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Class Information
Number: 257/758
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > Multiple metal levels on semiconductor, separated by insulating layer (e.g., multiple level metallization for integrated circuit)
Description: Subject matter wherein there are plural layers of metal forming electrical contact material, the layers being separated by intervening layers of insulator material.










Sub-classes under this class:

Class Number Class Name Patents
257/759 Including organic insulating material between metal levels 826
257/760 Separating insulating layer is laminate or composite of plural insulating materials (e.g., silicon oxide on silicon nitride, silicon oxynitride) 1,055


Patents under this class:

Patent Number Title Of Patent Date Issued
8710658 Under bump passive components in wafer level packaging Apr. 29, 2014
8704374 Semiconductor device and method for manufacturing the same Apr. 22, 2014
8704372 Integrated circuits and methods for processing integrated circuits with embedded features Apr. 22, 2014
8704339 Semiconductor device Apr. 22, 2014
8692379 Integrated circuit connector access region Apr. 8, 2014
8692375 Interconnect structure containing various capping materials for programmable electrical fuses Apr. 8, 2014
8692374 Carbon nanotube circuit component structure Apr. 8, 2014
8692333 Semiconductor device for word line driver with efficient routing of conductor for decreased gate resistance Apr. 8, 2014
8686571 Bonding layer structure and method for wafer to wafer bonding Apr. 1, 2014
8686486 Memory device Apr. 1, 2014
8680680 Semiconductor devices including porous insulators Mar. 25, 2014
8680599 Semiconductor device and method of manufacturing the same Mar. 25, 2014
8674508 Seal ring structures with reduced moisture-induced reliability degradation Mar. 18, 2014
8674232 Device-embedded flexible printed circuit board and manufacturing method thereof Mar. 18, 2014
8673772 Biosensor chip and a method of manufacturing the same Mar. 18, 2014
8670638 Signal distribution and radiation in a wireless enabled integrated circuit (IC) using a leaky waveguide Mar. 11, 2014
8669661 Metal line and via formation using hard masks Mar. 11, 2014
8669659 Semiconductor device and a method of manufacturing the same Mar. 11, 2014
8669608 Method for manufacturing nonvolatile semiconductor storage device and nonvolatile semiconductor storage device Mar. 11, 2014
8669555 Semiconductor device Mar. 11, 2014
8664765 Semiconductor device Mar. 4, 2014
8664764 Semiconductor device including a core substrate and a semiconductor element Mar. 4, 2014
8664763 Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus Mar. 4, 2014
8664759 Integrated circuit with heat conducting structures for localized thermal control Mar. 4, 2014
8664113 Multilayer interconnect structure and method for integrated circuits Mar. 4, 2014
8664108 Stacked multilayer structure and manufacturing method thereof Mar. 4, 2014
8659159 Integrated circuit device with interconnects arranged parallel to each other and connected to contact via, and method for manufacturing same Feb. 25, 2014
8659158 Thermally inkjettable acrylic dielectric ink formulation and process Feb. 25, 2014
8658473 Ultrathin buried die module and method of manufacturing thereof Feb. 25, 2014
8653666 Semiconductor storage device having a peripheral circuit region and a memory cell region Feb. 18, 2014
8653664 Barrier layers for copper interconnect Feb. 18, 2014
8653663 Barrier layer for copper interconnect Feb. 18, 2014
8653662 Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits Feb. 18, 2014
8653629 Semiconductor device and wafer Feb. 18, 2014
8652962 Etch damage and ESL free dual damascene metal interconnect Feb. 18, 2014
8652855 Low resistance stacked annular contact Feb. 18, 2014
8648467 Semiconductor memory device and method of manufacturing the same Feb. 11, 2014
8648395 Integrated CMOS porous sensor Feb. 11, 2014
8647978 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Feb. 11, 2014
8643184 Crosstalk polarity reversal and cancellation through substrate material tuning Feb. 4, 2014
8643183 Long-term heat-treated integrated circuit arrangements and methods for producing the same Feb. 4, 2014
8643178 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same Feb. 4, 2014
8643151 Passivation layer for semiconductor devices Feb. 4, 2014
8643084 Vertical non-volatile memory device Feb. 4, 2014
8643083 Electronic devices with ultraviolet blocking layers Feb. 4, 2014
8642467 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method Feb. 4, 2014
8637988 Semiconductor device and method of testing the same Jan. 28, 2014
8637987 Semiconductor assemblies with multi-level substrates and associated methods of manufacturing Jan. 28, 2014
8637937 Through silicon via for use in integrated circuit chips Jan. 28, 2014
8633595 Semiconductor device having groove-shaped via-hole Jan. 21, 2014











 
 
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