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Class Information
Number: 257/751
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer forms a diffusion barrier
Description: Subject matter wherein at least one layer forms a barrier to the diffusion of the contact material into the semiconductor or into another contact layer.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710672 Semiconductor device and method of manufacturing the same Apr. 29, 2014
8710660 Hybrid interconnect scheme including aluminum metal line in low-k dielectric Apr. 29, 2014
8710659 Semiconductor device and method of manufacturing the same Apr. 29, 2014
8704373 Semiconductor device and a method of manufacturing the same Apr. 22, 2014
8704367 Semiconductor device and manufacturing method of semiconductor device Apr. 22, 2014
8692372 Semiconductor device having impurity doped polycrystalline layer including impurity diffusion prevention layer and dynamic random memory device including the semiconductor device Apr. 8, 2014
8691688 Method of manufacturing semiconductor structure Apr. 8, 2014
8685851 MOS device with memory function and manufacturing method thereof Apr. 1, 2014
8681527 Semiconductor device Mar. 25, 2014
8680682 Barrier for through-silicon via Mar. 25, 2014
8679970 Structure and process for conductive contact integration Mar. 25, 2014
8674508 Seal ring structures with reduced moisture-induced reliability degradation Mar. 18, 2014
8669177 Semiconductor device and method for manufacturing semiconductor device Mar. 11, 2014
8661664 Techniques for forming narrow copper filled vias having improved conductivity Mar. 4, 2014
8659156 Interconnect structure with an electromigration and stress migration enhancement liner Feb. 25, 2014
8658533 Semiconductor interconnect structure with multi-layered seed layer providing enhanced reliability and minimizing electromigration Feb. 25, 2014
8653665 Barrier layer, film forming method, and processing system Feb. 18, 2014
8653664 Barrier layers for copper interconnect Feb. 18, 2014
8653663 Barrier layer for copper interconnect Feb. 18, 2014
8648466 Method for producing a metallization having two multiple alternating metallization layers for at least one contact pad and semiconductor wafer having said metallization for at least one contac Feb. 11, 2014
8648465 Semiconductor interconnect structure having enhanced performance and reliability Feb. 11, 2014
8647978 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Feb. 11, 2014
8642467 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method Feb. 4, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8629561 Air gap-containing interconnect structure having photo-patternable low k material Jan. 14, 2014
8624394 Integrated technology for partial air gap low K deposition Jan. 7, 2014
8624388 Package carrier and manufacturing method thereof Jan. 7, 2014
8624382 Packaging substrate and method of fabricating the same Jan. 7, 2014
8618662 Devices containing carbon nanomaterial electrical interconnects overcoated with metal nitride films and methods for production thereof Dec. 31, 2013
8618661 Die having coefficient of thermal expansion graded layer Dec. 31, 2013
8614107 Liner-free tungsten contact Dec. 24, 2013
8614106 Liner-free tungsten contact Dec. 24, 2013
8610285 3D IC packaging structures and methods with a metal pillar Dec. 17, 2013
8610283 Semiconductor device having a copper plug Dec. 17, 2013
8610278 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Dec. 17, 2013
8610276 Metal cap for back end of line (BEOL) interconnects, design structure and method of manufacture Dec. 17, 2013
8610275 Semiconductor contact structure including a spacer formed within a via and method of manufacturing the same Dec. 17, 2013
8610270 Semiconductor device and semiconductor assembly with lead-free solder Dec. 17, 2013
8604502 Light emitting diodes including barrier sublayers Dec. 10, 2013
8592979 Semiconductor device conductive pattern structures and methods of manufacturing the same Nov. 26, 2013
8592978 Method of fabricating semiconductor device and the semiconductor device Nov. 26, 2013
8592977 Integrated circuit (IC) chip and method for fabricating the same Nov. 26, 2013
8592884 Semiconductor device including capacitor Nov. 26, 2013
8592306 Redundant metal barrier structure for interconnect applications Nov. 26, 2013
8587119 Conductive feature for semiconductor substrate and method of manufacture Nov. 19, 2013
8586418 Method for the production of an electronic component and electronic component produced according to this method Nov. 19, 2013
8581406 Flip chip mounted monolithic microwave integrated circuit (MMIC) structure Nov. 12, 2013
8581405 Integrated circuit having a semiconductor substrate with barrier layer Nov. 12, 2013
8581400 Post-passivation interconnect structure Nov. 12, 2013
8580688 Copper interconnection structure and method for forming copper interconnections Nov. 12, 2013











 
 
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