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Class Information
Number: 257/758
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > Multiple metal levels on semiconductor, separated by insulating layer (e.g., multiple level metallization for integrated circuit)
Description: Subject matter wherein there are plural layers of metal forming electrical contact material, the layers being separated by intervening layers of insulator material.


Sub-classes under this class:

Class Number Class Name Patents
257/759 Including organic insulating material between metal levels 633
257/760 Separating insulating layer is laminate or composite of plural insulating materials (e.g., silicon oxide on silicon nitride, silicon oxynitride) 858


Patents under this class:

Patent Number Title Of Patent Date Issued
7619310 Semiconductor interconnect and method of making same Nov. 17, 2009
7619309 Integrated connection arrangements Nov. 17, 2009
7619297 Electronic device including an inductor Nov. 17, 2009
7619264 Semiconductor device Nov. 17, 2009
7618890 Methods for forming conductive structures and structures regarding same Nov. 17, 2009
7617598 Method of making a thermally isolated via structure Nov. 17, 2009
7615848 Semiconductor device and a method of manufacturing the same Nov. 10, 2009
7615819 Semiconductor device Nov. 10, 2009
7612453 Semiconductor device having an interconnect structure and a reinforcing insulating film Nov. 3, 2009
7608928 Laminated body and semiconductor device Oct. 27, 2009
7608927 Localized biasing for silicon on insulator structures Oct. 27, 2009
7605471 Semiconductor devices and methods for manufacturing the same Oct. 20, 2009
7605470 Dummy patterns and method of manufacture for mechanical strength of low K dielectric materials in copper interconnect structures for semiconductor devices Oct. 20, 2009
7605464 Semiconductor device Oct. 20, 2009
7605414 MOS transistors having low-resistance salicide gates and a self-aligned contact between them Oct. 20, 2009
7602065 Seal ring in semiconductor device Oct. 13, 2009
7602064 Semiconductor device having an inspection hole striding a boundary Oct. 13, 2009
7601998 Semiconductor memory device having metallization comprising select lines, bit lines and word lines Oct. 13, 2009
7601631 Very low dielectric constant plasma-enhanced CVD films Oct. 13, 2009
7601629 Semiconductive device fabricated using subliming materials to form interlevel dielectrics Oct. 13, 2009
7598616 Interconnect structure Oct. 6, 2009
7598615 Analytic structure for failure analysis of semiconductor device having a multi-stacked interconnection structure Oct. 6, 2009
7595555 Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures Sep. 29, 2009
7595554 Interconnect structure with dielectric air gaps Sep. 29, 2009
7592710 Bond pad structure for wire bonding Sep. 22, 2009
7592248 Method of forming semiconductor device having nanotube structures Sep. 22, 2009
7592247 Sub-lithographic local interconnects, and methods for forming same Sep. 22, 2009
7589424 Thin silicon based substrate Sep. 15, 2009
7589423 Semiconductor device and a method of manufacturing the same and designing the same Sep. 15, 2009
7589398 Embedded metal features structure Sep. 15, 2009
7589011 Semiconductor device and method of forming intermetal dielectric layer Sep. 15, 2009
7586196 Apparatus for an improved air gap interconnect structure Sep. 8, 2009
7586195 Semiconductor device Sep. 8, 2009
7586176 Semiconductor device with crack prevention ring Sep. 8, 2009
7586143 Semiconductor device Sep. 8, 2009
7586132 Power FET with low on-resistance using merged metal layers Sep. 8, 2009
7585754 Method of forming bonding pad opening Sep. 8, 2009
7582970 Carbon containing silicon oxide film having high ashing tolerance and adhesion Sep. 1, 2009
7582969 Hermetic interconnect structure and method of manufacture Sep. 1, 2009
7579696 Semiconductor device Aug. 25, 2009
7573142 Alignment key structure in a semiconductor device and method of forming the same Aug. 11, 2009
7573135 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film Aug. 11, 2009
7573133 Interconnect structures and methods for their fabrication Aug. 11, 2009
7572734 Etch depth control for dual damascene fabrication process Aug. 11, 2009
7572728 Semiconductor device and method for manufacturing the same Aug. 11, 2009
7569936 Semiconductor device and method of manufacturing the same Aug. 4, 2009
7569908 Semiconductor device and method of manufacturing the same Aug. 4, 2009
7569476 Semiconductor integrated circuit device and a method of manufacturing the same Aug. 4, 2009
7566971 Semiconductor device and manufacturing method thereof Jul. 28, 2009
7564135 Semiconductor device having self-aligned contact and method of fabricating the same Jul. 21, 2009



 
 
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