing method thereof Jul. 23, 2013
8487439 Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board Jul. 16, 2013
8476760 Electroplated posts with reduced topography and stress Jul. 2, 2013
8476645 LED thermal management Jul. 2, 2013
8471388 Integrated circuit and method for fabricating the same Jun. 25, 2013











 
 
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