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Class Information
Number: 257/760
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > Multiple metal levels on semiconductor, separated by insulating layer (e.g., multiple level metallization for integrated circuit) > Separating insulating layer is laminate or composite of plural insulating materials (e.g., silicon oxide on silicon nitride, silicon oxynitride)
Description: Subject matter wherein there is at least one separating insulator layer between different metal layers, which separating insulator layer is itself made up of plural sublayers, or which separating insulator layer is a composite such as a mixture of silicon oxide and silicon nitride.

Patents under this class:

Patent Number Title Of Patent Date Issued
8692379 Integrated circuit connector access region Apr. 8, 2014
8685851 MOS device with memory function and manufacturing method thereof Apr. 1, 2014
8653664 Barrier layers for copper interconnect Feb. 18, 2014
8648446 Method for protecting a gate structure during contact formation Feb. 11, 2014
8643151 Passivation layer for semiconductor devices Feb. 4, 2014
8633590 Semiconductor device and method for manufacturing the same Jan. 21, 2014
8633589 Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques Jan. 21, 2014
8629561 Air gap-containing interconnect structure having photo-patternable low k material Jan. 14, 2014
8629560 Self aligned air-gap in interconnect structures Jan. 14, 2014
8618663 Patternable dielectric film structure with improved lithography and method of fabricating same Dec. 31, 2013
8617981 Semiconductor device and manufacturing method thereof Dec. 31, 2013
8614507 Semiconductor devices having lower and upper interconnection structures that exhibit reduced coupling Dec. 24, 2013
8598706 Method for forming interlayer dielectric film, interlayer dielectric film, semiconductor device and semiconductor manufacturing apparatus Dec. 3, 2013
8587119 Conductive feature for semiconductor substrate and method of manufacture Nov. 19, 2013
8575753 Semiconductor device having a conductive structure including oxide and non oxide portions Nov. 5, 2013
8569821 Semiconductor devices and methods of forming the same Oct. 29, 2013
8552559 Very thick metal interconnection scheme in IC chips Oct. 8, 2013
8551877 Sidewall and chamfer protection during hard mask removal for interconnect patterning Oct. 8, 2013
8541878 Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus Sep. 24, 2013
8541828 Methods for depositing high-K dielectrics Sep. 24, 2013
8536707 Semiconductor structure comprising moisture barrier and conductive redistribution layer Sep. 17, 2013
8531038 Top layers of metal for high performance IC's Sep. 10, 2013
8530955 Nonvolatile semiconductor memory device and method for manufacturing same Sep. 10, 2013
8525343 Device with through-silicon via (TSV) and method of forming the same Sep. 3, 2013
8513805 Manufacturing of a semiconductor device and the manufacturing method Aug. 20, 2013
8507965 Semiconductor device and manufacturing method thereof Aug. 13, 2013
8497542 ZrXHfYSn1-X-YO2 films as high K gate dielectrics Jul. 30, 2013
8492902 Multi-layer TSV insulation and methods of fabricating the same Jul. 23, 2013
8476765 Copper interconnect structure having a graphene cap Jul. 2, 2013
8476633 Thin film transistor array substrate for a display panel and a method for manufacturing a thin film transistor array substrate for a display panel Jul. 2, 2013
8471384 Top layers of metal for high performance IC's Jun. 25, 2013
8461685 Substrate comprising a plurality of integrated circuitry die, and a substrate Jun. 11, 2013
8446014 Integrated circuit interconnect structure May. 21, 2013
8446012 Interconnect structures May. 21, 2013
8445995 Semiconductor structure with conductive plug in an oxide layer May. 21, 2013
8445382 Side wall pore sealing for low-k dielectrics May. 21, 2013
8445377 Mechanically robust metal/low-k interconnects May. 21, 2013
8441796 Electrical power substrate May. 14, 2013
8431480 Semiconductor device and manufacturing method thereof Apr. 30, 2013
8426970 Substrate processing including a masking layer Apr. 23, 2013
8390135 Semiconductor device Mar. 5, 2013
8390121 Semiconductor device and method of manufacture thereof Mar. 5, 2013
8389358 Manufacturing method and structure of non-volatile memory Mar. 5, 2013
8384208 Semiconductor device and method of fabricating the same Feb. 26, 2013
8378489 Semiconductor device and manufacturing method therefor Feb. 19, 2013
8373275 Fine pitch solder bump structure with built-in stress buffer Feb. 12, 2013
8373274 Method of forming wiring structure and semiconductor device comprising underlying refractory metal layers Feb. 12, 2013
8361898 Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof Jan. 29, 2013
8358011 Interconnect structures with engineered dielectrics with nanocolumnar porosity Jan. 22, 2013
8350387 Semiconductor device and semiconductor storage device Jan. 8, 2013

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