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Class Information
Number: 257/762
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer containing silver or copper
Description: Subject matter wherein a layered electrical contact or lead has at least one layer which contains copper (Cu) or silver (Ag).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7605468 |
Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow |
Oct. 20, 2009 |
| 7605471 |
Semiconductor devices and methods for manufacturing the same |
Oct. 20, 2009 |
| 7605472 |
Interconnections having double capping layer and method for forming the same |
Oct. 20, 2009 |
| 7605460 |
Method and apparatus for a power distribution system |
Oct. 20, 2009 |
| 7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus |
Sep. 29, 2009 |
| 7595556 |
Semiconductor device and method for manufacturing the same |
Sep. 29, 2009 |
| 7586197 |
Wire structure, method of forming wire, thin film transistor substrate, and method of manufacturing thin film transistor substrate |
Sep. 8, 2009 |
| 7579696 |
Semiconductor device |
Aug. 25, 2009 |
| 7572728 |
Semiconductor device and method for manufacturing the same |
Aug. 11, 2009 |
| 7569937 |
Technique for forming a copper-based contact layer without a terminal metal |
Aug. 4, 2009 |
| 7569476 |
Semiconductor integrated circuit device and a method of manufacturing the same |
Aug. 4, 2009 |
| 7566973 |
Semiconductor device and method of manufacturing the same |
Jul. 28, 2009 |
| 7566975 |
Semiconductor device and method for manufacturing the same |
Jul. 28, 2009 |
| 7560814 |
Semiconductor device that improves electrical connection reliability |
Jul. 14, 2009 |
| 7557448 |
High-aspect-ratio metal-polymer composite structures for nano interconnects |
Jul. 7, 2009 |
| 7554202 |
Semiconductor integrated circuit device |
Jun. 30, 2009 |
| 7554199 |
Substrate for evaluation |
Jun. 30, 2009 |
| 7553757 |
Semiconductor device and method of manufacturing the same |
Jun. 30, 2009 |
| 7550822 |
Dual-damascene metal wiring patterns for integrated circuit devices |
Jun. 23, 2009 |
| 7547972 |
Laminated structure, very-large-scale integrated circuit wiring board, and method of formation thereof |
Jun. 16, 2009 |
| 7535095 |
Printed wiring board and method for producing the same |
May. 19, 2009 |
| 7535104 |
Structure and method for bond pads of copper-metallized integrated circuits |
May. 19, 2009 |
| 7528071 |
Method for fabricating semiconductor device |
May. 5, 2009 |
| 7525196 |
Protection of seedlayer for electroplating |
Apr. 28, 2009 |
| 7521801 |
Semiconductor device |
Apr. 21, 2009 |
| 7521802 |
Semiconductor device having a refractory metal containing film and method for manufacturing the same |
Apr. 21, 2009 |
| 7508076 |
Information handling system including a circuitized substrate having a dielectric layer without continuous fibers |
Mar. 24, 2009 |
| 7504727 |
Semiconductor interconnect structure utilizing a porous dielectric material as an etch stop layer between adjacent non-porous dielectric materials |
Mar. 17, 2009 |
| 7504724 |
Semiconductor device |
Mar. 17, 2009 |
| 7504712 |
Electronic device with selective nickel palladium gold plated leadframe and method of making the same |
Mar. 17, 2009 |
| 7504674 |
Electronic apparatus having a core conductive structure within an insulating layer |
Mar. 17, 2009 |
| 7498242 |
Plasma pre-treating surfaces for atomic layer deposition |
Mar. 3, 2009 |
| 7495335 |
Method of reducing process steps in metal line protective structure formation |
Feb. 24, 2009 |
| 7495338 |
Metal capped copper interconnect |
Feb. 24, 2009 |
| 7482693 |
Top layers of metal for high performance IC's |
Jan. 27, 2009 |
| 7479700 |
Semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thickness formed thereon, and method for manufacturing the same |
Jan. 20, 2009 |
| 7479687 |
Deep via seed repair using electroless plating chemistry |
Jan. 20, 2009 |
| 7476564 |
Flip-chip packaging process using copper pillar as bump structure |
Jan. 13, 2009 |
| 7476971 |
Via line barrier and etch stop structure |
Jan. 13, 2009 |
| 7476979 |
Chip scale surface mounted device and process of manufacture |
Jan. 13, 2009 |
| 7473642 |
Method for fabricating conductive layer |
Jan. 6, 2009 |
| 7470990 |
Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
Dec. 30, 2008 |
| 7462565 |
Method of manufacturing semiconductor device |
Dec. 9, 2008 |
| 7459787 |
Multi-layered copper line structure of semiconductor device and method for forming the same |
Dec. 2, 2008 |
| 7456501 |
Semiconductor structure having recess with conductive metal |
Nov. 25, 2008 |
| 7449781 |
Printed wiring board |
Nov. 11, 2008 |
| 7449780 |
Apparatus to minimize thermal impedance using copper on die backside |
Nov. 11, 2008 |
| 7446393 |
Co-sputter deposition of metal-doped chalcogenides |
Nov. 4, 2008 |
| 7443029 |
Adhesion of copper and etch stop layer for copper alloy |
Oct. 28, 2008 |
| 7439182 |
Semiconductor device and method of fabricating the same |
Oct. 21, 2008 |
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