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Class Information
Number: 257/752
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > Planarized to top of insulating layer
Description: Subject matter wherein a contact or lead and an insulating layer to which it is connected form a single planar surface.


Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
7456501 Semiconductor structure having recess with conductive metal Nov. 25, 2008
7446415 Method for filling electrically different features Nov. 4, 2008
7446416 Barrier material formation in integrated circuit structures Nov. 4, 2008
7439182 Semiconductor device and method of fabricating the same Oct. 21, 2008
7439623 Semiconductor device having via connecting between interconnects Oct. 21, 2008
7414275 Multi-level interconnections for an integrated circuit chip Aug. 19, 2008
7414314 Semiconductor device and manufacturing method thereof Aug. 19, 2008
7397122 Metal wiring for semiconductor device and method for forming the same Jul. 8, 2008
7371679 Semiconductor device with a metal line and method of forming the same May. 13, 2008
7348676 Semiconductor device having a metal wiring structure Mar. 25, 2008
7338907 Selective etching processes of silicon nitride and indium oxide thin films for FeRAM device applications Mar. 4, 2008
7332813 Semiconductor device Feb. 19, 2008
7327034 Compositions for planarization of metal-containing surfaces using halogens and halide salts Feb. 5, 2008
7315082 Semiconductor device having integrated circuit contact Jan. 1, 2008
7294570 Contact integration method Nov. 13, 2007
7291920 Semiconductor structures Nov. 6, 2007
7259432 Semiconductor device for reducing parasitic capacitance produced in the vicinity of a transistor located within the semiconductor device Aug. 21, 2007
7250682 Semiconductor integrated circuit device Jul. 31, 2007
7235882 Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same Jun. 26, 2007
7233059 Semiconductor arrangement Jun. 19, 2007
7230335 Inspection methods and structures for visualizing and/or detecting specific chip structures Jun. 12, 2007
7227265 Electroplated copper interconnection structure, process for making and electroplating bath Jun. 5, 2007
7193323 Electroplated CoWP composite structures as copper barrier layers Mar. 20, 2007
7187085 Semiconductor device including dual damascene interconnections Mar. 6, 2007
7180188 Contact structure of semiconductor devices and method of fabricating the same Feb. 20, 2007
7176571 Nitride barrier layer to prevent metal (Cu) leakage issue in a dual damascene structure Feb. 13, 2007
7164206 Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer Jan. 16, 2007
7161246 Interconnect alloys and methods and apparatus using same Jan. 9, 2007
7146722 Method of forming a bond pad structure Dec. 12, 2006
7145245 Low-k dielectric film with good mechanical strength that varies in local porosity depending on location on substrate--therein Dec. 5, 2006
7145244 Hardening of copper to improve copper CMP performance Dec. 5, 2006
7145239 Circuit board with trace configuration for high-speed digital differential signaling Dec. 5, 2006
7145238 Semiconductor package and substrate having multi-level vias Dec. 5, 2006
RE39413 Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers Nov. 28, 2006
7122898 Electrical programmable metal resistor Oct. 17, 2006
7115991 Method for creating barriers for copper diffusion Oct. 3, 2006
7105925 Differential planarization Sep. 12, 2006
7098497 Semiconductor device using high-dielectric-constant material and method of manufacturing the same Aug. 29, 2006
7087998 Control of air gap position in a dielectric layer Aug. 8, 2006
7071099 Forming of local and global wiring for semiconductor product Jul. 4, 2006
7041586 Semiconductor device having a multilayer interconnection structure May. 9, 2006
7042099 Semiconductor device containing a dummy wire May. 9, 2006
7034360 High voltage transistor and method of manufacturing the same Apr. 25, 2006
7015531 FeRAM having bottom electrode connected to storage node and method for forming the same Mar. 21, 2006
7012335 Semiconductor device wiring and method of manufacturing the same Mar. 14, 2006
6992371 Device including an amorphous carbon layer for improved adhesion of organic layers and method of fabrication Jan. 31, 2006
6992390 Liner with improved electromigration redundancy for damascene interconnects Jan. 31, 2006
6979903 Integrated circuit with dielectric diffusion barrier layer formed between interconnects and interlayer dielectric layers Dec. 27, 2005
6972492 Method and structure to form capacitor in copper damascene process for integrated circuit devices Dec. 6, 2005
6969911 Wiring structure of semiconductor device and production method of the device Nov. 29, 2005

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