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Class Information
Number: 257/762
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer containing silver or copper
Description: Subject matter wherein a layered electrical contact or lead has at least one layer which contains copper (Cu) or silver (Ag).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459787 |
Multi-layered copper line structure of semiconductor device and method for forming the same |
Dec. 2, 2008 |
| 7456501 |
Semiconductor structure having recess with conductive metal |
Nov. 25, 2008 |
| 7449780 |
Apparatus to minimize thermal impedance using copper on die backside |
Nov. 11, 2008 |
| 7449781 |
Printed wiring board |
Nov. 11, 2008 |
| 7446393 |
Co-sputter deposition of metal-doped chalcogenides |
Nov. 4, 2008 |
| 7443029 |
Adhesion of copper and etch stop layer for copper alloy |
Oct. 28, 2008 |
| 7439624 |
Enhanced mechanical strength via contacts |
Oct. 21, 2008 |
| 7439182 |
Semiconductor device and method of fabricating the same |
Oct. 21, 2008 |
| 7436066 |
Semiconductor element |
Oct. 14, 2008 |
| 7427563 |
Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures |
Sep. 23, 2008 |
| 7423347 |
In-situ deposition for cu hillock suppression |
Sep. 9, 2008 |
| 7422979 |
Method of forming a semiconductor device having a diffusion barrier stack and structure thereof |
Sep. 9, 2008 |
| 7420227 |
Cu-metalized compound semiconductor device |
Sep. 2, 2008 |
| 7416972 |
Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion |
Aug. 26, 2008 |
| 7416996 |
Method of making circuitized substrate |
Aug. 26, 2008 |
| 7417256 |
Display device and manufacturing method thereof |
Aug. 26, 2008 |
| 7411303 |
Semiconductor assembly having substrate with electroplated contact pads |
Aug. 12, 2008 |
| 7411302 |
Semiconductor device and a method of manufacturing the same and designing the same |
Aug. 12, 2008 |
| 7411301 |
Semiconductor integrated circuit device |
Aug. 12, 2008 |
| 7411212 |
Switching device for a pixel electrode and methods for fabricating the same |
Aug. 12, 2008 |
| 7405481 |
Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip |
Jul. 29, 2008 |
| 7402883 |
Back end of the line structures with liner and noble metal layer |
Jul. 22, 2008 |
| 7397125 |
Semiconductor device with bonding pad support structure |
Jul. 8, 2008 |
| 7394158 |
Solderable top metal for SiC device |
Jul. 1, 2008 |
| 7394157 |
Integrated circuit and seed layers |
Jul. 1, 2008 |
| 7390615 |
Integrated circuit fuse and method of opening |
Jun. 24, 2008 |
| 7391086 |
Conductive contacts and methods for fabricating conductive contacts for elctrochemical planarization of a work piece |
Jun. 24, 2008 |
| 7391116 |
Fretting and whisker resistant coating system and method |
Jun. 24, 2008 |
| 7387960 |
Dual depth trench termination method for improving Cu-based interconnect integrity |
Jun. 17, 2008 |
| 7388292 |
Top layers of metal for high performance IC's |
Jun. 17, 2008 |
| 7385293 |
Copper alloy, fabrication method thereof, and sputtering target |
Jun. 10, 2008 |
| 7378741 |
Semiconductor component and corresponding fabrication/mounting method |
May. 27, 2008 |
| 7372152 |
Copper interconnect systems |
May. 13, 2008 |
| 7372159 |
Semiconductor device |
May. 13, 2008 |
| 7368379 |
Multi-layer interconnect structure for semiconductor devices |
May. 6, 2008 |
| 7368805 |
Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device |
May. 6, 2008 |
| 7365001 |
Interconnect structures and methods of making thereof |
Apr. 29, 2008 |
| 7361993 |
Terminal pad structures and methods of fabricating same |
Apr. 22, 2008 |
| 7348671 |
Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same |
Mar. 25, 2008 |
| 7348672 |
Interconnects with improved reliability |
Mar. 25, 2008 |
| 7339274 |
Metallization performance in electronic devices |
Mar. 4, 2008 |
| 7332813 |
Semiconductor device |
Feb. 19, 2008 |
| 7329952 |
Method of fabricating a semiconductor device |
Feb. 12, 2008 |
| 7327031 |
Semiconductor device and method of manufacturing the same |
Feb. 5, 2008 |
| 7327033 |
Copper alloy via bottom liner |
Feb. 5, 2008 |
| 7327036 |
Method for depositing a group III-nitride material on a silicon substrate and device therefor |
Feb. 5, 2008 |
| 7318962 |
Magnetically directed self-assembly of molecular electronic junctions comprising conductively coated ferromagnetic microparticles |
Jan. 15, 2008 |
| 7315084 |
Copper interconnection and the method for fabricating the same |
Jan. 1, 2008 |
| 7315083 |
Circuit device and manufacturing method thereof |
Jan. 1, 2008 |
| 7307344 |
Semiconductor device including a discontinuous film and method for manufacturing the same |
Dec. 11, 2007 |
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