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Class Information
Number: 257/753
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > With adhesion promoting means (e.g., layer of material) to promote adhesion of contact to an insulating layer
Description: Subject matter wherein a means, e.g., a layer of material, is provided to promote adhesion of an electrical contact or lead to an insulating surface.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7612456 |
Electronic device, semiconductor device using same, and method for manufacturing semiconductor device |
Nov. 3, 2009 |
| 7605469 |
Atomic layer deposited tantalum containing adhesion layer |
Oct. 20, 2009 |
| 7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 6, 2009 |
| 7579277 |
Semiconductor device and method for fabricating the same |
Aug. 25, 2009 |
| 7564132 |
Semiconductor chip |
Jul. 21, 2009 |
| 7554168 |
Semiconductor acceleration sensor device |
Jun. 30, 2009 |
| 7545042 |
Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure |
Jun. 9, 2009 |
| 7538434 |
Copper interconnection with conductive polymer layer and method of forming the same |
May. 26, 2009 |
| 7528488 |
Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure |
May. 5, 2009 |
| 7521779 |
Roughened printed circuit board |
Apr. 21, 2009 |
| 7514340 |
Composite integrated device and methods for forming thereof |
Apr. 7, 2009 |
| 7514359 |
Adhering layers to metals with dielectric adhesive layers |
Apr. 7, 2009 |
| 7504674 |
Electronic apparatus having a core conductive structure within an insulating layer |
Mar. 17, 2009 |
| 7495317 |
Semiconductor package with ferrite shielding structure |
Feb. 24, 2009 |
| 7485970 |
Semiconductor package substrate having contact pad protective layer formed thereon |
Feb. 3, 2009 |
| 7485961 |
Approach to avoid buckling in BPSG by using an intermediate barrier layer |
Feb. 3, 2009 |
| 7473643 |
Dendrite growth control circuit |
Jan. 6, 2009 |
| 7470987 |
Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate |
Dec. 30, 2008 |
| 7470986 |
Mounting structure, electro-optical device, and electronic apparatus |
Dec. 30, 2008 |
| 7446415 |
Method for filling electrically different features |
Nov. 4, 2008 |
| 7422977 |
Copper adhesion improvement device and method |
Sep. 9, 2008 |
| 7420278 |
Semiconductor device |
Sep. 2, 2008 |
| 7417316 |
Wired circuit forming board, wired circuit board, and thin metal layer forming method |
Aug. 26, 2008 |
| 7417264 |
Top-emitting nitride-based light emitting device and method of manufacturing the same |
Aug. 26, 2008 |
| 7405484 |
Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
Jul. 29, 2008 |
| 7405481 |
Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip |
Jul. 29, 2008 |
| 7402909 |
Microelectronic package interconnect and method of fabrication thereof |
Jul. 22, 2008 |
| 7375005 |
Method for reclaiming and reusing wafers |
May. 20, 2008 |
| 7361976 |
Data carrier with a module with a reinforcement strip |
Apr. 22, 2008 |
| 7362491 |
Heated glass panels and methods for making electrical contact with electro-conductive films |
Apr. 22, 2008 |
| 7355281 |
Method for making semiconductor device having a high-k gate dielectric layer and a metal gate electrode |
Apr. 8, 2008 |
| 7348671 |
Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same |
Mar. 25, 2008 |
| 7335989 |
Semiconductor device and production method therefor |
Feb. 26, 2008 |
| 7327033 |
Copper alloy via bottom liner |
Feb. 5, 2008 |
| 7315082 |
Semiconductor device having integrated circuit contact |
Jan. 1, 2008 |
| 7304383 |
TFT substrate for liquid crystal display apparatus and method of manufacturing the same |
Dec. 4, 2007 |
| 7301241 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 27, 2007 |
| 7294931 |
Method and apparatus for selective deposition |
Nov. 13, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7285858 |
Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate |
Oct. 23, 2007 |
| 7276801 |
Designs and methods for conductive bumps |
Oct. 2, 2007 |
| 7276441 |
Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures |
Oct. 2, 2007 |
| 7256353 |
Metal/ceramic bonding substrate and method for producing same |
Aug. 14, 2007 |
| 7256496 |
Semiconductor device having adhesion increasing film to prevent peeling |
Aug. 14, 2007 |
| 7233059 |
Semiconductor arrangement |
Jun. 19, 2007 |
| 7227265 |
Electroplated copper interconnection structure, process for making and electroplating bath |
Jun. 5, 2007 |
| 7224063 |
Dual-damascene metallization interconnection |
May. 29, 2007 |
| 7221055 |
System and method for die attach using a backside heat spreader |
May. 22, 2007 |
| 7218007 |
Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices |
May. 15, 2007 |
| 7205663 |
Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers |
Apr. 17, 2007 |
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