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Class Information
Number: 257/753
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > With adhesion promoting means (e.g., layer of material) to promote adhesion of contact to an insulating layer
Description: Subject matter wherein a means, e.g., a layer of material, is provided to promote adhesion of an electrical contact or lead to an insulating surface.


Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
7446415 Method for filling electrically different features Nov. 4, 2008
7422977 Copper adhesion improvement device and method Sep. 9, 2008
7420278 Semiconductor device Sep. 2, 2008
7417264 Top-emitting nitride-based light emitting device and method of manufacturing the same Aug. 26, 2008
7417316 Wired circuit forming board, wired circuit board, and thin metal layer forming method Aug. 26, 2008
7405481 Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip Jul. 29, 2008
7405484 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof Jul. 29, 2008
7402909 Microelectronic package interconnect and method of fabrication thereof Jul. 22, 2008
7375005 Method for reclaiming and reusing wafers May. 20, 2008
7362491 Heated glass panels and methods for making electrical contact with electro-conductive films Apr. 22, 2008
7361976 Data carrier with a module with a reinforcement strip Apr. 22, 2008
7355281 Method for making semiconductor device having a high-k gate dielectric layer and a metal gate electrode Apr. 8, 2008
7348671 Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same Mar. 25, 2008
7335989 Semiconductor device and production method therefor Feb. 26, 2008
7327033 Copper alloy via bottom liner Feb. 5, 2008
7315082 Semiconductor device having integrated circuit contact Jan. 1, 2008
7304383 TFT substrate for liquid crystal display apparatus and method of manufacturing the same Dec. 4, 2007
7301241 Semiconductor device for preventing defective filling of interconnection and cracking of insulating film Nov. 27, 2007
7294931 Method and apparatus for selective deposition Nov. 13, 2007
7288489 Process for thinning a semiconductor workpiece Oct. 30, 2007
7285858 Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate Oct. 23, 2007
7276441 Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures Oct. 2, 2007
7276801 Designs and methods for conductive bumps Oct. 2, 2007
7256353 Metal/ceramic bonding substrate and method for producing same Aug. 14, 2007
7256496 Semiconductor device having adhesion increasing film to prevent peeling Aug. 14, 2007
7233059 Semiconductor arrangement Jun. 19, 2007
7227265 Electroplated copper interconnection structure, process for making and electroplating bath Jun. 5, 2007
7224063 Dual-damascene metallization interconnection May. 29, 2007
7221055 System and method for die attach using a backside heat spreader May. 22, 2007
7218007 Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices May. 15, 2007
7205663 Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers Apr. 17, 2007
7202566 Crossed power strapped layout for full CMOS circuit design Apr. 10, 2007
7183649 Methods and procedures for engineering of composite conductive films by atomic layer deposition Feb. 27, 2007
7180188 Contact structure of semiconductor devices and method of fabricating the same Feb. 20, 2007
7180197 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof Feb. 20, 2007
7176571 Nitride barrier layer to prevent metal (Cu) leakage issue in a dual damascene structure Feb. 13, 2007
7164203 Methods and procedures for engineering of composite conductive by atomic layer deposition Jan. 16, 2007
7148560 IC chip package structure and underfill process Dec. 12, 2006
7128979 Circuit board, method of producing same, and power module Oct. 31, 2006
7129580 Methods and procedures for engineering of composite conductive films by atomic layer deposition Oct. 31, 2006
7119439 Semiconductor device and method for manufacturing the same Oct. 10, 2006
7119441 Semiconductor interconnect structure Oct. 10, 2006
7115989 Adhesive sheet for producing a semiconductor device Oct. 3, 2006
7115992 Electrode structure for use in an integrated circuit Oct. 3, 2006
7109062 Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof Sep. 19, 2006
7109584 Dendrite growth control circuit Sep. 19, 2006
7102232 Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer Sep. 5, 2006
7098537 Interconnect structure diffusion barrier with high nitrogen content Aug. 29, 2006
7091609 Semiconductor devices including an alloy layer and a wetting layer on an interlayer dielectric Aug. 15, 2006
7081674 Polyelectrolyte nanolayers as diffusion barriers in semiconductor devices Jul. 25, 2006

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