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Class Information
Number: 257/748
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > With thermal expansion matching of contact or lead material to semiconductor active device > Plural layers of specified contact or lead material
Description: Subject matter wherein the thermal expansion matching lead material is layered.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456437 |
LED package and method for producing the same |
Nov. 25, 2008 |
| 7432596 |
Apparatus and method for bonding silicon wafer to conductive substrate |
Oct. 7, 2008 |
| 7423332 |
Vertical laminated electrical switch circuit |
Sep. 9, 2008 |
| 7400041 |
Compliant multi-composition interconnects |
Jul. 15, 2008 |
| 7400040 |
Thermal interface apparatus, systems, and methods |
Jul. 15, 2008 |
| 7399996 |
LED package and method for producing the same |
Jul. 15, 2008 |
| 7391116 |
Fretting and whisker resistant coating system and method |
Jun. 24, 2008 |
| 7382050 |
Semiconductor device and method for producing the same |
Jun. 3, 2008 |
| 7378745 |
Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns |
May. 27, 2008 |
| 7358618 |
Semiconductor device and manufacturing method thereof |
Apr. 15, 2008 |
| 7321166 |
Wiring board having connecting wiring between electrode plane and connecting pad |
Jan. 22, 2008 |
| 7320932 |
Semiconductor device and manufacturing method thereof |
Jan. 22, 2008 |
| 7304377 |
Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device |
Dec. 4, 2007 |
| 7265448 |
Interconnect structure for power transistors |
Sep. 4, 2007 |
| 7235881 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
Jun. 26, 2007 |
| 7233069 |
Interconnection substrate and fabrication method thereof |
Jun. 19, 2007 |
| 7233074 |
Semiconductor device with improved contacts |
Jun. 19, 2007 |
| 7224060 |
Integrated circuit with protective moat |
May. 29, 2007 |
| 7205232 |
Method of forming a self-aligned contact structure using a sacrificial mask layer |
Apr. 17, 2007 |
| 7187078 |
Bump structure |
Mar. 6, 2007 |
| 7183656 |
Bilayer aluminum last metal for interconnects and wirebond pads |
Feb. 27, 2007 |
| 7164196 |
Semiconductor device |
Jan. 16, 2007 |
| 7154176 |
Conductive bumps with non-conductive juxtaposed sidewalls |
Dec. 26, 2006 |
| 7148569 |
Pad surface finish for high routing density substrate of BGA packages |
Dec. 12, 2006 |
| 7109107 |
Method for creating flip-chip conductive-polymer bumps using photolithography and polishing |
Sep. 19, 2006 |
| 7071557 |
Metallization structures for semiconductor device interconnects, methods for making same, and semiconductor devices including same |
Jul. 4, 2006 |
| 7053462 |
Planarization of metal container structures |
May. 30, 2006 |
| 7034398 |
Semiconductor device having contact plug and buried conductive film therein |
Apr. 25, 2006 |
| 7030004 |
Method for forming bond pad openings |
Apr. 18, 2006 |
| 7023067 |
Bond pad design |
Apr. 4, 2006 |
| 7012019 |
Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same |
Mar. 14, 2006 |
| 7009299 |
Kinetically controlled solder |
Mar. 7, 2006 |
| 7002201 |
Semiconductor device and manufacturing method thereof |
Feb. 21, 2006 |
| 6969915 |
Semiconductor device, manufacturing method and apparatus for the same |
Nov. 29, 2005 |
| 6955951 |
Liquid crystal display device having an auxiliary wiring |
Oct. 18, 2005 |
| 6943376 |
Electrode for p-type SiC |
Sep. 13, 2005 |
| 6927490 |
Buried solder bumps for AC-coupled microelectronic interconnects |
Aug. 9, 2005 |
| 6894391 |
Electrode structure on P-type III group nitride semiconductor layer and formation method thereof |
May. 17, 2005 |
| 6888243 |
Semiconductor device |
May. 3, 2005 |
| 6889155 |
High frequency module board device |
May. 3, 2005 |
| 6882010 |
High performance three-dimensional TFT-based CMOS inverters, and computer systems utilizing such novel CMOS inverters |
Apr. 19, 2005 |
| 6879049 |
Damascene interconnection and semiconductor device |
Apr. 12, 2005 |
| 6879041 |
Semiconductor device with joint structure having lead-free solder layer over nickel layer |
Apr. 12, 2005 |
| 6873048 |
System and method for integrating multiple metal gates for CMOS applications |
Mar. 29, 2005 |
| 6873047 |
Semiconductor device and manufacturing method thereof |
Mar. 29, 2005 |
| 6861752 |
Semiconductor device having wiring line with hole, and manufacturing method thereof |
Mar. 1, 2005 |
| 6847116 |
Chip-type semiconductor light-emitting device |
Jan. 25, 2005 |
| 6844576 |
Master slice type semiconductor integrated circuit and method for designing the same |
Jan. 18, 2005 |
| 6828681 |
Semiconductor devices having contact pads and methods of manufacturing the same |
Dec. 7, 2004 |
| 6803613 |
Semiconductor device and manufacturing method of the same |
Oct. 12, 2004 |
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