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Class Information
Number: 257/750
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > Layered
Description: Subject matter wherein the specified contact material is layered.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 257/766 |
At least one layer containing chromium or nickel |
346 |
| 257/762 |
At least one layer containing silver or copper |
843 |
| 257/761 |
At least one layer containing vanadium, hafnium, niobium, zirconium, or tantalum |
277 |
| 257/751 |
At least one layer forms a diffusion barrier |
1,166 |
| 257/765 |
At least one layer of an alloy containing aluminum |
408 |
| 257/763 |
At least one layer of molybdenum, titanium, or tungsten |
832 |
| 257/754 |
At least one layer of silicide or polycrystalline silicon |
510 |
| 257/758 |
Multiple metal levels on semiconductor, separated by insulating layer (e.g., multiple level metallization for integrated circuit) |
2,662 |
| 257/752 |
Planarized to top of insulating layer |
471 |
| 257/753 |
With adhesion promoting means (e.g., layer of material) to promote adhesion of contact to an insulating layer |
356 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459786 |
Semiconductor device |
Dec. 2, 2008 |
| 7449361 |
Semiconductor substrate with islands of diamond and resulting devices |
Nov. 11, 2008 |
| 7443019 |
Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same |
Oct. 28, 2008 |
| 7443032 |
Memory device with chemical vapor deposition of titanium for titanium silicide contacts |
Oct. 28, 2008 |
| 7442961 |
Image display device |
Oct. 28, 2008 |
| 7439624 |
Enhanced mechanical strength via contacts |
Oct. 21, 2008 |
| 7439623 |
Semiconductor device having via connecting between interconnects |
Oct. 21, 2008 |
| 7432594 |
Semiconductor chip, electrically connections therefor |
Oct. 7, 2008 |
| 7432584 |
Leadframe for use in a semiconductor package |
Oct. 7, 2008 |
| 7423332 |
Vertical laminated electrical switch circuit |
Sep. 9, 2008 |
| 7423343 |
Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof |
Sep. 9, 2008 |
| 7420276 |
Post passivation structure for semiconductor chip or wafer |
Sep. 2, 2008 |
| 7420211 |
Wiring line and manufacture process thereof, and semiconductor device and manufacturing process thereof |
Sep. 2, 2008 |
| 7417316 |
Wired circuit forming board, wired circuit board, and thin metal layer forming method |
Aug. 26, 2008 |
| 7417264 |
Top-emitting nitride-based light emitting device and method of manufacturing the same |
Aug. 26, 2008 |
| 7414275 |
Multi-level interconnections for an integrated circuit chip |
Aug. 19, 2008 |
| 7411301 |
Semiconductor integrated circuit device |
Aug. 12, 2008 |
| 7411299 |
Passivation film of semiconductor device |
Aug. 12, 2008 |
| 7405480 |
Elimination of thermal deformation in electronic structures |
Jul. 29, 2008 |
| 7405419 |
Unidirectionally conductive materials for interconnection |
Jul. 29, 2008 |
| 7402883 |
Back end of the line structures with liner and noble metal layer |
Jul. 22, 2008 |
| 7400041 |
Compliant multi-composition interconnects |
Jul. 15, 2008 |
| 7397122 |
Metal wiring for semiconductor device and method for forming the same |
Jul. 8, 2008 |
| 7397125 |
Semiconductor device with bonding pad support structure |
Jul. 8, 2008 |
| 7382037 |
Semiconductor device with a peeling prevention layer |
Jun. 3, 2008 |
| 7382049 |
Chip package and bump connecting structure thereof |
Jun. 3, 2008 |
| 7382051 |
Semiconductor device with reduced contact resistance |
Jun. 3, 2008 |
| 7372153 |
Integrated circuit package bond pad having plurality of conductive members |
May. 13, 2008 |
| 7371679 |
Semiconductor device with a metal line and method of forming the same |
May. 13, 2008 |
| 7368392 |
Method of fabricating a gate structure of a field effect transistor having a metal-containing gate electrode |
May. 6, 2008 |
| 7362491 |
Heated glass panels and methods for making electrical contact with electro-conductive films |
Apr. 22, 2008 |
| 7361993 |
Terminal pad structures and methods of fabricating same |
Apr. 22, 2008 |
| 7361991 |
Closed air gap interconnect structure |
Apr. 22, 2008 |
| 7358618 |
Semiconductor device and manufacturing method thereof |
Apr. 15, 2008 |
| 7355281 |
Method for making semiconductor device having a high-k gate dielectric layer and a metal gate electrode |
Apr. 8, 2008 |
| 7352064 |
Multiple layer resist scheme implementing etch recipe particular to each layer |
Apr. 1, 2008 |
| 7348669 |
Bump structure of semiconductor device and method of manufacturing the same |
Mar. 25, 2008 |
| 7339270 |
Semiconductor device and method for fabricating the same |
Mar. 4, 2008 |
| 7332433 |
Methods of modulating the work functions of film layers |
Feb. 19, 2008 |
| 7327031 |
Semiconductor device and method of manufacturing the same |
Feb. 5, 2008 |
| 7321166 |
Wiring board having connecting wiring between electrode plane and connecting pad |
Jan. 22, 2008 |
| 7321171 |
Semiconductor integrated circuit device |
Jan. 22, 2008 |
| 7319271 |
Semiconductor device |
Jan. 15, 2008 |
| 7319270 |
Multi-layer electrode and method of forming the same |
Jan. 15, 2008 |
| 7317252 |
Ohmic contact configuration |
Jan. 8, 2008 |
| 7315083 |
Circuit device and manufacturing method thereof |
Jan. 1, 2008 |
| 7312486 |
Stripe board dummy metal for reducing coupling capacitance |
Dec. 25, 2007 |
| 7307342 |
Interconnection structure of integrated circuit chip |
Dec. 11, 2007 |
| 7304388 |
Method and apparatus for an improved air gap interconnect structure |
Dec. 4, 2007 |
| 7304349 |
Power semiconductor component with increased robustness |
Dec. 4, 2007 |
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