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Class Information
Number: 257/760
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > Multiple metal levels on semiconductor, separated by insulating layer (e.g., multiple level metallization for integrated circuit) > Separating insulating layer is laminate or composite of plural insulating materials (e.g., silicon oxide on silicon nitride, silicon oxynitride)
Description: Subject matter wherein there is at least one separating insulator layer between different metal layers, which separating insulator layer is itself made up of plural sublayers, or which separating insulator layer is a composite such as a mixture of silicon oxide and silicon nitride.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619283 |
Methods of fabricating glass-based substrates and apparatus employing same |
Nov. 17, 2009 |
| 7619310 |
Semiconductor interconnect and method of making same |
Nov. 17, 2009 |
| 7612453 |
Semiconductor device having an interconnect structure and a reinforcing insulating film |
Nov. 3, 2009 |
| 7608926 |
Nonvolatile semiconductor memory device |
Oct. 27, 2009 |
| 7608928 |
Laminated body and semiconductor device |
Oct. 27, 2009 |
| 7605472 |
Interconnections having double capping layer and method for forming the same |
Oct. 20, 2009 |
| 7605471 |
Semiconductor devices and methods for manufacturing the same |
Oct. 20, 2009 |
| 7602048 |
Semiconductor device and semiconductor wafer having a multi-layered insulation film |
Oct. 13, 2009 |
| 7602066 |
Method of filling structures for forming via-first dual damascene interconnects |
Oct. 13, 2009 |
| 7602067 |
Hetero-structure variable silicon rich nitride for multiple level memory flash memory device |
Oct. 13, 2009 |
| 7595556 |
Semiconductor device and method for manufacturing the same |
Sep. 29, 2009 |
| 7595555 |
Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures |
Sep. 29, 2009 |
| 7595010 |
Method for producing a doped nitride film, doped oxide film and other doped films |
Sep. 29, 2009 |
| 7592660 |
Semiconductor device and method for manufacturing the same |
Sep. 22, 2009 |
| 7592710 |
Bond pad structure for wire bonding |
Sep. 22, 2009 |
| 7586132 |
Power FET with low on-resistance using merged metal layers |
Sep. 8, 2009 |
| 7582970 |
Carbon containing silicon oxide film having high ashing tolerance and adhesion |
Sep. 1, 2009 |
| 7582969 |
Hermetic interconnect structure and method of manufacture |
Sep. 1, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7572571 |
Image sensor and method for manufacturing the same |
Aug. 11, 2009 |
| 7572728 |
Semiconductor device and method for manufacturing the same |
Aug. 11, 2009 |
| 7564132 |
Semiconductor chip |
Jul. 21, 2009 |
| 7554200 |
Semiconductor devices including porous insulators |
Jun. 30, 2009 |
| 7553757 |
Semiconductor device and method of manufacturing the same |
Jun. 30, 2009 |
| 7550824 |
Low k interconnect dielectric using surface transformation |
Jun. 23, 2009 |
| 7550822 |
Dual-damascene metal wiring patterns for integrated circuit devices |
Jun. 23, 2009 |
| 7550788 |
Semiconductor device having fuse element arranged between electrodes formed in different wiring layers |
Jun. 23, 2009 |
| 7550823 |
Nonvolatile memory cell, array thereof, fabrication methods thereof and device comprising the same |
Jun. 23, 2009 |
| 7547977 |
Semiconductor chip having bond pads |
Jun. 16, 2009 |
| 7544992 |
Illuminating efficiency-increasable and light-erasable embedded memory structure |
Jun. 9, 2009 |
| 7544983 |
MTJ read head with sidewall spacers |
Jun. 9, 2009 |
| 7544608 |
Porous and dense hybrid interconnect structure and method of manufacture |
Jun. 9, 2009 |
| 7541682 |
Semiconductor chip having bond pads |
Jun. 2, 2009 |
| 7541638 |
Symmetrical and self-aligned non-volatile memory structure |
Jun. 2, 2009 |
| 7541646 |
Thin film transistor device and method of manufacturing the same |
Jun. 2, 2009 |
| 7535107 |
Tiled construction of layered materials |
May. 19, 2009 |
| 7521802 |
Semiconductor device having a refractory metal containing film and method for manufacturing the same |
Apr. 21, 2009 |
| 7521381 |
Method for producing silicon wafer and silicon wafer |
Apr. 21, 2009 |
| 7518246 |
Atomic layer deposition of CeO.sub.2/Al.sub.2O.sub.3 films as gate dielectrics |
Apr. 14, 2009 |
| 7518242 |
Semiconductor testing device |
Apr. 14, 2009 |
| 7514779 |
Multilayer build-up wiring board |
Apr. 7, 2009 |
| 7508076 |
Information handling system including a circuitized substrate having a dielectric layer without continuous fibers |
Mar. 24, 2009 |
| 7507656 |
Method and structure for low k interlayer dielectric layer |
Mar. 24, 2009 |
| 7504731 |
Interconnect structure to reduce stress induced voiding effect |
Mar. 17, 2009 |
| 7504699 |
Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections |
Mar. 17, 2009 |
| 7498677 |
Semiconductor device |
Mar. 3, 2009 |
| 7495337 |
Dual-gate device and method |
Feb. 24, 2009 |
| 7488428 |
Method for forming stacked via-holes in printed circuit boards |
Feb. 10, 2009 |
| 7485964 |
Dielectric material |
Feb. 3, 2009 |
| 7485915 |
Semiconductor device and method having capacitor and capacitor insulating film that includes preset metal element |
Feb. 3, 2009 |
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