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Class Information
Number: 257/751
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered > At least one layer forms a diffusion barrier
Description: Subject matter wherein at least one layer forms a barrier to the diffusion of the contact material into the semiconductor or into another contact layer.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615867 |
Thin-film transistor, method of manufacturing the same, liquid crystal display panel having the same and electro-luminescence display panel having the same |
Nov. 10, 2009 |
| 7615866 |
Contact surrounded by passivation and polymide and method therefor |
Nov. 10, 2009 |
| 7615482 |
Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength |
Nov. 10, 2009 |
| 7612456 |
Electronic device, semiconductor device using same, and method for manufacturing semiconductor device |
Nov. 3, 2009 |
| 7612453 |
Semiconductor device having an interconnect structure and a reinforcing insulating film |
Nov. 3, 2009 |
| 7612452 |
Method for manufacturing a semiconductor device and semiconductor device |
Nov. 3, 2009 |
| 7612451 |
Reducing resistivity in interconnect structures by forming an inter-layer |
Nov. 3, 2009 |
| 7611915 |
Methods of manufacturing light emitting diodes including barrier layers/sublayers |
Nov. 3, 2009 |
| 7605468 |
Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow |
Oct. 20, 2009 |
| 7601633 |
Semiconductor device and method for fabricating the same |
Oct. 13, 2009 |
| 7598614 |
Low leakage metal-containing cap process using oxidation |
Oct. 6, 2009 |
| 7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 6, 2009 |
| 7586143 |
Semiconductor device |
Sep. 8, 2009 |
| 7573132 |
Wiring structure of a semiconductor device and method of forming the same |
Aug. 11, 2009 |
| 7573061 |
Low-k SiC copper diffusion barrier films |
Aug. 11, 2009 |
| 7570336 |
Display device with piezoelectric material and method for fabricating the same |
Aug. 4, 2009 |
| 7566976 |
Semiconductor device and method for fabricating the same |
Jul. 28, 2009 |
| 7566975 |
Semiconductor device and method for manufacturing the same |
Jul. 28, 2009 |
| 7566973 |
Semiconductor device and method of manufacturing the same |
Jul. 28, 2009 |
| 7566972 |
Semiconductor device and method for manufacturing the semiconductor device |
Jul. 28, 2009 |
| 7564133 |
Semiconductor device and method for fabricating the same |
Jul. 21, 2009 |
| 7560816 |
Small grain size, conformal aluminum interconnects and method for their formation |
Jul. 14, 2009 |
| 7560815 |
Device structures including ruthenium silicide diffusion barrier layers |
Jul. 14, 2009 |
| 7560814 |
Semiconductor device that improves electrical connection reliability |
Jul. 14, 2009 |
| 7557446 |
Semiconductor device and a fabrication process thereof |
Jul. 7, 2009 |
| 7554176 |
Integrated circuits having a multi-layer structure with a seal ring |
Jun. 30, 2009 |
| 7550822 |
Dual-damascene metal wiring patterns for integrated circuit devices |
Jun. 23, 2009 |
| 7547972 |
Laminated structure, very-large-scale integrated circuit wiring board, and method of formation thereof |
Jun. 16, 2009 |
| 7545041 |
Techniques for patterning features in semiconductor devices |
Jun. 9, 2009 |
| 7545040 |
Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device |
Jun. 9, 2009 |
| 7544986 |
System including integrated circuit structures formed in a silicone ladder polymer layer |
Jun. 9, 2009 |
| 7541675 |
Semiconductor device including fluorine diffusion barrier layer and method for manufacturing the same |
Jun. 2, 2009 |
| 7538434 |
Copper interconnection with conductive polymer layer and method of forming the same |
May. 26, 2009 |
| 7535104 |
Structure and method for bond pads of copper-metallized integrated circuits |
May. 19, 2009 |
| 7535095 |
Printed wiring board and method for producing the same |
May. 19, 2009 |
| 7531902 |
Multi-layered metal line of semiconductor device having excellent diffusion barrier and method for forming the same |
May. 12, 2009 |
| 7531901 |
Metal interconnection of semiconductor device and method for forming the same |
May. 12, 2009 |
| 7528430 |
Electronic systems |
May. 5, 2009 |
| 7525197 |
Barrier process/structure for transistor trench contact applications |
Apr. 28, 2009 |
| 7525196 |
Protection of seedlayer for electroplating |
Apr. 28, 2009 |
| 7521801 |
Semiconductor device |
Apr. 21, 2009 |
| 7511349 |
Contact or via hole structure with enlarged bottom critical dimension |
Mar. 31, 2009 |
| 7508082 |
Semiconductor device and method of manufacturing the same |
Mar. 24, 2009 |
| 7507988 |
Semiconductor heterostructure including a substantially relaxed, low defect density SiGe layer |
Mar. 24, 2009 |
| 7507660 |
Deposition processes for tungsten-containing barrier layers |
Mar. 24, 2009 |
| 7504725 |
Semiconductor memory device having low-resistance tungsten line and method of manufacturing the semiconductor memory device |
Mar. 17, 2009 |
| 7504674 |
Electronic apparatus having a core conductive structure within an insulating layer |
Mar. 17, 2009 |
| 7494867 |
Semiconductor device having MIM capacitive elements and manufacturing method for the same |
Feb. 24, 2009 |
| 7488679 |
Interconnect structure and process of making the same |
Feb. 10, 2009 |
| 7485970 |
Semiconductor package substrate having contact pad protective layer formed thereon |
Feb. 3, 2009 |
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