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Class Information
Number: 257/753
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > With adhesion promoting means (e.g., layer of material) to promote adhesion of contact to an insulating layer
Description: Subject matter wherein a means, e.g., a layer of material, is provided to promote adhesion of an electrical contact or lead to an insulating surface.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7446415 |
Method for filling electrically different features |
Nov. 4, 2008 |
| 7422977 |
Copper adhesion improvement device and method |
Sep. 9, 2008 |
| 7420278 |
Semiconductor device |
Sep. 2, 2008 |
| 7417264 |
Top-emitting nitride-based light emitting device and method of manufacturing the same |
Aug. 26, 2008 |
| 7417316 |
Wired circuit forming board, wired circuit board, and thin metal layer forming method |
Aug. 26, 2008 |
| 7405481 |
Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip |
Jul. 29, 2008 |
| 7405484 |
Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
Jul. 29, 2008 |
| 7402909 |
Microelectronic package interconnect and method of fabrication thereof |
Jul. 22, 2008 |
| 7375005 |
Method for reclaiming and reusing wafers |
May. 20, 2008 |
| 7362491 |
Heated glass panels and methods for making electrical contact with electro-conductive films |
Apr. 22, 2008 |
| 7361976 |
Data carrier with a module with a reinforcement strip |
Apr. 22, 2008 |
| 7355281 |
Method for making semiconductor device having a high-k gate dielectric layer and a metal gate electrode |
Apr. 8, 2008 |
| 7348671 |
Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same |
Mar. 25, 2008 |
| 7335989 |
Semiconductor device and production method therefor |
Feb. 26, 2008 |
| 7327033 |
Copper alloy via bottom liner |
Feb. 5, 2008 |
| 7315082 |
Semiconductor device having integrated circuit contact |
Jan. 1, 2008 |
| 7304383 |
TFT substrate for liquid crystal display apparatus and method of manufacturing the same |
Dec. 4, 2007 |
| 7301241 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 27, 2007 |
| 7294931 |
Method and apparatus for selective deposition |
Nov. 13, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7285858 |
Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate |
Oct. 23, 2007 |
| 7276441 |
Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures |
Oct. 2, 2007 |
| 7276801 |
Designs and methods for conductive bumps |
Oct. 2, 2007 |
| 7256353 |
Metal/ceramic bonding substrate and method for producing same |
Aug. 14, 2007 |
| 7256496 |
Semiconductor device having adhesion increasing film to prevent peeling |
Aug. 14, 2007 |
| 7233059 |
Semiconductor arrangement |
Jun. 19, 2007 |
| 7227265 |
Electroplated copper interconnection structure, process for making and electroplating bath |
Jun. 5, 2007 |
| 7224063 |
Dual-damascene metallization interconnection |
May. 29, 2007 |
| 7221055 |
System and method for die attach using a backside heat spreader |
May. 22, 2007 |
| 7218007 |
Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices |
May. 15, 2007 |
| 7205663 |
Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers |
Apr. 17, 2007 |
| 7202566 |
Crossed power strapped layout for full CMOS circuit design |
Apr. 10, 2007 |
| 7183649 |
Methods and procedures for engineering of composite conductive films by atomic layer deposition |
Feb. 27, 2007 |
| 7180188 |
Contact structure of semiconductor devices and method of fabricating the same |
Feb. 20, 2007 |
| 7180197 |
Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
Feb. 20, 2007 |
| 7176571 |
Nitride barrier layer to prevent metal (Cu) leakage issue in a dual damascene structure |
Feb. 13, 2007 |
| 7164203 |
Methods and procedures for engineering of composite conductive by atomic layer deposition |
Jan. 16, 2007 |
| 7148560 |
IC chip package structure and underfill process |
Dec. 12, 2006 |
| 7128979 |
Circuit board, method of producing same, and power module |
Oct. 31, 2006 |
| 7129580 |
Methods and procedures for engineering of composite conductive films by atomic layer deposition |
Oct. 31, 2006 |
| 7119439 |
Semiconductor device and method for manufacturing the same |
Oct. 10, 2006 |
| 7119441 |
Semiconductor interconnect structure |
Oct. 10, 2006 |
| 7115989 |
Adhesive sheet for producing a semiconductor device |
Oct. 3, 2006 |
| 7115992 |
Electrode structure for use in an integrated circuit |
Oct. 3, 2006 |
| 7109062 |
Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof |
Sep. 19, 2006 |
| 7109584 |
Dendrite growth control circuit |
Sep. 19, 2006 |
| 7102232 |
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer |
Sep. 5, 2006 |
| 7098537 |
Interconnect structure diffusion barrier with high nitrogen content |
Aug. 29, 2006 |
| 7091609 |
Semiconductor devices including an alloy layer and a wetting layer on an interlayer dielectric |
Aug. 15, 2006 |
| 7081674 |
Polyelectrolyte nanolayers as diffusion barriers in semiconductor devices |
Jul. 25, 2006 |
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