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Class Information
Number: 257/748
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified material other than unalloyed aluminum > With thermal expansion matching of contact or lead material to semiconductor active device > Plural layers of specified contact or lead material
Description: Subject matter wherein the thermal expansion matching lead material is layered.

Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8692127 Terminal structure, printed wiring board, module substrate, and electronic device Apr. 8, 2014
8674507 Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer Mar. 18, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8604624 Flip chip interconnection system having solder position control mechanism Dec. 10, 2013
8581411 Semiconductor device Nov. 12, 2013
8575751 Conductive bump, method for producing the same, and electronic component mounted structure Nov. 5, 2013
8564129 Low resistivity contact Oct. 22, 2013
8482125 Conductive sidewall for microbumps Jul. 9, 2013
8432045 Conductive pads defined by embedded traces Apr. 30, 2013
8431817 Multi-junction solar cell having sidewall bi-layer electrical interconnect Apr. 30, 2013
8421227 Semiconductor chip structure Apr. 16, 2013
8421246 Joint structure and electronic component Apr. 16, 2013
8373275 Fine pitch solder bump structure with built-in stress buffer Feb. 12, 2013
8368211 Solderable top metalization and passivation for source mounted package Feb. 5, 2013
8319246 Semiconductor device and method for manufacturing same Nov. 27, 2012
8319341 Semiconductor device with gate structure Nov. 27, 2012
8283756 Electronic component with buffer layer Oct. 9, 2012
8159077 Pad in semicondcutor device and fabricating method thereof Apr. 17, 2012
8154131 Profiled contact Apr. 10, 2012
8138611 Semiconductor device having shifted stacked chips Mar. 20, 2012
8093688 Device comprising an ohmic via contact, and method of fabricating thereof Jan. 10, 2012
8089151 Conductive particles for anisotropic conductive interconnection Jan. 3, 2012
8039973 Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module Oct. 18, 2011
8030765 Configuration terminal for integrated devices and method for configuring an integrated device Oct. 4, 2011
7960830 Electronic assembly having a multilayer adhesive structure Jun. 14, 2011
7956365 Alternating current light emitting device with plural conductors of electrodes for coupling to adjacent light emitting unit Jun. 7, 2011
7939940 Multilayer chip scale package May. 10, 2011
7893544 Semiconductor device having improved contacts Feb. 22, 2011
7880302 Semiconductor device having metal wirings of laminated structure Feb. 1, 2011
7859109 Gallium nitride-based III-V group compound semiconductor device and method of manufacturing the same Dec. 28, 2010
7839003 Semiconductor device including a coupling conductor having a concave and convex Nov. 23, 2010
7772697 Semiconductor device and method for producing the same Aug. 10, 2010
7745941 Semiconductor device having shifted stacked chips Jun. 29, 2010
7723839 Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device May. 25, 2010
7671470 Enhanced mechanical strength via contacts Mar. 2, 2010
7633165 Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV Dec. 15, 2009
7625816 Method of fabricating passivation Dec. 1, 2009
7598609 Structure of polymer-matrix conductive film and method for fabricating the same Oct. 6, 2009
7573132 Wiring structure of a semiconductor device and method of forming the same Aug. 11, 2009
7557445 Multilayer substrate and the manufacturing method thereof Jul. 7, 2009
7521801 Semiconductor device Apr. 21, 2009
7501705 Configuration terminal for integrated devices and method for configuring an integrated device Mar. 10, 2009
7501694 Semiconductor device using multi-layer unleaded metal plating, and method of manufacturing the same Mar. 10, 2009
7482637 Led package and method for producing the same Jan. 27, 2009
7456437 LED package and method for producing the same Nov. 25, 2008
7432596 Apparatus and method for bonding silicon wafer to conductive substrate Oct. 7, 2008
7423332 Vertical laminated electrical switch circuit Sep. 9, 2008
7399996 LED package and method for producing the same Jul. 15, 2008
7400041 Compliant multi-composition interconnects Jul. 15, 2008
7400040 Thermal interface apparatus, systems, and methods Jul. 15, 2008

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