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Class Information
Number: 257/759
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > Multiple metal levels on semiconductor, separated by insulating layer (e.g., multiple level metallization for integrated circuit) > Including organic insulating material between metal levels
Description: Subject matter wherein there is at least one layer of organic insulating material between different layers of metal. An organic compound is one which fulfills the requirements of the Class 260 definition, i.e., has a molecule characterized by two carbon atoms bonded together, one atom of carbon being bonded to at least one atom of hydrogen or a halogen, or one atom or carbon bonded to at least one atom of nitrogen by a single or double bond, certain compounds such as HCN, CN-CN, HNCO, HNCS, cyanogen halides, cyanamide, fulminic acid and metal carbides, being exceptions to this rule.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8692379 Integrated circuit connector access region Apr. 8, 2014
8680680 Semiconductor devices including porous insulators Mar. 25, 2014
8652962 Etch damage and ESL free dual damascene metal interconnect Feb. 18, 2014
8653629 Semiconductor device and wafer Feb. 18, 2014
8647978 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Feb. 11, 2014
8629560 Self aligned air-gap in interconnect structures Jan. 14, 2014
8618663 Patternable dielectric film structure with improved lithography and method of fabricating same Dec. 31, 2013
8614510 Semiconductor device including a metal wiring with a metal cap Dec. 24, 2013
8614507 Semiconductor devices having lower and upper interconnection structures that exhibit reduced coupling Dec. 24, 2013
8610278 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Dec. 17, 2013
8604618 Structure and method for reducing vertical crack propagation Dec. 10, 2013
8598706 Method for forming interlayer dielectric film, interlayer dielectric film, semiconductor device and semiconductor manufacturing apparatus Dec. 3, 2013
8592980 Carbon nanotube-modified low-K materials Nov. 26, 2013
8592990 Semiconductor device and method of manufacturing semiconductor device Nov. 26, 2013
8592983 Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device Nov. 26, 2013
8581388 Multilayered wiring substrate Nov. 12, 2013
8581239 Package structure and semiconductor structure thereof Nov. 12, 2013
8575753 Semiconductor device having a conductive structure including oxide and non oxide portions Nov. 5, 2013
8551877 Sidewall and chamfer protection during hard mask removal for interconnect patterning Oct. 8, 2013
8546947 Chip structure and process for forming the same Oct. 1, 2013
8541096 Printed circuit board and method of manufacturing the same Sep. 24, 2013
8531038 Top layers of metal for high performance IC's Sep. 10, 2013
8530955 Nonvolatile semiconductor memory device and method for manufacturing same Sep. 10, 2013
8525163 Organic EL device, method for fabricating organic EL device, and organic EL illumination system Sep. 3, 2013
8525174 Organic light emitting display device and method of manufacturing the same Sep. 3, 2013
8525289 Adjusting threshold voltage for sophisticated transistors by diffusing a gate dielectric cap layer material prior to gate dielectric stabilization Sep. 3, 2013
8519540 Self-aligned dual damascene BEOL structures with patternable low- K material and methods of forming same Aug. 27, 2013
8507901 Organic material and electrophotographic device Aug. 13, 2013
8497508 Semiconductor device and manufacturing method thereof Jul. 30, 2013
8487298 Organic semiconductor transistor Jul. 16, 2013
8481993 Semiconductor composite film, method for forming semiconductor composite film, thin film transistor, method for manufacturing thin film transistor, and electronic apparatus Jul. 9, 2013
8471384 Top layers of metal for high performance IC's Jun. 25, 2013
8445382 Side wall pore sealing for low-k dielectrics May. 21, 2013
8446014 Integrated circuit interconnect structure May. 21, 2013
8445377 Mechanically robust metal/low-k interconnects May. 21, 2013
8440579 Re-establishing surface characteristics of sensitive low-k dielectrics in microstructure device by using an in situ surface modification May. 14, 2013
8426970 Substrate processing including a masking layer Apr. 23, 2013
8415252 Selective copper encapsulation layer deposition Apr. 9, 2013
8415800 Top layers of metal for high performance IC's Apr. 9, 2013
8404577 Semiconductor device having a grain orientation layer Mar. 26, 2013
8405081 Organic thin film transistor having peripheral metal structures Mar. 26, 2013
8404584 Method of manufacturing semiconductor device Mar. 26, 2013
8390115 Wiring board and semiconductor device using the wiring board Mar. 5, 2013
8384189 High performance system-on-chip using post passivation process Feb. 26, 2013
8384205 Electronic device package and method of manufacture Feb. 26, 2013
8384208 Semiconductor device and method of fabricating the same Feb. 26, 2013
8384209 Semiconductor device and method for manufacturing semiconductor device Feb. 26, 2013
8378489 Semiconductor device and manufacturing method therefor Feb. 19, 2013
8324627 Organic thin film transistor substrate, its manufacturing method, image display panel, and its manufacturing method Dec. 4, 2012
8314435 Organic light emitting diode display Nov. 20, 2012

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