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Browse by Category: Main > Physics
Class Information
Number: 257/752
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > Planarized to top of insulating layer
Description: Subject matter wherein a contact or lead and an insulating layer to which it is connected form a single planar surface.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
8710660 Hybrid interconnect scheme including aluminum metal line in low-k dielectric Apr. 29, 2014
8710661 Methods for selective reverse mask planarization and interconnect structures formed thereby Apr. 29, 2014
8669182 Metal cap with ultra-low .kappa. dielectric material for circuit interconnect applications Mar. 11, 2014
8669608 Method for manufacturing nonvolatile semiconductor storage device and nonvolatile semiconductor storage device Mar. 11, 2014
8653663 Barrier layer for copper interconnect Feb. 18, 2014
8558350 Metal-oxide-metal capacitor structure Oct. 15, 2013
8545998 Electroless deposition of platinum on copper Oct. 1, 2013
8541882 Stacked IC device with recessed conductive layers adjacent to interlevel conductors Sep. 24, 2013
8536704 Semiconductor device and method for fabricating the same Sep. 17, 2013
8518818 Reverse damascene process Aug. 27, 2013
8513777 Method and apparatus for generating reticle data Aug. 20, 2013
8482125 Conductive sidewall for microbumps Jul. 9, 2013
8476766 Semiconductor memory device and method for manufacturing the same Jul. 2, 2013
8432037 Semiconductor device with a line and method of fabrication thereof Apr. 30, 2013
8415251 Electric component and component and method for the production thereof Apr. 9, 2013
8394656 Method of creating MEMS device cavities by a non-etching process Mar. 12, 2013
8390120 Semiconductor device and method of fabricating the same Mar. 5, 2013
8390123 ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer Mar. 5, 2013
8373070 Metal structure of flexible multi-layer substrate and manufacturing method thereof Feb. 12, 2013
8373276 Printed wiring board and method for manufacturing the same Feb. 12, 2013
8368211 Solderable top metalization and passivation for source mounted package Feb. 5, 2013
8368227 Semiconductor element and package having semiconductor element Feb. 5, 2013
8354751 Interconnect structure for electromigration enhancement Jan. 15, 2013
8334597 Semiconductor device having via connecting between interconnects Dec. 18, 2012
8304300 Method of manufacturing display device including transistor Nov. 6, 2012
8258629 Curing low-k dielectrics for improving mechanical strength Sep. 4, 2012
8232647 Structure and process for metallization in high aspect ratio features Jul. 31, 2012
8216932 Method of manufacturing semiconductor devices having metal lines Jul. 10, 2012
8178950 Multilayered through a via May. 15, 2012
8138604 Metal cap with ultra-low k dielectric material for circuit interconnect applications Mar. 20, 2012
8119519 Semiconductor device manufacturing method Feb. 21, 2012
8105942 CMP-first damascene process scheme Jan. 31, 2012
8106513 Copper damascene and dual damascene interconnect wiring Jan. 31, 2012
8089153 Method for eliminating loading effect using a via plug Jan. 3, 2012
8058731 Technique for forming metal lines in a semiconductor by adapting the temperature dependence of the line resistance Nov. 15, 2011
8053357 Prevention of post CMP defects in CU/FSG process Nov. 8, 2011
8044519 Semiconductor device and method of fabricating the same Oct. 25, 2011
8039968 Semiconductor integrated circuit device Oct. 18, 2011
8026604 Semiconductor devices having contact holes including protrusions exposing contact pads Sep. 27, 2011
8026605 Interconnect structure and method of manufacturing a damascene structure Sep. 27, 2011
8022550 Semiconductor integrated circuit device Sep. 20, 2011
8017452 Method of manufacturing semiconductor device with electrode for external connection and semiconductor device obtained by means of said method Sep. 13, 2011
8004082 Electronic component formed with barrier-seed layer on base material Aug. 23, 2011
7968456 Method of forming an embedded barrier layer for protection from chemical mechanical polishing process Jun. 28, 2011
7964969 Semiconductor device having via connecting between interconnects Jun. 21, 2011
7960188 Polishing method Jun. 14, 2011
7936069 Semiconductor device with a line and method of fabrication thereof May. 3, 2011
7911037 Method and structure for creating embedded metal features Mar. 22, 2011
7906430 Method of manufacturing a semiconductor device with a peeling prevention layer Mar. 15, 2011
7898065 Structure and method for device-specific fill for improved anneal uniformity Mar. 1, 2011

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