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Class Information
Number: 257/750
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered
Description: Subject matter wherein the specified contact material is layered.










Sub-classes under this class:

Class Number Class Name Patents
257/766 At least one layer containing chromium or nickel 423
257/762 At least one layer containing silver or copper 1,188
257/761 At least one layer containing vanadium, hafnium, niobium, zirconium, or tantalum 366
257/751 At least one layer forms a diffusion barrier 1,655
257/765 At least one layer of an alloy containing aluminum 501
257/763 At least one layer of molybdenum, titanium, or tungsten 980
257/754 At least one layer of silicide or polycrystalline silicon 607
257/758 Multiple metal levels on semiconductor, separated by insulating layer (e.g., multiple level metallization for integrated circuit) 3,974
257/752 Planarized to top of insulating layer 559
257/753 With adhesion promoting means (e.g., layer of material) to promote adhesion of contact to an insulating layer 479


Patents under this class:

Patent Number Title Of Patent Date Issued
8710663 Method of manufacturing semiconductor device and semiconductor device Apr. 29, 2014
8704372 Integrated circuits and methods for processing integrated circuits with embedded features Apr. 22, 2014
8692372 Semiconductor device having impurity doped polycrystalline layer including impurity diffusion prevention layer and dynamic random memory device including the semiconductor device Apr. 8, 2014
8692371 Semiconductor apparatus and manufacturing method thereof Apr. 8, 2014
8686562 Refractory metal nitride capped electrical contact and method for frabricating same Apr. 1, 2014
8673772 Biosensor chip and a method of manufacturing the same Mar. 18, 2014
8648464 Semiconductor device and manufacturing method thereof Feb. 11, 2014
8643151 Passivation layer for semiconductor devices Feb. 4, 2014
8643147 Seal ring structure with improved cracking protection and reduced problems Feb. 4, 2014
8633593 Semiconductor device Jan. 21, 2014
8629561 Air gap-containing interconnect structure having photo-patternable low k material Jan. 14, 2014
8604625 Semiconductor device having conductive pads to prevent solder reflow Dec. 10, 2013
8604616 Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip Dec. 10, 2013
8598705 Composite substrate for a semiconductor chip Dec. 3, 2013
8598704 Semiconductor device Dec. 3, 2013
8598703 Semiconductor device Dec. 3, 2013
8592985 Methods of forming conductive structures and methods of forming DRAM cells Nov. 26, 2013
8587112 Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack Nov. 19, 2013
8581404 Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures Nov. 12, 2013
8575751 Conductive bump, method for producing the same, and electronic component mounted structure Nov. 5, 2013
8569887 Post passivation interconnect with oxidation prevention layer Oct. 29, 2013
8564131 Semiconductor device and method for manufacturing the same Oct. 22, 2013
8558381 Semiconductor device Oct. 15, 2013
8552559 Very thick metal interconnection scheme in IC chips Oct. 8, 2013
8546947 Chip structure and process for forming the same Oct. 1, 2013
8541882 Stacked IC device with recessed conductive layers adjacent to interlevel conductors Sep. 24, 2013
8536708 Method of manufacturing a semiconductor device and semiconductor device Sep. 17, 2013
8536703 Semiconductor devices and electronic systems Sep. 17, 2013
8525339 Hybrid copper interconnect structure and method of fabricating same Sep. 3, 2013
8524596 Techniques for improving bond pad performance Sep. 3, 2013
8513808 Semiconductor device having trench-isolated element formation region Aug. 20, 2013
8513805 Manufacturing of a semiconductor device and the manufacturing method Aug. 20, 2013
8507379 Semiconductor device and manufacturing method thereof Aug. 13, 2013
8492893 Semiconductor device capable of preventing dielectric layer from cracking Jul. 23, 2013
8487439 Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board Jul. 16, 2013
8487437 Electronic device package and method for fabricating the same Jul. 16, 2013
8487304 High performance compliant wafer test probe Jul. 16, 2013
8482126 Semiconductor device Jul. 9, 2013
8476764 Bonding pad structure for semiconductor devices Jul. 2, 2013
8476759 Electrical connection structure Jul. 2, 2013
8461685 Substrate comprising a plurality of integrated circuitry die, and a substrate Jun. 11, 2013
8461681 Layered structure for corrosion resistant interconnect contacts Jun. 11, 2013
8460996 Semiconductor devices with different dielectric thicknesses Jun. 11, 2013
8456006 Hybrid interconnect structure for performance improvement and reliability enhancement Jun. 4, 2013
8450204 Structure and process for metallization in high aspect ratio features May. 28, 2013
8445382 Side wall pore sealing for low-k dielectrics May. 21, 2013
8445321 Semiconductor device and method of manufacturing the same May. 21, 2013
8441130 Power supply interconnect structure of semiconductor integrated circuit May. 14, 2013
8436482 Semiconductor device, and method of fabricating semiconductor device May. 7, 2013
8432045 Conductive pads defined by embedded traces Apr. 30, 2013











 
 
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