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Class Information
Number: 257/753
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > With adhesion promoting means (e.g., layer of material) to promote adhesion of contact to an insulating layer
Description: Subject matter wherein a means, e.g., a layer of material, is provided to promote adhesion of an electrical contact or lead to an insulating surface.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8710639 Semiconductor element-embedded wiring substrate Apr. 29, 2014
8710662 Light-reflective anisotropic conductive paste and light-emitting device Apr. 29, 2014
8710660 Hybrid interconnect scheme including aluminum metal line in low-k dielectric Apr. 29, 2014
8704367 Semiconductor device and manufacturing method of semiconductor device Apr. 22, 2014
8691687 Superfilled metal contact vias for semiconductor devices Apr. 8, 2014
8659157 Adhesive composition for producing semiconductor device and adhesive sheet for producing semiconductor device Feb. 25, 2014
8653664 Barrier layers for copper interconnect Feb. 18, 2014
8633594 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8633595 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8617984 Tungsten metallization: structure and fabrication of same Dec. 31, 2013
8618661 Die having coefficient of thermal expansion graded layer Dec. 31, 2013
8610277 Bridge type pad structure of a semiconductor device Dec. 17, 2013
8581404 Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures Nov. 12, 2013
8569889 Nano thick Pt metallization layer Oct. 29, 2013
8564132 Tungsten metallization: structure and fabrication of same Oct. 22, 2013
8536704 Semiconductor device and method for fabricating the same Sep. 17, 2013
8502382 MEMS and protection structure thereof Aug. 6, 2013
8492898 Printed circuit boards Jul. 23, 2013
8487438 Integrated circuit system having different-size solder bumps and different-size bonding pads Jul. 16, 2013
8466557 Solder bump confinement system for an integrated circuit package Jun. 18, 2013
8461684 Cobalt nitride layers for copper interconnects and methods for forming them Jun. 11, 2013
8461685 Substrate comprising a plurality of integrated circuitry die, and a substrate Jun. 11, 2013
8450200 Method for stacked contact with low aspect ratio May. 28, 2013
8445382 Side wall pore sealing for low-k dielectrics May. 21, 2013
8445377 Mechanically robust metal/low-k interconnects May. 21, 2013
8432037 Semiconductor device with a line and method of fabrication thereof Apr. 30, 2013
8432036 Lead frames with improved adhesion to plastic encapsulant Apr. 30, 2013
8410609 Semiconductor device having carbon nanotube interconnects contact deposited with different orientation and method for manufacturing the same Apr. 2, 2013
8410613 Semiconductor device having groove-shaped pattern Apr. 2, 2013
8405217 Coating method and solutions for enhanced electromigration resistance Mar. 26, 2013
8390121 Semiconductor device and method of manufacture thereof Mar. 5, 2013
8390134 Semiconductor device having surface protective films on bond pad Mar. 5, 2013
8384218 Back side metallization with superior adhesion in high-performance semiconductor devices Feb. 26, 2013
8377824 Methods and apparatus for depositing copper on tungsten Feb. 19, 2013
8373070 Metal structure of flexible multi-layer substrate and manufacturing method thereof Feb. 12, 2013
8354692 Vertical semiconductor power switch, electronic component and methods of producing the same Jan. 15, 2013
8319222 Adhesive composition Nov. 27, 2012
8314500 Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers Nov. 20, 2012
8314345 Device mounting board and semiconductor module Nov. 20, 2012
8294269 Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers Oct. 23, 2012
8294270 Copper alloy via bottom liner Oct. 23, 2012
8283754 Seal ring structure with metal pad Oct. 9, 2012
8268722 Interfacial capping layers for interconnects Sep. 18, 2012
8247836 Nickel tin bonding system with barrier layer for semiconductor wafers and devices Aug. 21, 2012
8237065 Twin-chip-mounting type diode Aug. 7, 2012
8227914 Mounting structure of electronic component Jul. 24, 2012
8212359 Semiconductor integrated circuit device, mounting structure of semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device Jul. 3, 2012
8193640 MEMS and a protection structure thereof Jun. 5, 2012
8193610 Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP Jun. 5, 2012
8188600 Semiconductor device and method of fabricating the same May. 29, 2012

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